Flexible Circuits: Materials and Applications

Table of Contents

• INTRODUCTION
  • GOALS AND OBJECTIVES
  • REASONS FOR DOING THE STUDY
  • CONTRIBUTION OF THE STUDY AND FOR WHOM
  • SCOPE AND FORMAT
  • METHODOLOGY
  • INFORMATION SOURCES
  • RELATED BCC PUBLICATIONS
    • REPORTS
    • MONTHLY NEWSLETTERS
  • BCC ONLINE SERVICES
  • DISCLAIMER
• SUMMARY
  • Summary Table: GLOBAL FORECAST OF THE FLEX CIRCUIT MARKET, THROUGH 2010 ($ BILLIONS)
  • Summary Figure: GLOBAL FLEX CIRCUIT MARKET, 2002-2010 ($ BILLIONS)
• OVERVIEW
  • INDUSTRY DEFINITION
  • TYPES OF FLEX CIRCUITS
    • FLEX CIRCUIT CLASSIFICATION BASED ON LINE DENSITY
  • Table 1 TECHNOLOGY TRENDS FOR HIGHER DENSITY INTERCONNECTS
    • FLEX CIRCUIT CLASSIFICATION BASED ON LAYER COUNT
      • Single-sided Flex Circuits
  • Figure 1 A SINGLE-SIDED FLEX CIRCUIT
    • Benefits of Single-Sided Flex Circuits
    • Double-sided Flex Circuits
      • Benefits of Double-Sided Flex Circuits
    • Multilayer Flex Circuits
    • EVOLUTION OF FLEX CIRCUITS
  • Figure 2 WORLDWIDE FLEX CIRCUIT INDUSTRY MARKET VALUE, 1996-2010 ($ MILLIONS)
    • DRIVING FORCES IN THE FLEX CIRCUIT INDUSTRY
    • FORESEEABLE FUTURE DEVELOPMENTS
• TECHNOLOGY OVERVIEW
  • FUNCTIONS OF FLEX CIRCUITS
  • Table 2 ESSENTIAL FUNCTIONS OF FLEX CIRCUITS
    • COMPARISON BETWEEN RIGID AND FLEX CIRCUIT BOARDS
  • Table 3 COMPARISON BETWEEN RIGID AND FLEX CIRCUIT BOARDS
    • ADVANTAGES OF FLEX CIRCUITS
  • Table 4 ADVANTAGES OF FLEX CIRCUITS OVER OTHER ELECTRONIC INTERCONNECTION TECHNOLOGIES
    • CHALLENGES FACING FLEX CIRCUIT TECHNOLOGY
      • TRENDS IN PRINTED CIRCUIT BOARD DESIGN
  • Table 5 EFFECT OF DECREASING COMPONENT SIZE ON PRINTED CIRCUIT BOARDS
  • Table 6 CHALLENGES FACING THE PRINTED CIRCUIT BOARD INDUSTRY
    • TECHNOLOGICAL DEVELOPMENTS IN THE CHIP INDUSTRY
  • Table 7 COMPARISON OF TECHNOLOGY DRIVERS IN THE CHIP AND THE PRINTED CIRCUIT BOARD INDUSTRIES
    • OTHER CHALLENGES FACED BY FLEX CIRCUITS
    • MANUFACTURING OF FLEX CIRCUITS
      • BASE MATERIALS
  • Table 8 REQUIRED PROPERTIES FOR FLEX CIRCUIT BASE MATERIAL
    • Polyimide
  • Table 9 PROPERTIES OF POLYIMIDE
    • Polyester
  • Table 10 PROPERTIES OF POLYESTER
    • Others
      • Liquid Crystalline Polymer
      • Aramid
      • Epoxy
      • Polyethylene Terephthalate
    • ADHESIVES
  • Table 11 VARIOUS COMBINATIONS OF BASE MATERIALS AND ADHESIVES IN FLEX CIRCUITS
  • Table 12 ADHESIVE MATERIALS AND PROPERTIES
    • Adhesives (Continued)
    • CONDUCTOR MATERIALS
  • Table 13 ADVANTAGES OF COPPER OVER OTHER CONDUCTOR MATERIALS
    • PROTECTIVE COATINGS
      • Cover-coats
      • Cover-layers
      • Cover-films
      • Comparison of Cover-coats, Cover-layers, and Cover-films
  • Table 14 VARIOUS PROTECTIVE COATINGS AND THEIR PROPERTIES
  • Figure 3 FLEX CIRCUIT MANUFACTURING PROCESS FLOW CHART
• MARKET BY PRODUCTS
  • COMPARISON BETWEEN POLYESTER AND POLYIMIDE SUBSTRATES
  • Table 15 COMPARISON BETWEEN POLYESTER AND POLYIMIDE SUBSTRATES USED IN FLEX CIRCUITS
    • RAW MATERIAL COSTS
    • ADHESIVES
    • HEAT CAPABILITIES
    • SOLDERABILITY
  • Table 16 COMPARISON BETWEEN PRESS FIT AND SOLDERING
    • LINE WIDTH
    • MARKET BY DENSITY
  • Table 17 GLOBAL FORECAST FOR FLEX CIRCUIT MARKET BY DENSITY, THROUGH 2010 ($ MILLIONS)
    • POLYIMIDE FLEX CIRCUIT MARKET BY DENSITY
  • Table 18 GLOBAL FORECAST FOR POLYIMIDE FLEX CIRCUIT MARKET BY DENSITY THROUGH 2010 ($ MILLIONS)
    • POLYESTER FLEX CIRCUIT MARKET BY DENSITY
  • Table 19 GLOBAL FORECAST FOR POLYESTER FLEX CIRCUIT MARKET BY DENSITY, THROUGH 2010 ($ MILLIONS)
    • OTHER BASE MATERIAL FLEX CIRCUIT MARKET BY DENSITY
  • Table 20 GLOBAL FORECAST FOR OTHER BASE MATERIAL FLEX CIRCUIT MARKET BY DENSITY, THROUGH 2010 ($ MILLIONS)
    • MARKET BY LAYER COUNT
  • Table 21 GLOBAL FORECAST OF FLEX CIRCUIT MARKET BY LAYER COUNT, THROUGH 2010 ($ MILLIONS)
    • MARKET BY BASE MATERIAL
  • Table 22 GLOBAL FORECAST OF FLEX CIRCUIT MARKET BY BASE MATERIAL THROUGH 2010 ($ MILLIONS)
    • POLYIMIDE FLEX CIRCUIT
      • Material Description
        • Adhesive Polyimide Flex Circuits
        • Adhesiveless Polyimide Flex Circuits
          • Advantages of Adhesiveless Technology
          • Mechanical Advantages
          • Electrical Advantages
  • Table 23 COMPARISON BETWEEN ADHESIVE AND ADHESIVELESS POLYIMIDE CIRCUITS
    • Growth Drivers
    • Inhibitors
    • Polyimide Flex Circuit Market by Layer Type
  • Table 24 GLOBAL FORECAST OF POLYIMIDE FLEX CIRCUIT MARKET BY LAYER TYPES, THROUGH 2010 ($ MILLIONS)
    • Polyimide Single-Sided Flex Circuit Market by Density
  • Table 25 GLOBAL FORECAST OF POLYIMIDE SINGLE-SIDED FLEX CIRCUIT MARKET BY DENSITY, THROUGH 2010 ($ MILLIONS)
    • Polyimide Double-Sided Flex Circuits Market by Density
  • Table 26 GLOBAL FORECAST OF POLYIMIDE DOUBLE-SIDED FLEX CIRCUIT MARKET BY DENSITY THROUGH 2010 ($ MILLIONS)
    • Polyimide Multilayer Flex Circuit Market by Density
  • Table 27 GLOBAL FORECAST OF POLYIMIDE MULTILAYER FLEX CIRCUIT MARKET BY DENSITY, THROUGH 2010 ($ MILLIONS)
    • POLYESTER FLEX CIRCUITS
      • Material Description
      • Growth Drivers
      • Inhibitors
      • Polyester Flex Circuit Market by Layer Type
  • Table 28 GLOBAL FORECAST OF POLYESTER FLEX CIRCUIT MARKET BY LAYER TYPES, THROUGH 2010 ($ MILLIONS)
    • Polyester-based Single-Sided Flex Circuits Market by Density
  • Table 29 GLOBAL FORECAST OF POLYESTER SINGLE-SIDED FLEX CIRCUIT MARKET BY DENSITY, THROUGH 2010 ($ MILLIONS)
    • Polyester Double-sided Flex Circuit Market by Density
  • Table 30 GLOBAL FORECAST OF POLYESTER DOUBLE-SIDED FLEX CIRCUIT MARKET BY DENSITY, THROUGH 2010 ($ MILLIONS)
    • OTHER BASE MATERIAL
      • Other Base Materials Flex Circuit Market by Layer Type
  • Table 31 GLOBAL FORECAST OF OTHER BASE MATERIAL FLEX CIRCUIT MARKET BY LAYER TYPES, THROUGH 2010 ($ MILLIONS)
    • Other Base Material-based Single-Sided Flex Circuit Market by Density
  • Table 32 GLOBAL FORECAST OF OTHER BASE MATERIAL SINGLE-SIDED FLEX CIRCUIT MARKET BY DENSITY, THROUGH 2010 ($ MILLIONS)
    • Other Base Material-based Double-Sided Flex Circuit Market by Density
  • Table 33 GLOBAL FORECAST OF OTHER BASE MATERIAL DOUBLE-SIDED FLEX CIRCUIT MARKET BY DENSITY THROUGH 2010 ($ MILLIONS)
    • Other Base Material-based Multilayer Flex Circuits Market by Density
  • Table 34 GLOBAL FORECAST OF OTHER BASE MATERIAL MULTILAYER FLEX CIRCUIT MARKET BY DENSITY, THROUGH 2010 ($ MILLIONS)
    • Other Base Material-based�EContinued)
• MARKET BY APPLICATIONS
  • WORLDWIDE MARKET SIZE
  • Figure 4 SHARE OF GLOBAL FLEX CIRCUIT MARKET BY APPLICATION AREA, 2002-2010 (%)
  • Table 35 GLOBAL FORECAST OF FLEX CIRCUIT MARKET BY APPLICATION, THROUGH 2010 ($ MILLIONS)
    • TELECOMMUNICATIONS
      • CELLULAR PHONES
        • Application Description
  • Table 36 USE OF FLEX CIRCUITS IN CELL PHONES
    • Voice Data-Centric Phones
    • Feature Phones
    • Smart Phones
    • Growth Drivers
    • Future Trends
    • Flex Circuit Market by Telecom Applications
  • Table 37 GLOBAL FORECAST OF FLEX CIRCUIT MARKET IN TELECOMMUNICATIONS, THROUGH 2010 ($ MILLIONS)
    • HANDHELD ELECTRONIC DEVICES
      • FLEX CIRCUIT MARKET BY HANDHELD ELECTRONIC DEVICES
  • Table 38 GLOBAL FORECAST OF FLEX CIRCUIT MARKET IN HANDHELD ELECTRONICS DEVICES, THROUGH 2010 ($ MILLIONS)
    • Digital Still Cameras
      • Application Description
  • Table 39 FLEX CIRCUITS IN DIGITAL CAMERAS
    • Flex Circuit Market in Digital Still Cameras
  • Table 40 GLOBAL FORECAST OF FLEX CIRCUIT MARKET IN DIGITAL STILL CAMERAS, THROUGH 2010 ($ MILLIONS)
    • Growth Drivers
    • Inhibitors
    • Future Trends
    • Camcorders
      • Application Description
      • Flex Circuit Market in Digital Camcorders
  • Table 41 GLOBAL FORECAST OF FLEX CIRCUIT MARKET IN DIGITAL CAMCORDERS, THROUGH 2010 ($ MILLION)
    • Growth Drivers
    • Inhibitors
    • Future Trends
    • Personal Digital Assistants
      • Application Description
      • Flex Circuits Market in PDAs
  • Table 42 GLOBAL FORECAST OF FLEX CIRCUITS MARKET IN PERSONAL DIGITAL ASSISTANTS, THROUGH 2010 ($ MILLION)
    • Growth Drivers
    • Inhibitors
    • Future Trends
    • COMPUTERS AND PERIPHERALS
      • APPLICATION DESCRIPTION
  • Table 43 FLEX CIRCUITS IN PC (HARD DISK DRIVE)
    • FLEX CIRCUIT MARKET IN COMPUTERS AND PERIPHERALS APPLICATION
  • Table 44 GLOBAL FORECAST OF FLEX CIRCUIT MARKET IN COMPUTERS AND PERIPHERALS, THROUGH 2010 ($ MILLIONS)
    • GROWTH DRIVERS
    • INHIBITORS
    • FUTURE TRENDS
    • OTHER APPLICATIONS
      • FLEX CIRCUIT MARKET BY OTHER APPLICATIONS
  • Table 45 GLOBAL FORECAST OF FLEX CIRCUIT MARKET IN OTHER APPLICATIONS, THROUGH 2010 ($ MILLIONS)
    • Automotive
    • Defense/Aerospace
    • Others
• PATENT OVERVIEW
  • PATENTING TRENDS-BY TIME PERIOD
    • SUBSTRATE TYPES
  • Table 46 FLEX CIRCUIT PATENTS BY SUBSTRATE, 2003 AND 2004 (NO. OF PATENTS)
    • Polyimide
  • Figure 5 POLYIMIDE FLEX CIRCUIT PATENTS, 2003 AND 2004 (NO. OF PATENTS)
    • Polyester
  • Figure 6 POLYESTER FLEX CIRCUIT PATENTS, 2003 AND 2004 (NO. OF PATENTS)
    • Epoxy
  • Figure 7 EPOXY FLEX CIRCUIT PATENTS, 2003 AND 2004 (NO. OF PATENTS)
    • Liquid Crystal Polymer
  • Figure 8 LCP FLEX CIRCUIT PATENTS, 2003 AND 2004 (NO. OF PATENTS)
    • Polyethylene Terephthalate
  • Figure 9 PET FLEX CIRCUIT PATENTS, 2003 AND 2004 (NO. OF PATENTS)
    • Aramid
  • Figure 10 ARAMID FLEX CIRCUIT PATENTS, 2003 AND 2004 (NO OF PATENTS)
    • COPPER FOIL TYPE PATENTS
  • Table 47 FLEX CIRCUIT PATENTS BY COPPER FOIL LAMINATE, 2003 AND 2004 (NO. OF PATENTS)
    • Annealed Copper Foil
  • Figure 11 COPPER FOIL-ANNEALED FLEX CIRCUIT PATENTS, 2003 AND 2004 (NO. OF PATENTS)
    • Electrodeposited Copper Foil
  • Figure 12 COPPER FOIL-ELECTRODEPOSITED FLEX CIRCUIT PATENTS, 2003 AND 2004 (NO. OF PATENTS)
    • Rolled Copper Foil
  • Figure 13 COPPER FOIL - ROLLED FLEX CIRCUIT PATENTS, 2003 AND 2004 (NO OF PATENTS)
    • PATENTING TRENDS - BY MAJOR FILERS
      • SUBSTRATE TYPES
        • Polyimide
  • Figure 14 COMPARISON OF MAJOR FILERS OF POLYIMIDE FLEX CIRCUIT PATENTS, 2003-2004 (NO. OF PATENTS)
    • Polyester
  • Figure 15 COMPARISON OF MAJOR FILERS OF POLYESTER FLEX CIRCUIT PATENTS, 2003-2004 (NO. OF PATENTS)
    • Epoxy
  • Figure 16 COMPARISON OF MAJOR FILERS OF EPOXY FLEX CIRCUIT PATENTS, 2003-2004 (NO. OF PATENTS)
    • Liquid Crystal Polymer (LCP)
  • Figure 17 COMPARISON OF MAJOR FILERS OF LCP FLEX CIRCUIT PATENTS, 2003-2004 (NO. OF PATENTS)
    • Polyethylene Terephthalate
  • Figure 18 COMPARISON OF MAJOR FILERS OF PET FLEX CIRCUIT PATENTS, 2003-2004 (NO OF PATENTS)
    • Aramid
  • Figure 19 COMPARISON OF MAJOR FILERS OF ARAMID FLEX CIRCUIT PATENTS, 2003-2004 (NO. OF PATENTS)
    • COPPER FOIL TYPES-MAJOR PATENT FILERS
      • Annealed Copper Foil
  • Figure 20 COMPARISON OF MAJOR FILERS OF COPPER FOIL-ANNEALED FLEX CIRCUIT PATENTS, 2003-2004 (NO. OF PATENTS)
    • Electrodeposited Copper Foil
  • Figure 21 MAJOR FILER OF ELECTRODEPOSITED COPPER FOIL FLEX CIRCUIT PATENTS, 2003-2004 (NO. OF PATENTS)
    • Rolled Copper Foil
  • Figure 22 COMPARISON OF MAJOR FILERS OF ROLLED COPPER FOIL FLEX CIRCUIT PATENTS, 2003-2004 (NO. OF PATENTS)
    • PATENTING TRENDS BY REGION
      • SUBSTRATE TYPES
  • Table 48 FLEX CIRCUIT PATENTS BY REGION AND BY SUBSTRATE, 2003-2004
  • Figure 23 FLEX CIRCUIT PATENTS BY REGION (FOR SUBSTRATES), 2003-2004 (%)
  • Figure 23 (CONTINUED)
    • Polyimide
  • Figure 24 POLYIMIDE PATENTS BY GEOGRAPHY, 2003-2004 (%)
  • Figure 24 (CONTINUED)
    • Polyester
  • Figure 25 POLYESTER PATENTS BY GEOGRAPHY, 2003-2004 (%)
    • Epoxy
  • Figure 26 EPOXY PATENTS BY GEOGRAPHY, 2003-2004 (%)
    • Liquid Crystal Polymer (LCP)
  • Figure 27 LCP PATENTS BY GEOGRAPHY, 2003-2004 (%)
    • Polyethylene Terephthalate (PET)
  • Figure 28 PET PATENTS BY GEOGRAPHY, 2003-2004 (%)
    • Aramid
  • Figure 29 ARAMID PATENTS BY GEOGRAPHY, 2003-2004 (%)
    • COPPER FOIL TYPES
  • Table 49 FLEX CIRCUIT PATENTS BY COPPER FOIL THROUGH 2004 (NO. OF PATENTS)
  • Figure 30 FLEX CIRCUIT PATENTS BY GEOGRAPHY (FOR COPPER FOIL LAMINATES), 2003-2004 (%)
    • Copper Foil-Annealed
  • Figure 31 COPPER FOIL-ANNEALED PATENTS BY GEOGRAPHY, 2003-2004 (%)
    • Electrodeposited Copper Foil
  • Figure 32 COPPER FOIL-ELECTRODEPOSITED PATENTS BY GEOGRAPHY, 2003-2004 (%)
    • Rolled Copper Foil
  • Figure 33 COPPER FOIL - ROLLED FLEX CIRCUIT PATENTS BY GEOGRAPHY, 2003-2004 (%)
    • ABSTRACTS OF RELEVANT PATENTS
      • Polyimide
        • Polyimide Film, Production Method Therefore and Use Thereof
      • Polyester
        • Component Mounting Flexible Circuit Board
      • Epoxy
        • Resin Composition, Prepreg and Laminated Board
      • Liquid Crystal Polymer (LCP)
        • Liquid Crystal Polymers for Flexible Circuits
      • Polyethylene Terephthalate (PET)
        • Low reflection, high transmission, touch-panel membrane
      • Aramid
        • Composite Film Made From Low Dielectric Constant Resin and Para-Oriented Aromatic Polyamide
• INDUSTRY STRUCTURE AND COMPETITIVE ANALYSIS
  • INDUSTRY OVERVIEW
    • DRIVERS IN THE FLEX CIRCUIT INDUSTRY
    • INDUSTRY CHALLENGES
    • FLEX CIRCUIT VALUE CHAIN
  • Figure 34 FLEX CIRCUIT INDUSTRY VALUE CHAIN
  • Table 50 KEY PLAYERS IN THE FLEX CIRCUIT INDUSTRY VALUE CHAIN
    • Base Material Providers
  • Table 51 POLYIMIDE FILM MANUFACTURERS
  • Table 52 POLYESTER FILM MANUFACTURERS
    • Copper Foil Providers
  • Table 53 TYPES OF COPPER FOIL AND ITS SUPPLIERS
    • Copper Clad Laminate Suppliers
    • Flex Circuit Manufacturers
    • Equipment Manufacturers
  • Table 54 KEY EQUIPMENT MANUFACTURERS IN DIFFERENT APPLICATION AREAS FOR FLEX CIRCUIT BOARDS
    • STRATEGIES FOR STAYING COMPETITIVE
      • REDUCTION IN COSTS
    • ECONOMIC SCENARIO
      • PRICING TRENDS IN THE INDUSTRY
  • Table 55 FACTORS AFFECTING PRICING OF PRODUCTS IN THE FLEXIBLE CIRCUIT BOARD INDUSTRY
  • Table 55 (CONTINUED)
    • INDUSTRY COMPETITIVENESS ANALYSIS-PORTERS MODEL
      • FLEX CIRCUIT INDUSTRY ANALYSIS
  • Figure 35 FLEX CIRCUIT INDUSTRY STRUCTURE AS ANALYZED BY USING PORTERS FIVE FORCE MODEL
    • Threat from New Entrants
    • Threat of Substitute Products
    • Bargaining Power of Suppliers
    • Bargaining Power of Buyers
    • Industry Rivalry
    • MERGERS AND ACQUISITIONS
      • Mergers and Acquisitions (Continued)
      • Mergers and Acquisitions (Continued)
• MARKETS BY REGION
  • WORLDWIDE MARKET
  • Table 56 GLOBAL FORECAST OFFLEX CIRCUIT MARKET BY REGION, THROUGH 2010 ($ MILLIONS)
    • NORTH AMERICA
  • Table 57 FORECAST OF THE NORTH AMERICAN FLEX CIRCUIT MARKET, THROUGH 2010 ($ MILLIONS)
  • Table 58 FORECAST OF THE NORTH AMERICAN FLEX CIRCUITS MARKET BY LAYER TYPE, THROUGH 2010 ($ MILLIONS)
    • EUROPE
  • Table 59 FORECAST OF THE EUROPEAN FLEX CIRCUIT MARKET BY COUNTRY, THROUGH 2010 ($ MILLIONS)
  • Table 60 FORECAST OF THE EUROPEAN FLEX CIRCUITS MARKET BY LAYER TYPE, THROUGH 2010 ($ MILLIONS)
    • Germany
  • Table 61 FORECAST OF THE GERMAN FLEX CIRCUITS MARKET BY LAYER COUNT, THROUGH 2010 ($ MILLIONS)
  • Table 62 FORECAST FOR THE ROE FLEX CIRCUITS MARKET BY LAYER COUNT, THROUGH 2010 ($ MILLIONS)
    • ASIA
  • Table 63 FORECAST OF THE ASIAN FLEX CIRCUITS MARKET BY COUNTRY, THROUGH 2010 ($ MILLIONS)
  • Table 64 FORECAST OF THE ASIAN FLEX CIRCUIT MARKET BY LAYER TYPE, THROUGH 2010 ($ MILLIONS)
    • Japan
  • Table 65 FORECAST OF THE JAPANESE FLEX CIRCUIT MARKET BY LAYER TYPE, THROUGH 2010 ($ MILLIONS)
    • China/Hong Kong
  • Table 66 FORECAST OF THE CHINESE FLEX CIRCUIT MARKET BY LAYER TYPE THROUGH 2010 ($ MILLIONS)
    • Taiwan
  • Table 67 FORECAST OF THE TAIWAN FLEX CIRCUIT MARKET BY LAYER TYPE THROUGH 2010 ($ MILLIONS)
    • South Korea
  • Table 68 FORECAST OF THE SOUTH KOREA FLEX CIRCUIT MARKET BY LAYER TYPE THROUGH 2010 ($ MILLIONS)
    • Rest of Asia
  • Table 69 FORECAST FOR THE ROA FLEX CIRCUIT MARKET BY LAYER TYPE THROUGH 2010 ($ MILLIONS)
    • REST OF THE WORLD
  • Table 70 FORECAST FOR THE ROW FLEX CIRCUIT MARKET BY LAYER TYPE, THROUGH 2010 ($ MILLIONS)
• COMPANY PROFILES AND MARKET SHARES OF MAJOR PLAYERS
  • MARKET SHARE OF MAJOR PLAYERS
  • Table 71 SALES AND MARKET SHARES OF MAJOR PLAYERS IN FLEX CIRCUITS INDUSTRY, 2004 ($ MILLIONS)
    • COMPANY PROFILES OF MAJOR PLAYERS
      • NIPPON MEKTRON, LTD.
        • Key Executives
        • Company Description
      • FUJIKURA LTD.
        • Key Executives
        • Company Description
      • NITTO DENKO CORP.
        • Key Executives
        • Company Description
      • 3M CO.
        • Key Executives
        • Company Description
      • SONY CHEMICALS CORP.
        • Key Executives
        • Company Description
      • MULTI-FINELINE ELECTRONIX, INC. (M-FLEX)
        • Key Executives
        • Company Description
      • MFS TECHNOLOGY LTD.
        • Key Executives
        • Company Description
      • CASIO MICRONICS CO., LTD.
        • Key Executives
        • Company Description
      • INNOVEX, INC.
        • Key Executives
        • Company Description
      • PARLEX CORP.
        • Key Executives
        • Company Description
      • CAREER TECHNOLOGY (MFG.) CO., LTD.
        • Key Executives
        • Company Description
      • AMPHENOL CORP.
        • Key Executives
        • Company Description
      • MOLEX, INC.
        • Key Executives
        • Company Description
      • SANMINA-SCI CORP.
        • Key Executives
        • Company Description
      • COMMSCOPE, INC.
        • Key Executives
        • Company Description
      • TYCO INTERNATIONAL LTD.
        • Key Executives
        • Company Description
      • CORNING INC.
        • Key Executives
        • Company Description
      • PEMSTAR INC.
        • Key Executives
        • Company Description
      • FLEXTRONICS INTERNATIONAL LTD.
        • Key Executives
        • Company Description
      • SUMITOMO ELECTRIC INDUSTRIES, LTD.
        • Key Executives
        • Company Description
      • SI FLEX CO., LTD.
        • Key Executives
        • Company Description
      • YOUNGPOONG ELECTRONICS CO., LTD.
        • Key Executives
        • Company Description
      • NORTHPOINT TECHNOLOGIES, INC.
        • Company Description
      • DAISHO DENSHI CO., LTD.
        • Key Executives
        • Company Description
          • Company Description (Continued)
• LIST OF TABLES
• Summary Table:
• Table 1 TECHNOLOGY TRENDS FOR HIGHER DENSITY INTERCONNECTS
• Table 2 ESSENTIAL FUNCTIONS OF FLEX CIRCUITS
• Table 3 COMPARISON BETWEEN RIGID AND FLEX CIRCUIT BOARDS
• Table 4 ADVANTAGES OF FLEX CIRCUITS OVER OTHER ELECTRONIC INTERCONNECTION TECHNOLOGIES
• Table 5 EFFECT OF DECREASING COMPONENT SIZE ON PRINTED CIRCUIT BOARDS
• Table 6 CHALLENGES FACING THE PRINTED CIRCUIT BOARD INDUSTRY
• Table 7 COMPARISON OF TECHNOLOGY DRIVERS IN THE CHIP AND THE PRINTED CIRCUIT BOARD INDUSTRIES
• Table 8 REQUIRED PROPERTIES FOR FLEX CIRCUIT BASE MATERIAL
• Table 9 PROPERTIES OF POLYIMIDE
• Table 10 PROPERTIES OF POLYESTER
• Table 11 VARIOUS COMBINATIONS OF BASE MATERIALS AND ADHESIVES IN FLEX CIRCUITS
• Table 12 ADHESIVE MATERIALS AND PROPERTIES
• Table 13 ADVANTAGES OF COPPER OVER OTHER CONDUCTOR MATERIALS
• Table 14 VARIOUS PROTECTIVE COATINGS AND THEIR PROPERTIES
• Table 15 COMPARISON BETWEEN POLYESTER AND POLYIMIDE SUBSTRATES USED IN FLEX CIRCUITS
• Table 16 COMPARISON BETWEEN PRESS FIT AND SOLDERING
• Table 17 GLOBAL FORECAST FOR FLEX CIRCUIT MARKET BY DENSITY, THROUGH 2010 ($ MILLIONS)
• Table 18 GLOBAL FORECAST FOR POLYIMIDE FLEX CIRCUIT MARKET BY DENSITY THROUGH 2010 ($ MILLIONS)
• Table 19 GLOBAL FORECAST FOR POLYESTER FLEX CIRCUIT MARKET BY DENSITY, THROUGH 2010 ($ MILLIONS)
• Table 20 GLOBAL FORECAST FOR OTHER BASE MATERIAL FLEX CIRCUIT MARKET BY DENSITY, THROUGH 2010 ($ MILLIONS)
• Table 21 GLOBAL FORECAST OF FLEX CIRCUIT MARKET BY LAYER COUNT, THROUGH 2010 ($ MILLIONS)
• Table 22 GLOBAL FORECAST OF FLEX CIRCUIT MARKET BY BASE MATERIAL THROUGH 2010 ($ MILLIONS)
• Table 23 COMPARISON BETWEEN ADHESIVE AND ADHESIVELESS POLYIMIDE CIRCUITS
• Table 24 GLOBAL FORECAST OF POLYIMIDE FLEX CIRCUIT MARKET BY LAYER TYPES, THROUGH 2010 ($ MILLIONS)
• Table 25 GLOBAL FORECAST OF POLYIMIDE SINGLE-SIDED FLEX CIRCUIT MARKET BY DENSITY, THROUGH 2010 ($ MILLIONS)
• Table 26 GLOBAL FORECAST OF POLYIMIDE DOUBLE-SIDED FLEX CIRCUIT MARKET BY DENSITY THROUGH 2010 ($ MILLIONS)
• Table 27 GLOBAL FORECAST OF POLYIMIDE MULTILAYER FLEX CIRCUIT MARKET BY DENSITY, THROUGH 2010 ($ MILLIONS)
• Table 28 GLOBAL FORECAST OF POLYESTER FLEX CIRCUIT MARKET BY LAYER TYPES, THROUGH 2010 ($ MILLIONS)
• Table 29 GLOBAL FORECAST OF POLYESTER SINGLE-SIDED FLEX CIRCUIT MARKET BY DENSITY, THROUGH 2010 ($ MILLIONS)
• Table 30 GLOBAL FORECAST OF POLYESTER DOUBLE-SIDED FLEX CIRCUIT MARKET BY DENSITY, THROUGH 2010 ($ MILLIONS)
• Table 31 GLOBAL FORECAST OF OTHER BASE MATERIAL FLEX CIRCUIT MARKET BY LAYER TYPES, THROUGH 2010 ($ MILLIONS)
• Table 32 GLOBAL FORECAST OF OTHER BASE MATERIAL SINGLE-SIDED FLEX CIRCUIT MARKET BY DENSITY, THROUGH 2010 ($ MILLIONS)
• Table 33 GLOBAL FORECAST OF OTHER BASE MATERIAL DOUBLE-SIDED FLEX CIRCUIT MARKET BY DENSITY THROUGH 2010 ($ MILLIONS)
• Table 34 GLOBAL FORECAST OF OTHER BASE MATERIAL MULTILAYER FLEX CIRCUIT MARKET BY DENSITY, THROUGH 2010 ($ MILLIONS)
• Table 35 GLOBAL FORECAST OF FLEX CIRCUIT MARKET BY APPLICATION, THROUGH 2010 ($ MILLIONS)
• Table 36 USE OF FLEX CIRCUITS IN CELL PHONES
• Table 37 GLOBAL FORECAST OF FLEX CIRCUIT MARKET IN TELECOMMUNICATIONS, THROUGH 2010 ($ MILLIONS)
• Table 38 GLOBAL FORECAST OF FLEX CIRCUIT MARKET IN HANDHELD ELECTRONICS DEVICES, THROUGH 2010 ($ MILLIONS)
• Table 39 FLEX CIRCUITS IN DIGITAL CAMERAS
• Table 40 GLOBAL FORECAST OF FLEX CIRCUIT MARKET IN DIGITAL STILL CAMERAS, THROUGH 2010 ($ MILLIONS)
• Table 41 GLOBAL FORECAST OF FLEX CIRCUIT MARKET IN DIGITAL CAMCORDERS, THROUGH 2010 ($ MILLION)
• Table 42 GLOBAL FORECAST OF FLEX CIRCUITS MARKET IN PERSONAL DIGITAL ASSISTANTS, THROUGH 2010 ($ MILLION)
• Table 43 FLEX CIRCUITS IN PC (HARD DISK DRIVE)
• Table 44 GLOBAL FORECAST OF FLEX CIRCUIT MARKET IN COMPUTERS AND PERIPHERALS, THROUGH 2010 ($ MILLIONS)
• Table 45 GLOBAL FORECAST OF FLEX CIRCUIT MARKET IN OTHER APPLICATIONS, THROUGH 2010 ($ MILLIONS)
• Table 46 FLEX CIRCUIT PATENTS BY SUBSTRATE, 2003 AND 2004 (NO. OF PATENTS)
• Table 47 FLEX CIRCUIT PATENTS BY COPPER FOIL LAMINATE, 2003 AND 2004 (NO. OF PATENTS)
• Table 48 FLEX CIRCUIT PATENTS BY REGION AND BY SUBSTRATE, 2003-2004
• Table 49 FLEX CIRCUIT PATENTS BY COPPER FOIL THROUGH 2004 (NO. OF PATENTS)
• Table 50 KEY PLAYERS IN THE FLEX CIRCUIT INDUSTRY VALUE CHAIN
• Table 51 POLYIMIDE FILM MANUFACTURERS
• Table 52 POLYESTER FILM MANUFACTURERS
• Table 53 TYPES OF COPPER FOIL AND ITS SUPPLIERS
• Table 54 KEY EQUIPMENT MANUFACTURERS IN DIFFERENT APPLICATION AREAS FOR FLEX CIRCUIT BOARDS
• Table 55 FACTORS AFFECTING PRICING OF PRODUCTS IN THE FLEXIBLE CIRCUIT BOARD INDUSTRY
• Table 56 GLOBAL FORECAST OFFLEX CIRCUIT MARKET BY REGION, THROUGH 2010 ($ MILLIONS)
• Table 57 FORECAST OF THE NORTH AMERICAN FLEX CIRCUIT MARKET, THROUGH 2010 ($ MILLIONS)
• Table 58 FORECAST OF THE NORTH AMERICAN FLEX CIRCUITS MARKET BY LAYER TYPE, THROUGH 2010 ($ MILLIONS)
• Table 59 FORECAST OF THE EUROPEAN FLEX CIRCUIT MARKET BY COUNTRY, THROUGH 2010 ($ MILLIONS)
• Table 60 FORECAST OF THE EUROPEAN FLEX CIRCUITS MARKET BY LAYER TYPE, THROUGH 2010 ($ MILLIONS)
• Table 61 FORECAST OF THE GERMAN FLEX CIRCUITS MARKET BY LAYER COUNT, THROUGH 2010 ($ MILLIONS)
• Table 62 FORECAST FOR THE ROE FLEX CIRCUITS MARKET BY LAYER COUNT, THROUGH 2010 ($ MILLIONS)
• Table 63 FORECAST OF THE ASIAN FLEX CIRCUITS MARKET BY COUNTRY, THROUGH 2010 ($ MILLIONS)
• Table 64 FORECAST OF THE ASIAN FLEX CIRCUIT MARKET BY LAYER TYPE, THROUGH 2010 ($ MILLIONS)
• Table 65 FORECAST OF THE JAPANESE FLEX CIRCUIT MARKET BY LAYER TYPE, THROUGH 2010 ($ MILLIONS)
• Table 66 FORECAST OF THE CHINESE FLEX CIRCUIT MARKET BY LAYER TYPE THROUGH 2010 ($ MILLIONS)
• Table 67 FORECAST OF THE TAIWAN FLEX CIRCUIT MARKET BY LAYER TYPE THROUGH 2010 ($ MILLIONS)
• Table 68 FORECAST OF THE SOUTH KOREA FLEX CIRCUIT MARKET BY LAYER TYPE THROUGH 2010 ($ MILLIONS)
• Table 69 FORECAST FOR THE ROA FLEX CIRCUIT MARKET BY LAYER TYPE THROUGH 2010 ($ MILLIONS)
• Table 70 FORECAST FOR THE ROW FLEX CIRCUIT MARKET BY LAYER TYPE, THROUGH 2010 ($ MILLIONS)
• Table 71 SALES AND MARKET SHARES OF MAJOR PLAYERS IN FLEX CIRCUITS INDUSTRY, 2004 ($ MILLIONS)
• LIST OF FIGURES
• Summary Figure:
• Figure 1 A SINGLE-SIDED FLEX CIRCUIT
• Figure 2 WORLDWIDE FLEX CIRCUIT INDUSTRY MARKET VALUE, 1996-2010 ($ MILLIONS)
• Figure 3 FLEX CIRCUIT MANUFACTURING PROCESS FLOW CHART
• Figure 4 SHARE OF GLOBAL FLEX CIRCUIT MARKET BY APPLICATION AREA, 2002-2010 (%)
• Figure 5 POLYIMIDE FLEX CIRCUIT PATENTS, 2003 AND 2004 (NO. OF PATENTS)
• Figure 6 POLYESTER FLEX CIRCUIT PATENTS, 2003 AND 2004 (NO. OF PATENTS)
• Figure 7 EPOXY FLEX CIRCUIT PATENTS, 2003 AND 2004 (NO. OF PATENTS)
• Figure 8 LCP FLEX CIRCUIT PATENTS, 2003 AND 2004 (NO. OF PATENTS)
• Figure 9 PET FLEX CIRCUIT PATENTS, 2003 AND 2004 (NO. OF PATENTS)
• Figure 10 ARAMID FLEX CIRCUIT PATENTS, 2003 AND 2004 (NO OF PATENTS)
• Figure 11 COPPER FOIL-ANNEALED FLEX CIRCUIT PATENTS, 2003 AND 2004 (NO. OF PATENTS)
• Figure 12 COPPER FOIL-ELECTRODEPOSITED FLEX CIRCUIT PATENTS, 2003 AND 2004 (NO. OF PATENTS)
• Figure 13 COPPER FOIL - ROLLED FLEX CIRCUIT PATENTS, 2003 AND 2004 (NO OF PATENTS)
• Figure 14 COMPARISON OF MAJOR FILERS OF POLYIMIDE FLEX CIRCUIT PATENTS, 2003-2004 (NO. OF PATENTS)
• Figure 15 COMPARISON OF MAJOR FILERS OF POLYESTER FLEX CIRCUIT PATENTS, 2003-2004 (NO. OF PATENTS)
• Figure 16 COMPARISON OF MAJOR FILERS OF EPOXY FLEX CIRCUIT PATENTS, 2003-2004 (NO. OF PATENTS)
• Figure 17 COMPARISON OF MAJOR FILERS OF LCP FLEX CIRCUIT PATENTS, 2003-2004 (NO. OF PATENTS)
• Figure 18 COMPARISON OF MAJOR FILERS OF PET FLEX CIRCUIT PATENTS, 2003-2004 (NO OF PATENTS)
• Figure 19 COMPARISON OF MAJOR FILERS OF ARAMID FLEX CIRCUIT PATENTS, 2003-2004 (NO. OF PATENTS)
• Figure 20 COMPARISON OF MAJOR FILERS OF COPPER FOIL-ANNEALED FLEX CIRCUIT PATENTS, 2003-2004 (NO. OF PATENTS)
• Figure 21 MAJOR FILER OF ELECTRODEPOSITED COPPER FOIL FLEX CIRCUIT PATENTS, 2003-2004 (NO. OF PATENTS)
• Figure 22 COMPARISON OF MAJOR FILERS OF ROLLED COPPER FOIL FLEX CIRCUIT PATENTS, 2003-2004 (NO. OF PATENTS)
• Figure 23 FLEX CIRCUIT PATENTS BY REGION (FOR SUBSTRATES), 2003-2004 (%)
• Figure 24 POLYIMIDE PATENTS BY GEOGRAPHY, 2003-2004 (%)
• Figure 25 POLYESTER PATENTS BY GEOGRAPHY, 2003-2004 (%)
• Figure 26 EPOXY PATENTS BY GEOGRAPHY, 2003-2004 (%)
• Figure 27 LCP PATENTS BY GEOGRAPHY, 2003-2004 (%)
• Figure 28 PET PATENTS BY GEOGRAPHY, 2003-2004 (%)
• Figure 29 ARAMID PATENTS BY GEOGRAPHY, 2003-2004 (%)
• Figure 30 FLEX CIRCUIT PATENTS BY GEOGRAPHY (FOR COPPER FOIL LAMINATES), 2003-2004 (%)
• Figure 31 COPPER FOIL-ANNEALED PATENTS BY GEOGRAPHY, 2003-2004 (%)
• Figure 32 COPPER FOIL-ELECTRODEPOSITED PATENTS BY GEOGRAPHY, 2003-2004 (%)
• Figure 33 COPPER FOIL - ROLLED FLEX CIRCUIT PATENTS BY GEOGRAPHY, 2003-2004 (%)
• Figure 34 FLEX CIRCUIT INDUSTRY VALUE CHAIN
• Figure 35 FLEX CIRCUIT INDUSTRY STRUCTURE AS ANALYZED BY USING PORTERS FIVE FORCE MODEL