Reported to contain a SemiLEDs die on flexible copper substrate and the subject of much controversy and feuding between Nichia and Seoul Semiconductor, this device has indeed a very interesting die. ...
The low-profile package is very straightforward in concept and design, and uses materials which are typical in the high-power LED industry. As the LED die substrate is electrically insulating, there is no back-side contact to the die. Three bond wires for ...
The device is a surface mount gull wing device containing a GaN LED chip. Considerable attention has been paid to current distribution, heat dissipation, and to reflectivity in this device. ...
MuAnalysis has used a large variety of analytical techniques including IR-laser scanning microscopy, electron microscopy with photochemical delineation, EDX and FTIR spectroscopy to probe the insides of this LED lamp and reveal its secrets. Back-side appe ...
These devices may look the same and be interchangeable in your product but inside they have widely different technologies. MuAnalysis has used a large variety of analytical techniques including Optical Beam Induced Current (OBIC), electron microscopy as w ...
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