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Market Research Report

Plastics in Electronic Components

Published by BCC Research Contact us : +1-860-674-8796
Published 2006/09 Content info 200 pages 75 tables
Product code BC46196
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Description TOC

Table of Contents

  • INTRODUCTION
    • OBJECTIVES
    • SCOPE AND FORMAT
    • REASONS FOR DOING THE STUDY
    • METHODOLOGY
    • ACRONYMS
    • ABOUT THE AUTHOR
    • RELATED BCC PUBLICATIONS
    • BCC ONLINE SERVICES
    • DISCLAIMER
  • EXECUTIVE SUMMARY
    • Summary Table:
    • NORTH AMERICAN CONSUMPTION IN ELECTRONIC COMPONENTS BY TYPE OF RESIN, THROUGH 2011 (MILLION POUNDS)
    • Summary Figure:
    • NORTH AMERICAN CONSUMPTION IN ELECTRONIC COMPONENTS BY TYPE OF RESIN, 2005-2011 (MILLION POUNDS)
  • RESINS USED IN ELECTRONIC COMPONENTS
    • THERMOPLASTICS
      • NYLONS
        • Background
        • Properties
        • Major Types
          • Nylon 66
          • Nylon 6
          • Similarities and Difference between Properties of Nylon 6 and Nylon 66
    • Table 1 COMPARISON OF NYLON 6 AND NYLON 66 PROPERTIES
      • Other Nylons
        • Overview
        • Nylon 46
      • Reinforced Nylons
      • Processing
      • Electric/Electronic Applications
      • Producers and Capacities
  • Table 2 NYLON PRODUCERS AND CAPACITIES (MILLION POUNDS/YEAR)
    • Recent Developments
      • BASF Buys Honeywell' s Nylons
      • Kuraray High-Temperature Nylons
      • EMS-Grivory' s New Nylons
      • Bayer' s Reinforced Nylons
      • DuPont' s Reinforced Nylons
      • DSM Nylons for Connectors
      • Degussa Nylons for Connectors
    • Market Estimates and Forecasts
  • Table 3 NORTH AMERICAN NYLON MARKET FORECAST BY APPLICATION, THROUGH 2011 (MILLION POUNDS)
    • THERMOPLASTIC POLYESTERS
      • Background
      • Polybutylene Terephthalate (PBT)
        • Background
        • Properties
        • Applications
        • Producers
    • Table 4 GLOBAL PBT PRODUCERS AND CAPACITIES (MILLION POUNDS/YEAR)
      • New Developments and Products
      • BASF
      • Cyclics Corporation
      • Bayer Corporation
      • Ticona Corporation
      • Degussa
    • Polyethylene Terephthalate (PET)
      • Overview
      • Properties and Grades
      • Electronic/Electrical Applications
      • Producers and Capacities
    • Table 5 KEY NORTH AMERICAN PET PRODUCERS AND CAPACITIES (MILLION POUNDS/YEAR)
      • New Developments
      • PET and PBT Competitive Scenario
    • Polycyclohexyldimethylene Terephthalate (PCT)
      • Background
      • Properties
      • Producers and Applications
      • New Developments
        • PCT Usage in Automotive Connectors
        • New Resins for MIDs
      • Market Estimates and Forecasts
    • Table 6 NORTH AMERICAN PBT MARKET FORECAST BY APPLICATION, THROUGH 2011 (MILLION POUNDS)
    • Table 7 NORTH AMERICAN PET MARKET FORECAST BY APPLICATION, THROUGH 2011 (MILLION POUNDS)
      • POLYPHENYLENE SULFIDE (PPS)
        • Background
        • Properties
        • Advantages and Disadvantages
        • Applications
        • Producers
        • Other Technology Considerations
        • Market Estimates and Forecasts
    • Table 8 NORTH AMERICAN PPS MARKET FORECAST BY APPLICATION, THROUGH 2011 (MILLION POUNDS)
      • POLYIMIDES/ PEI/ PAI
        • Background
        • Properties
        • Early E/E Applications
        • Vespel Parts
        • A Major Electric/Electronic Application - Dielectric Interlayers
        • Polyimide Films
        • Polyetherimides (PEIs)
          • Background
          • Properties
          • Applications
        • Polyamideimides (PAIs)
          • Background
          • Properties
          • Applications
          • Producers
          • New Developments
            • GE Plastics
            • DuPont
          • Market Estimates and Forecasts
    • Table 9 NORTH AMERICAN POLYIMIDE MARKET FORECAST BY APPLICATION, THROUGH 2011 (MILLION POUNDS)
      • POLYCARBONATES
        • Background
        • General Grades
        • Properties
          • Overview
          • Property Advantages and Disadvantages
        • Polyester Carbonates
        • Applications
        • Marketing
        • Producers and Capacities
    • Table 10 DOMESTIC POLYCARBONATE PRODUCERS AND CAPACITIES (MILLION POUNDS)
      • Market Estimates and Forecasts
    • Table 11 NORTH AMERICAN POLYCARBONATE MARKET FORECAST BY APPLICATION, THROUGH 2011 (MILLION POUNDS)
      • POLYPHTHALAMIDES (PPA)
        • Background
        • Properties and Applications
        • Producers
        • Market Estimates and Forecasts
    • Table 12 NORTH AMERICAN POLYPHTHALAMIDE MARKET FORECAST BY APPLICATION, THROUGH 2011 (MILLION POUNDS)
      • LIQUID CRYSTAL POLYMERS (LCP)
        • Background
        • Properties
        • Applications
          • Background
          • Electrical/ Electronics
        • Producers
    • Table 13 ESTIMATES OF GLOBAL LIQUID CRYSTAL POLYMER CAPACITIES - 2006 (MILLION POUNDS/YEAR)
      • New Developments and Products
        • Ticona
        • DuPont
      • Market Estimates and Forecasts
    • Table 14 NORTH AMERICAN LCP MARKET BY APPLICATION, THROUGH 2011 (MILLION POUNDS)
      • TOTAL
      • POLYSULFONES
        • Background
        • Types of Polysulfones
          • Background
          • Polyethersulfones (PES)
          • Polyarylsulfones
        • Grades
        • Properties
        • Applications of Polysulfones
        • Electrical/Electronic Applications
        • Producer Scenario
        • Market Estimates and Forecasts
    • Table 15 NORTH AMERICAN POLYSULFONE MARKET FORECAST BY APPLICATION, THROUGH 2011 (MILLION POUNDS)
      • ALLOYS/BLENDS
        • Background
        • PPO/HIPS
          • Background
          • Properties
          • Applications
        • PPO/Nylon
          • Background and Properties
          • Grades and Applications
        • PEI/Polycarbonate Blends
        • LCP/PPS Alloys
        • Recent Alloy/Blend Developments
          • Compatibilizer Advances
          • LCP Teams up with Polycarbonates and PET
          • Use of PC/PBT Blends
        • Market Estimates and Forecasts
    • Table 16 NORTH AMERICAN ALLOY/BLEND MARKET BY APPLICATION, THROUGH 2011 (MILLION POUNDS)
      • FLUOROPOLYMERS
        • Background
        • Properties and Applications
        • Producers
        • Market Estimates and Forecasts
  • Table 17 NORTH AMERICAN FLUOROPOLYMER MARKET BY APPLICATION, THROUGH 2011 (MILLION POUNDS)
    • POLYKETONES
      • Background
      • Properties
      • Applications
      • Producers
      • Recent Developments
        • Degussa
        • Victrex, Ltd.
        • Asian Sources for PEEK
        • PEEK for Lead-Free Soldering
        • PEEK for Thin-Wall Parts
      • Market Estimates and Forecasts
    • Table 18 NORTH AMERICAN POLYKETONE MARKET BY APPLICATION, THROUGH 2011 (MILLION POUNDS)
      • THERMOPLASTIC MARKET ESTIMATES AND FORECASTS SUMMARY
    • Table 19 NORTH AMERICAN TOTAL THERMOPLASTIC RESIN MARKET VOLUME BY RESIN, THROUGH 2011 (MILLION POUNDS)
    • Figure 1 NORTH AMERICAN TOTAL THERMOPLASTIC RESIN MARKET VOLUME BY RESIN, 2005-2011 (MILLION POUNDS)
      • THERMOSET RESINS
        • OVERVIEW
        • REINFORCED GRADES
        • GENERAL PROPERTIES
    • Table 20 REINFORCED THERMOSET PROPERTIES AND MANUFACTURING PROCESSES
      • EPOXY RESINS
        • Overview
        • Background
        • Chemical Epoxy Types
        • Technology and Properties
        • Electronic Applications
        • Epoxy Systems
          • Background
          • Non-Molded
          • Laminating Systems
          • Molded Epoxies
        • Producers
        • Market Estimates and Forecasts
    • Table 21 NORTH AMERICAN EPOXY MARKET FORECAST BY APPLICATION, THROUGH 2011 (MILLION POUNDS)
      • POLYURETHANES
        • Background
        • General Applications
        • Market Estimates and Forecasts
    • Table 22 NORTH AMERICAN POLYURETHANE MARKET FORECAST BY APPLICATION, THROUGH 2011 (MILLION POUNDS)
      • PHENOLICS
        • Background
        • Grades
        • Molding Compounds
          • Background
          • Typical Applications for Phenolic Molding Compounds
        • Electric/Electronic Applications
        • Producers
        • Market Estimates and Forecasts
    • Table 23 NORTH AMERICAN PHENOLIC MARKET FORECAST BY APPLICATION, THROUGH 2011 (MILLION POUNDS)
      • UNSATURATED POLYESTERS
        • Background
        • Ingredients of Unsaturated Polyester Formulations
    • Table 24 INGREDIENTS OF UNSATURATED POLYESTER RESIN FORMULATIONS IN DESCENDING ORDER OF COMMERCIAL USE
      • Applications
        • Construction
        • Bathroom Products
        • Corrosion-Resistant Products
        • Marine Products
        • Transportation
        • Other Applications
        • Electrical/Electronic
      • Bulk Molding Compounds (BMC)
        • Background
        • Applications
      • Producers and Suppliers
      • Market Estimates and Forecasts
    • Table 25 NORTH AMERICAN UNSATURATED POLYESTER MARKET FORECAST BY APPLICATION, THROUGH 2011 (MILLION POUNDS)
      • DIALLYL PHTHALATE (DAP)
        • Overview
        • Background and Applications
        • Producers
        • Market Estimates and Forecasts
    • Table 26 NORTH AMERICAN DAP MARKET FORECAST BY APPLICATION, THROUGH 2011 (MILLION POUNDS)
      • THERMOSET MARKET ESTIMATE AND FORECAST SUMMARY
    • Table 27 TOTAL NORTH AMERICAN THERMOSET RESIN MARKET FORECAST BY RESIN, THROUGH 2011 (MILLION POUNDS)
    • Figure 2 TOTAL NORTH AMERICAN THERMOSET RESIN MARKET FORECAST BY RESIN, 2005-2011 (MILLION POUNDS)
  • ELECTRONIC COMPONENT PRODUCTS
    • INTRODUCTION
    • ACTIVE DEVICES
    • ACTIVE/PASSIVE DEVICES
    • PASSIVE DEVICES
    • FOCUS OF THIS REPORT
    • DIELECTRIC PROPERTIES OF PLASTICS
      • OVERVIEW
      • BACKGROUND
    • Table 28 DIELECTRIC CONSTANTS OF SELECTED MATERIALS
    • Table 29 DIELECTRIC CONSTANTS FOR SELECTED THERMOPLASTICS
      • PRINTED CIRCUIT BOARDS (PCBs)
        • BACKGROUND
        • OVERVIEW
        • PROPERTY REQUIREMENTS
          • Electrical
          • Mechanical
          • Other Property Requirements
        • TECHNOLOGIES
          • Overview
        • PCB SUBSTRATES
          • Overview
          • Rigid Substrates
            • Overview
            • Current Material Usage
              • Standard FR-4 Epoxy Resin
              • Higher-Performance Epoxies
              • Polyimides
              • Cyanate Esters
              • Silicon-Carbon
              • PTFE
              • BT Resins
              • Phenolics
              • Melamine
              • Other Materials
              • Copper Foils
              • Glass Cloth
            • Types of Reinforcements
            • Needs of Microwave Circuits
            • Production of Rigid PCBs
            • Environmental Issues
              • PCB Laminates
              • Lead-Free Electronic Soldering
            • Flame Retardant Issues
            • Issues Facing Plastics Usage
    • Flexible Printed Circuit Boards
      • Background
      • Technology
      • Standards
      • Advantages
      • Materials Used
        • Overview
        • Polyimides
        • Polyesters
        • Liquid Crystalline Polymers
        • Aramids
        • Epoxy Resins
        • Adhesiveless Laminates
      • Rigid-Flex Circuits
      • Comparison between Rigid and Flexible Circuit boards
    • Table 30 COMPARISON BETWEEN RIGID AND FLEX CIRCUITBOARDS
      • Production Statistics
    • Table 31 GLOBAL PCB PRODUCTION FORECAST BY GEOGRAPHIC AREA*, THROUGH 2011 ($ BILLIONS)
    • Figure 3 GLOBAL PCB PRODUCTION FORECAST BY GEOGRAPHIC AREA, 2005-2011 ($ BILLIONS)
      • Biodegradable PCBs
      • MARKET ESTIMATES AND FORECASTS
    • Table 32 NORTH AMERICAN PCB MARKET FORECAST BY THERMOPLASTIC AND THERMOSET RESIN, THROUGH 2011 (MILLION POUNDS)
    • Table 33 NORTH AMERICAN PCB MARKET BY THERMOPLASTIC RESIN (MILLION POUNDS)
    • Table 34 NORTH AMERICAN PCB MARKET BY THERMOSET RESIN (MILLION POUNDS)
      • ELECTRONIC PACKAGING
        • OVERVIEW
        • BACKGROUND
        • THROUGH-HOLE TECHNOLOGY
        • WIRE BONDING
        • TAPE AUTOMATED BONDING (TAB)
          • Overview
          • Advantages
        • CHIP-ON-BOARD (COB)
          • Background
          • Advantages/Disadvantages
          • Substrate Materials
        • FLIP CHIP BONDING
        • DUAL-IN-LINE
        • SURFACE-MOUNT TECHNOLOGY (SMT)
          • Background
          • Details
          • Design and Manufacturing Process
          • Advantages vs. Through-Hole
          • Wave Soldering Moving to Vapor Phase/IR
          • Resin and Material Usage
          • Competitive Resin Scenario
        • OTHER KEY, SELECTED ELECTRONICPACKAGING/INTERCONNECTION TECHNOLOGIES
          • Multichip Modules (MCMs)
            • Background
            • Rationale for Use
            • Types of MCMs
            • Materials Used
            • Problems for MCMs
    • PIN GRID ARRAYS (PGAS)
      • DGA vs. BGA
        • High-Density Chips
          • Background
          • Technology
          • Materials Used
            • Background
            • Epoxy Alternatives
            • Current Alternatives with Polyimides
    • POTENTIAL REPLACEMENTS FOR CONVENTIONAL INTERCONNECTS
      • Background
      • Interconnect Packaging Evolution
        • Background
        • SMT Chip Carriers
        • Molded/3D PCBs
          • Background
          • History
          • How Do They Differ From PCBs?
          • Materials Used
          • Market Target
          • Process Technologies
          • Impact of MIDs
          • Recent Developments
          • Degussa and Bayer
          • Ticona
          • BASF
    • ENCAPSULANTS
      • Definitions and Background
      • Primary Purposes of Encapsulation
      • Organic Encapsulants
        • Background
        • Impact of Thermoplastics
          • Background
          • Types and Application Modes
    • Table 35 ENCAPSULANTS - APPLICATION MODE, ADVANTAGES AND DISADVANTAGES
      • Epoxy Encapsulation Formulations
    • Table 36 EPOXY ENCAPSULANT FORMULATIONS
      • Encapsulated Electrical Components
        • Background
        • Specific Encapsulant Applications
      • Specifications and Standards
        • Overview
        • UL 1694 Looks at Circuit Boards
      • Major Selected Encapsulant Producers and Their Product Lines
        • Huntsman
        • Lord Chemical
        • Loctite
        • Henkel
      • Recent Developments
        • BASF
        • LNP
        • RTP
        • Bayer
    • Table 37 SELECTED ENCAPSULANT SUPPLIERS
      • Market Estimates and Forecasts
    • Table 38 NORTH AMERICAN ENCAPSULATION MARKET FORECAST BY THERMOPLASTIC AND THERMOSET RESIN, THROUGH 2011 (MILLION POUNDS)
    • Table 39 NORTH AMERICAN ENCAPSULANT MARKET FORECAST BY THERMOSET RESIN, THROUGH 2011 (MILLION POUNDS)
    • Table 40 NORTH AMERICAN ENCAPSULATION MARKET FORECAST BY THERMOPLASTIC RESIN, THROUGH 2011 (MILLION POUNDS)
      • MOLDED ELECTRONIC PRODUCTS
        • OVERVIEW
        • BACKGROUND
        • RESINS USED
        • DEMAND
    • Table 41 DEMAND FOR PASSIVE ELECTRONIC COMPONENTS (PERCENT OF TOTAL DOLLARS)
      • MARKET DRIVERS
      • CONNECTORS
        • Background
        • Trends
        • Function of Connectors
        • Resin Selection
        • Manufacturers
    • Table 42 SELECTED MANUFACTURERS OF HIGH DENSITY, MULTIPIN CONNECTORS
      • End-Use Markets
        • Background
        • Communications Industry
        • Automotive Industry
          • Background
          • Resin Scenario
        • Other Markets
          • Market Estimates and Forecasts
    • Table 43 NORTH AMERICAN CONNECTOR MARKET FORECAST BY THERMOPLASTIC AND THERMOSET RESIN, THROUGH 2011 (MILLION POUNDS)
    • Table 44 NORTH AMERICAN CONNECTOR MARKET FORECAST BY THERMOPLASTIC RESIN, THROUGH 2011 (MILLION POUNDS)
    • Table 45 NORTH AMERICAN CONNECTOR MARKET FORECAST BY THERMOSET RESIN, THROUGH 2011 (MILLION POUNDS)
      • SWITCHES
        • Background
        • Market Estimates and Forecasts
    • Table 46 NORTH AMERICAN SWITCH MARKET FORECAST BY THERMOPLASTIC AND THERMOSET RESIN, THROUGH 2011 (MILLION POUNDS)
    • Table 47 NORTH AMERICAN SWITCH MARKET FORECAST BY THERMOPLASTIC RESIN, THROUGH 2011 (MILLION POUNDS)
    • Table 48 NORTH AMERICAN SWITCH MARKET FORECAST BY THERMOSET RESIN, THROUGH 2011 (MILLION POUNDS)
      • BOBBINS
        • Background
    • Table 49 SELECTED BOBBIN MOLDERS
      • Market Estimates and Forecasts
    • Table 50 TOTAL NORTH AMERICAN BOBBIN MARKET BY THERMOPLASTIC AND THERMOSET RESIN, THROUGH 2011
    • Figure 4 TOTAL NORTH AMERICAN BOBBIN MARKET BY THERMOPLASTIC AND THERMOSET RESIN, 2005-2011
    • Table 51 NORTH AMERICAN BOBBIN MARKET FORECAST BY THERMOPLASTIC BY RESIN, THROUGH 2011 (MILLION POUNDS)
    • Table 52 NORTH AMERICAN BOBBIN MARKET FORECAST BY THERMOSET RESIN, THROUGH 2011 (MILLION POUNDS)
      • RELAYS
        • Background
        • Market Estimates and Forecasts
    • Table 53 TOTAL NORTH AMERICAN RELAY MARKET FORECAST BY THERMOPLASTIC AND THERMOSET RESIN, THROUGH 2011 (MILLION POUNDS)
    • Figure 5 TOTAL NORTH AMERICAN RELAY MARKET FORECAST BY THERMOPLASTIC AND THERMOSET RESIN, 2005-2011 (MILLION POUNDS)
    • Table 54 NORTH AMERICAN RELAY MARKET FORECAST BY THERMOPLASTIC RESIN, THROUGH 2011 (MILLION POUNDS)
    • Table 55 NORTH AMERICAN RELAY MARKET FORECAST BY THERMOSET RESIN, THROUGH 2011 (MILLION POUNDS)
      • CAPACITORS
        • Background
        • Applications
        • Consumption by Market Segment
        • Market Estimates and Forecasts
    • Table 56 NORTH AMERICAN CAPACITOR MARKET FORECAST BY THERMOPLASTIC RESIN, THROUGH 2011 (MILLION POUNDS)
      • OTHER MOLDED ELECTRONIC COMPONENTS
        • Resistors
          • Background
          • Applications
        • Inductors/ Transformers
        • Market Estimates and Forecasts (Other Molded Electronic Components)
    • Table 57 OTHER NORTH AMERICAN ELECTRONIC COMPONENT MARKET FORECAST BY TYPE OF RESIN, THROUGH 2011 (MILLION POUNDS)
    • Table 58 OTHER NORTH AMERICAN ELECTRONIC COMPONENT MARKET FORECAST BY THERMOPLASTIC RESIN, THROUGH 2011 (MILLION POUNDS)
    • Table 59 OTHER NORTH AMERICAN ELECTRONIC COMPONENT MARKET FORECAST BY THERMOSET RESIN, THROUGH 2011 (MILLION POUNDS)
      • NEW DEVELOPMENTS THAT WILL AFFECT DISCRETE ELECTRONIC MOLDED COMPONENTS
        • Background
        • Molded Electronic Parts Have Become Thinner
        • Combining Passive and Interconnect Devices with Ceramics
      • MOLDED ELECTRONIC COMPONENT SUMMARY
    • Table 60 NORTH AMERICAN MOLDED ELECTRONIC COMPONENT RESIN SUMMARY, THROUGH 2011 (MILLION POUNDS)
    • Table 61 NORTH AMERICAN THERMOPLASTIC MOLDED ELECTRONIC COMPONENT RESIN SUMMARY, THROUGH 2011 (MILLION POUNDS)
    • Table 62 NORTH AMERICAN THERMOSET MOLDED ELECTRONIC COMPONENT RESIN SUMMARY, THROUGH 2011 (MILLION POUNDS)
      • SUMMARY MARKET ESTIMATES AND FORECASTS FOR ELECTRONIC DEVICES
      • BY APPLICATION
    • Table 63 NORTH AMERICAN RESIN MARKET FORECAST BY APPLICATION, THROUGH 2011 (MILLION POUNDS)
      • BY RESIN
    • Table 64 NORTH AMERICAN THERMOPLASTIC RESIN MARKET FORECAST BY APPLICATION, THROUGH 2011 (MILLION POUNDS)
    • Table 65 NORTH AMERICAN THERMOSET MARKET FORECAST BY APPLICATION, THROUGH 2011 (MILLION POUNDS)
  • APPLICATION BY END-USE
    • BACKGROUND
    • COMPUTERS AND BUSINESS EQUIPMENT
      • BACKGROUND
      • DESKTOP COMPUTERS
      • MONITORS
      • KEYBOARDS
      • NOTEBOOKS
      • HAND-HELDS
        • Background
        • Other Hand-Held Computer Aspects
        • Power Considerations
      • PRINTERS
      • SCANNERS
        • Facsimile Machines (Fax Machines)
      • COPIERS
      • PHONES
        • Corded
        • Cordless
        • Cellular
      • PAGERS
    • CONSUMER ELECTRONICS
      • OVERVIEW
      • BACKGROUND
      • TELEVISION SETS
      • DIGITAL CAMERAS
    • AUTOMOTIVE UNDER-THE HOOD
      • OVERVIEW
    • Table 66 HISTORICAL, CURRENT AND PROJECTED U.S. AUTOMOTIVE SALES (MILLIONS)
      • CAFE ISSUES
      • OVERVIEW OF ELECTRONIC COMPONENTS
      • FLEXIBLE CIRCUITRY
      • MATERIAL USAGE
      • EXPANDED USE OF ENCAPSULATED COMPONENTS
      • BOBBINS/CONNECTORS
      • SWITCHES/SOCKETS
      • IGNITION COMPONENTS
      • TRENDS AND DEVELOPMENTS
        • Polymer Fuses
        • New Polyphthalamide
    • APPLIANCES
      • OVERVIEW
      • APPLIANCE USAGE IN U.S. HOUSEHOLDS
    • Table 67 SALES OF LEADING APPLIANCE PRODUCTS (MILLIONS OF UNITS)
      • KEY APPLICATIONS FOR PLASTICS IN APPLIANCES
    • Table 68 SELECTED MAJOR APPLICATIONS FOR POLYMERS IN APPLIANCES
      • ELECTRONIC MOLDED PRODUCTS
    • MEDICAL DEVICES
      • OVERVIEW
      • TESTING AND DIAGNOSTIC EQUIPMENT
        • Overview
        • Diagnostic Equipment
        • Electromedical Equipment
        • Clinical Laboratory Equipment
      • MARKET ESTIMATES AND FORECASTS
    • Table 69 NORTH AMERICAN PLASTICS CONSUMPTION IN ELECTRONIC COMPONENTS BY MAJOR END-USE INDUSTRY GROUPING, THROUGH 2011 (MILLION POUNDS)
    • Table 70 NORTH AMERICAN PLASTICS CONSUMPTION OF ELECTRONIC COMPONENTS IN OTHER MARKETS, THROUGH 2011 (MILLION POUNDS)
  • TECHNOLOGY TRENDS RELATED TO ELECTRONIC COMPONENTS
    • BACKGROUND
    • IMPORTANCE OF MINIATURIZATION
    • PACKAGING
    • CONCEPT OF MICROMOLDING
    • REPLACEMENT OF CERAMICS WITH PLASTICS
    • THINWALLING ELECTRONIC COMPONENTS
      • BACKGROUND
      • THINWALLING IS NOT A NOVEL CONCEPT
      • EFFECTS ON PERFORMANCE REQUIREMENTS AND DESIGN
      • APPLICATION REQUIREMENTS
      • MATERIAL AND PROCESS SELECTION
      • PROPERTIES REQUIRED
      • CHALLENGES IN DOWNSIZING
      • SOFTWARE THAT AIDS THINWALL DESIGN
    • FLEXIBLE ELECTRONICS
    • PRINTED ELECTRONICS
  • ELECTRONIC COMPONENT INDUSTRY OVERVIEW
    • TOP ELECTRONIC INDUSTRY MANUFACTURERS
    • Table 71 TOP GLOBAL SEMICONDUCTOR COMPANIES ($BILLION)
      • STRUCTURE OF ELECTRONIC COMPONENTS INDUSTRY
    • Table 72 SELECTED LIST OF ACTIVE/PASSIVE AND PASSIVE ELECTRONIC COMPONENTS
      • MARKETING ASPECTS
        • OUTSOURCING
        • WHAT PLASTIC MOLDERS ARE DOING
        • UPSTREAM MANUFACTURING
        • CONTRACT MANUFACTURING
  • RESIN PRODUCERS
    • OVERVIEW
    • Table 73 TRADE NAMES OF SELECTED, KEY RESINS USED IN ELECTRONIC COMPONENTS AND RELATED ELECTRICAL/ELECTRONIC PRODUCTS
      • MAJOR PLAYERS IN THE RESIN ELECTRONIC COMPONENT MARKET
        • THERMOSETS
          • Epoxies
          • Phenolics
          • Polyesters
          • DAP
        • THERMOPLASTICS
          • Nylon 6
          • Nylon 66
          • Other Nylons
          • Polyesters
          • PPS
          • Polyimides
          • Polycarbonates
          • LCPs
          • Polysulfones
          • Fluoropolymers
          • Polyphthalamides
          • Polyketones
  • PRICING
    • Table 74 NORTH AMERICAN LIST PRICES FOR SELECTED RESINS USED TO MOLD ELECTRONIC COMPONENTS (DOLLAR/LB)
  • MOLDERS OF ELECTRONIC COMPONENTS
    • Table 75 SALES OF TOP ELECTRIC/ELECTRONIC INJECTION MOLDERS ($ MILLION)
  • REGULATIONS
    • BACKGROUND
    • DETAILS OF ROHS DIRECTIVE
  • RECYCLING
    • BACKGROUND
    • UNITED STATES
    • EUROPE
    • ASIA
    • ELECTRONIC INDUSTRY INTERFACE
  • ENVIRONMENTAL ISSUES
    • OVERVIEW
    • PRINTED CIRCUIT BOARD DISPOSAL
    • HALOGEN-FREE PRINTED CIRCUIT BOARDS
  • SELECTED COMPANY PROFILES
    • AOC, INC. - COLLIERSVILLE, TN
    • ASAHI KASEI CHEMICAL - TOKYO, JAPAN
    • ASHLAND SPECIALTY CHEMICAL - DUBLIN, OH
    • BASF - FLORHAM PARK, NJ
    • BAYER CORPORATION - PITTSBURGH, PA
    • BULK MOLDING COMPOUNDS - CHICAGO, IL
    • CHEVRON PHILLIPS CHEMICAL - THE WOODLANDS, TX
    • CYTEC INDUSTRIES (OLEAN DIVISION) - OLEAN, NY
    • COSMIC PLASTICS - VALENCIA, CA
    • DAIKIN INDUSTRIES - TOKYO, JAPAN
    • DOW PLASTICS - MIDLAND, MI
    • DSM RESINS - AUGUSTA, GA
    • DUPONT - WILMINGTON, DE
    • EMS GRIVORY - SUMTER, SC
    • EPIC RESINS - PALMYRA, WI
    • GE PLASTICS - PITTSFIELD, MA
    • GLASTIC CORPORATION - FLORENCE, KY
    • HAYSITE REINFORCED PLASTICS - ERIE, PA
    • HEXCEL CORPORATION - STAMFORD, CT
    • HEXION SPECIALTY CHEMICALS - COLUMBUS, OH
    • HUNTSMAN ADVANCED MATERIALS - THE WOODLANDS, TX
    • INTERPLASTIC CORPORATION - ST. PAUL, MN
    • LOCTITE - ROCKY POINT, CT
    • PLASTICS ENGINEERING COMPANY - SHEBOYGAN, WI
    • PREMIX, INC - NORTH KINGSVILLE, OH
    • QUANTUM COMPOSITES - BAY CITY, MI
    • RHODIA ENGINEERING PLASTICS - FARMINGTON HILLS, MI
    • ROGERS CORPORATION - ROGERS, CT
    • ROHM & HAAS - PHILADELPHIA, PA
    • SOLUTIA - ST. LOUIS, MO
    • SOLVAY ENGINEERING POLYMERS - ALPHARETTA, GA
    • SOLVAY SOLEXIS - THOROFARE, NJ
    • TICONA - FLORENCE, KY
    • TORAY PLASTICS - TOKYO, JAPAN
    • VICTREX, LTD - GREENVILLE, SC
  • LIST OF TABLES
    • Summary Table:
    • NORTH AMERICAN CONSUMPTION IN ELECTRONIC COMPONENTS BY TYPE OF RESIN, THROUGH 2011 (MILLION POUNDS)
    • Table 1 COMPARISON OF NYLON 6 AND NYLON 66 PROPERTIES
    • Table 2 NYLON PRODUCERS AND CAPACITIES (MILLION POUNDS/YEAR)
    • Table 3 NORTH AMERICAN NYLON MARKET FORECAST BY APPLICATION, THROUGH 2011 (MILLION POUNDS)
    • Table 4 GLOBAL PBT PRODUCERS AND CAPACITIES (MILLION POUNDS/YEAR)
    • Table 5 KEY NORTH AMERICAN PET PRODUCERS AND CAPACITIES (MILLION POUNDS/YEAR)
    • Table 6 NORTH AMERICAN PBT MARKET FORECAST BY APPLICATION, THROUGH 2011 (MILLION POUNDS)
    • Table 7 NORTH AMERICAN PET MARKET FORECAST BY APPLICATION, THROUGH 2011 (MILLION POUNDS)
    • Table 8 NORTH AMERICAN PPS MARKET FORECAST BY APPLICATION, THROUGH 2011 (MILLION POUNDS)
    • Table 9 NORTH AMERICAN POLYIMIDE MARKET FORECAST BY APPLICATION, THROUGH 2011 (MILLION POUNDS)
    • Table 10 DOMESTIC POLYCARBONATE PRODUCERS AND CAPACITIES (MILLION POUNDS)
    • Table 11 NORTH AMERICAN POLYCARBONATE MARKET FORECAST BY APPLICATION, THROUGH 2011 (MILLION POUNDS)
    • Table 12 NORTH AMERICAN POLYPHTHALAMIDE MARKET FORECAST BY APPLICATION, THROUGH 2011 (MILLION POUNDS)
    • Table 13 ESTIMATES OF GLOBAL LIQUID CRYSTAL POLYMER CAPACITIES - 2006 (MILLION POUNDS/YEAR)
    • Table 14 NORTH AMERICAN LCP MARKET BY APPLICATION, THROUGH 2011 (MILLION POUNDS)
    • Table 15 NORTH AMERICAN POLYSULFONE MARKET FORECAST BY APPLICATION, THROUGH 2011 (MILLION POUNDS)
    • Table 16 NORTH AMERICAN ALLOY/BLEND MARKET BY APPLICATION, THROUGH 2011 (MILLION POUNDS)
    • Table 17 NORTH AMERICAN FLUOROPOLYMER MARKET BY APPLICATION, THROUGH 2011 (MILLION POUNDS)
    • Table 18 NORTH AMERICAN POLYKETONE MARKET BY APPLICATION, THROUGH 2011 (MILLION POUNDS)
    • Table 19 NORTH AMERICAN TOTAL THERMOPLASTIC RESIN MARKET VOLUME BY RESIN, THROUGH 2011 (MILLION POUNDS)
    • Table 20 REINFORCED THERMOSET PROPERTIES AND MANUFACTURING PROCESSES
    • Table 21 NORTH AMERICAN EPOXY MARKET FORECAST BY APPLICATION, THROUGH 2011 (MILLION POUNDS)
    • Table 22 NORTH AMERICAN POLYURETHANE MARKET FORECAST BY APPLICATION, THROUGH 2011 (MILLION POUNDS)
    • Table 23 NORTH AMERICAN PHENOLIC MARKET FORECAST BY APPLICATION, THROUGH 2011 (MILLION POUNDS)
    • Table 24 INGREDIENTS OF UNSATURATED POLYESTER RESIN FORMULATIONS IN DESCENDING ORDER OF COMMERCIAL USE
    • Table 25 NORTH AMERICAN UNSATURATED POLYESTER MARKET FORECAST BY APPLICATION, THROUGH 2011 (MILLION POUNDS)
    • Table 26 NORTH AMERICAN DAP MARKET FORECAST BY APPLICATION, THROUGH 2011 (MILLION POUNDS)
    • Table 27 TOTAL NORTH AMERICAN THERMOSET RESIN MARKET FORECAST BY RESIN, THROUGH 2011 (MILLION POUNDS)
    • Table 28 DIELECTRIC CONSTANTS OF SELECTED MATERIALS
    • Table 29 DIELECTRIC CONSTANTS FOR SELECTED THERMOPLASTICS
    • Table 30 COMPARISON BETWEEN RIGID AND FLEX CIRCUITBOARDS
    • Table 31 GLOBAL PCB PRODUCTION FORECAST BY GEOGRAPHIC AREA*, THROUGH 2011 ($ BILLIONS)
    • Table 32 NORTH AMERICAN PCB MARKET FORECAST BY THERMOPLASTIC AND THERMOSET RESIN, THROUGH 2011 (MILLION POUNDS)
    • Table 33 NORTH AMERICAN PCB MARKET BY THERMOPLASTIC RESIN (MILLION POUNDS)
    • Table 34 NORTH AMERICAN PCB MARKET BY THERMOSET RESIN (MILLION POUNDS)
    • Table 35 ENCAPSULANTS - APPLICATION MODE, ADVANTAGES AND DISADVANTAGES
    • Table 36 EPOXY ENCAPSULANT FORMULATIONS
    • Table 37 SELECTED ENCAPSULANT SUPPLIERS
    • Table 38 NORTH AMERICAN ENCAPSULATION MARKET FORECAST BY THERMOPLASTIC AND THERMOSET RESIN, THROUGH 2011 (MILLION POUNDS)
    • Table 39 NORTH AMERICAN ENCAPSULANT MARKET FORECAST BY THERMOSET RESIN, THROUGH 2011 (MILLION POUNDS)
    • Table 40 NORTH AMERICAN ENCAPSULATION MARKET FORECAST BY THERMOPLASTIC RESIN, THROUGH 2011 (MILLION POUNDS)
    • Table 41 DEMAND FOR PASSIVE ELECTRONIC COMPONENTS (PERCENT OF TOTAL DOLLARS)
    • Table 42 SELECTED MANUFACTURERS OF HIGH DENSITY, MULTIPIN CONNECTORS
    • Table 43 NORTH AMERICAN CONNECTOR MARKET FORECAST BY THERMOPLASTIC AND THERMOSET RESIN, THROUGH 2011 (MILLION POUNDS)
    • Table 44 NORTH AMERICAN CONNECTOR MARKET FORECAST BY THERMOPLASTIC RESIN, THROUGH 2011 (MILLION POUNDS)
    • Table 45 NORTH AMERICAN CONNECTOR MARKET FORECAST BY THERMOSET RESIN, THROUGH 2011 (MILLION POUNDS)
    • Table 46 NORTH AMERICAN SWITCH MARKET FORECAST BY THERMOPLASTIC AND THERMOSET RESIN, THROUGH 2011 (MILLION POUNDS)
    • Table 47 NORTH AMERICAN SWITCH MARKET FORECAST BY THERMOPLASTIC RESIN, THROUGH 2011 (MILLION POUNDS)
    • Table 48 NORTH AMERICAN SWITCH MARKET FORECAST BY THERMOSET RESIN, THROUGH 2011 (MILLION POUNDS)
    • Table 49 SELECTED BOBBIN MOLDERS
    • Table 50 TOTAL NORTH AMERICAN BOBBIN MARKET BY THERMOPLASTIC AND THERMOSET RESIN, THROUGH 2011
    • Table 51 NORTH AMERICAN BOBBIN MARKET FORECAST BY THERMOPLASTIC BY RESIN, THROUGH 2011 (MILLION POUNDS)
    • Table 52 NORTH AMERICAN BOBBIN MARKET FORECAST BY THERMOSET RESIN, THROUGH 2011 (MILLION POUNDS)
    • Table 53 TOTAL NORTH AMERICAN RELAY MARKET FORECAST BY THERMOPLASTIC AND THERMOSET RESIN, THROUGH 2011 (MILLION POUNDS)
    • Table 54 NORTH AMERICAN RELAY MARKET FORECAST BY THERMOPLASTIC RESIN, THROUGH 2011 (MILLION POUNDS)
    • Table 55 NORTH AMERICAN RELAY MARKET FORECAST BY THERMOSET RESIN, THROUGH 2011 (MILLION POUNDS)
    • Table 56 NORTH AMERICAN CAPACITOR MARKET FORECAST BY THERMOPLASTIC RESIN, THROUGH 2011 (MILLION POUNDS)
    • Table 57 OTHER NORTH AMERICAN ELECTRONIC COMPONENT MARKET FORECAST BY TYPE OF RESIN, THROUGH 2011 (MILLION POUNDS)
    • Table 58 OTHER NORTH AMERICAN ELECTRONIC COMPONENT MARKET FORECAST BY THERMOPLASTIC RESIN, THROUGH 2011 (MILLION POUNDS)
    • Table 59 OTHER NORTH AMERICAN ELECTRONIC COMPONENT MARKET FORECAST BY THERMOSET RESIN, THROUGH 2011 (MILLION POUNDS)
    • Table 60 NORTH AMERICAN MOLDED ELECTRONIC COMPONENT RESIN SUMMARY, THROUGH 2011 (MILLION POUNDS)
    • Table 61 NORTH AMERICAN THERMOPLASTIC MOLDED ELECTRONIC COMPONENT RESIN SUMMARY, THROUGH 2011 (MILLION POUNDS)
    • Table 62 NORTH AMERICAN THERMOSET MOLDED ELECTRONIC COMPONENT RESIN SUMMARY, THROUGH 2011 (MILLION POUNDS)
    • Table 63 NORTH AMERICAN RESIN MARKET FORECAST BY APPLICATION, THROUGH 2011 (MILLION POUNDS)
    • Table 64 NORTH AMERICAN THERMOPLASTIC RESIN MARKET FORECAST BY APPLICATION, THROUGH 2011 (MILLION POUNDS)
    • Table 65 NORTH AMERICAN THERMOSET MARKET FORECAST BY APPLICATION, THROUGH 2011 (MILLION POUNDS)
    • Table 66 HISTORICAL, CURRENT AND PROJECTED U.S. AUTOMOTIVE SALES (MILLIONS)
    • Table 67 SALES OF LEADING APPLIANCE PRODUCTS (MILLIONS OF UNITS)
    • Table 68 SELECTED MAJOR APPLICATIONS FOR POLYMERS IN APPLIANCES
    • Table 69 NORTH AMERICAN PLASTICS CONSUMPTION IN ELECTRONIC COMPONENTS BY MAJOR END-USE INDUSTRY GROUPING, THROUGH 2011 (MILLION POUNDS)
    • Table 70 NORTH AMERICAN PLASTICS CONSUMPTION OF ELECTRONIC COMPONENTS IN OTHER MARKETS, THROUGH 2011 (MILLION POUNDS)
    • Table 71 TOP GLOBAL SEMICONDUCTOR COMPANIES ($BILLION)
    • Table 72 SELECTED LIST OF ACTIVE/PASSIVE AND PASSIVE ELECTRONIC COMPONENTS
    • Table 73 TRADE NAMES OF SELECTED, KEY RESINS USED IN ELECTRONIC COMPONENTS AND RELATED ELECTRICAL/ELECTRONIC PRODUCTS
    • Table 74 NORTH AMERICAN LIST PRICES FOR SELECTED RESINS USED TO MOLD ELECTRONIC COMPONENTS (DOLLAR/LB)
    • Table 75 SALES OF TOP ELECTRIC/ELECTRONIC INJECTION MOLDERS ($ MILLION)
  • LIST OF FIGURES
    • Summary Figure:
    • NORTH AMERICAN CONSUMPTION IN ELECTRONIC COMPONENTS BY TYPE OF RESIN, 2005-2011 (MILLION POUNDS)
    • Figure 1 NORTH AMERICAN TOTAL THERMOPLASTIC RESIN MARKET VOLUME BY RESIN, 2005-2011 (MILLION POUNDS)
    • Figure 2 TOTAL NORTH AMERICAN THERMOSET RESIN MARKET FORECAST BY RESIN, 2005-2011 (MILLION POUNDS)
    • Figure 3 GLOBAL PCB PRODUCTION FORECAST BY GEOGRAPHIC AREA, 2005-2011 ($ BILLIONS)
    • Figure 4 TOTAL NORTH AMERICAN BOBBIN MARKET BY THERMOPLASTIC AND THERMOSET RESIN, 2005-2011
    • Figure 5 TOTAL NORTH AMERICAN RELAY MARKET FORECAST BY THERMOPLASTIC AND THERMOSET RESIN, 2005-2011 (MILLION POUNDS)
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