Table of Contents
- INTRODUCTION
- 2004: A LOOK BACK... A LOOK AHEAD
- New Materials Prove Essential
- Strained Silicon
- Gallium Nitride
- Conducting Polymers
- Environment
- Thermal Management
- Business Trends: Asia
- Optoelectronics
- Nanoelectronics
- Developments to Watch
- Developments to Watch (Continued)
- BUSINESS
- Sanyo Will Produce Blue Lasers
- JSR Markets Symyx Polymers
- Air Liquide to Supply AMD Fab
- National E-Waste Agreement Unlikely
- PCB Laminate Maker Restructures
- California eRecycle Law Takes Effect
- Soitec Signs Contract With AMD
- New SiC Plant in Sweden
- Cree, Nichia Cross-License LEDs
- Honeywell Opens Chemicals Plant
- Praxair to Supply Samsung
- Isola Will Fight Rogers Suit
- Photonics Manufacturer Licenses Patents
- Honeywell Receives Supplier Awards
- Air Liquide Expands in Korea
- Air Products Raises More Prices
- New SiC Substrate Facility
- Crystal IS Expands AlN Facility
- GaN Device Market to Grow
- Voltaix Expands Trimethylsilane Capacity
- New IPC Materials Standard
- Isola Buys Glass Cloth Manufacturer
- COMMENTARY
- Low-k Development Is Dragging Its Feet
- The Future of CMOS Technology
- The Future of CMOS Technology (Continued)
- Is RoHS a Four-Letter Word?
- Is RoHS a Four-Letter Word? (Continued)
- COMPOUND AND SILICON SUBSTRATES
- Flexible Transistors Use Oxide Film
- Honeywell Offers Sapphire Wafers
- Honeywell Offers Sapphire Wafers (Continued)
- Fujitsu Develops Low-Cost GaN HEMTs
- GaN-on-Insulator Wafers Introduced
- GaN-on-Insulator Wafers Introduced (Continued)
- Graded Material Produces Fastest Transistor
- Fast Pace for Strained Silicon
- Fast Pace for Strained Silicon (Continued)
- Fast Pace for Strained Silicon (Continued)
- Update on Strained Silicon Approaches
- Update on Strained Silicon Approaches (Continued)
- Update on Strained Silicon Approaches (Continued)
- Update on Strained Silicon Approaches (Continued)
- DIELECTRICS
- Low-k Technology Prevents Degradation
- Low-k Technology Prevents Degradation (Continued)
- ENVIRONMENT
- China to Issue Green Electronics Regulations
- China to Issue Green Electronics Regulations (Continued)
- Intel Ahead on Lead-Free, Packaging
- Update on RoHS Directive
- Update on RoHS Directive (Continued)
- Global e-waste Market to Cross $11 Billion by 2009
- Table 1 GLOBAL SALES FORECAST OF E-WASTE MARKET, THROUGH 2009 ($
MILLIONS)
- Figure 1 GLOBAL SALES FORECAST OF E-WASTE MARKET, 2002-2004 AND 2009
($ MILLIONS)
- INDUSTRY INSIGHT
- Will Indium Tin Oxide Shortages Slow LED Growth?
- Is ITO in Short Supply?
- Lack of Raw Materials
- Conclusion
- INDUSTRY NEWS
- Shin-Etsu Expanding Wafer Capacity
- Gas Suppliers Raise Prices Yet Again
- Licenses for Strained Silicon Technology
- Nichia, Nakamura Settle for $8 Million
- Kopin Forms LED JV In Asia
- Epoxy Curing, Solvent Prices Increase
- Antimony Trioxide Price Goes Up
- Austrian JV for High-Brightness LEDs
- II-VI plans 100 mm SiC Scale-up
- Revival Signs in Industry Statistics
- EMCORE Consolidates Solar Cell Operations
- Matheson Forms Linde Nippon Sanso JV
- FINANCIAL REPORTS
- MEMC Continues Strong Sales
- Soitec Also Strong
- Cabot Revenues Fall
- Gas Suppliers Report Sales Records
- GaAs Up, InP Down at AXT
- Cree Gains Once More
- Cabot Revenues Drop
- Park Does Better
- GRANTS AND FUNDING
- Universal Wins SBIR for IR OLEDs
- Evident Awarded SBIR for Quantum Dots
- NVE Receives STTR for Spintronics
- Funding for GaAs MOSFETs
- DARPA Awards Cree, Raytheon $27 Million
- PEOPLE
- Honeywell Appoints Materials VP
- Park Names President of Neltec
- DuPont Researcher Receives IMAPS Award
- IQE CEO Appointed Academy Fellow
- AXT Appoints New CEO
- Technical Marketing VP at Park
- RECENT EARNINGS
- Cree Strength Continues
- Parks Markets Slow
- Kopin Revenues Up
- ATMI Finishes Strong Year
- Record Year for Rogers
- RECENT PATENTS
- Molybdenum Eliminates Tungsten Interconnect Breakage.
- Assembly Tape for QFN Packages
- Spintronics Magnetic Field Sensor
- GaAsInN-HBT Wafer Technology
- RESEARCH
- Ferroelectric Nanodisks May Increase Memory Storage
- Metal Oxide Films by Polymer-Assisted Deposition
- Nanotubes Form Along Atomic Steps
- Fluorine Ion Implantation Stabilizes NiSi
- DNA May Hold Key to Data Storage
- External VCSEL Emits Visible Light
- ZnSnO Transparent Transistors
- III-V Nanowires Grown on Silicon
- Supercapacitors From Carbon Nanotubes
- Chip-Scale Magnetometer
- AIXTRON, IHP Sign High-k Alliance
- Magnetic Silicon for Spintronics?
- Raman Laser Chip Invented
- Enzyme Can Cut DNA Wires
- New Phase-Change Memory Material
- QCLs Operate Above Room Temperature
- Prototype OLED Light Source
- Semiconductors From Artificial Peptides
- WHO'S WHO IN ELECTRONIC MATERIALS
- A Pioneering Innovator In Electronic Devices
- A Pioneering Innovator in Electronic Devices (Continued)
- A Pioneering Innovator in Electronic Devices (Continued)
- MARKET ANALYSIS
- Industry Numbers Not Looking Good
- Industry Statistics Still in Doldrums
- Report on AlGaInP Laser Diode Market
- Industry Numbers Are Confusing
- Industry Numbers Hold Steady
- Industry Numbers Hold Steady (continued)
- METALS AND INTERCONNECTS
- Molecular Wires for Conductive Adhesives
- Molecular Wires for Conductive Adhesives (Continued)
- iNEMI Previews Lead-Free Report
- Worldwide Market for Power Supply and Management SemiconDuctors to Reach
$43.5 Billion by 2010
- Worldwide Market for Power Supply .. (continued)
- Table 2 WORLDWIDE MARKET FOR POWER SUPPLY AND MANAGEMENT SEMICONDUCTOR
DEVICES AND POWER MANAGEMENT SOFTWARE FOR ELECTRONICS, THROUGH 2010 ($
MILLIONS)
- NANOELECTRONICS
- Flexible Circuits From Metal Rubber
- Nanocomposite for Heat Spreaders
- Nanocomposite for Heat Spreaders (Continued)
- ORGANIC MATERIALS
- More Efficient Plastic Solar Cells
- Biomolecule Acts as Molecular Switch
- Organic FETs Use Ferroelectric Gate
- Organic FETs Use Ferroelectric Gate (Continued)
- STRATEGIC AND OTHER MATERIALS
- Collaboration Needed for Next-Generation
- Collaboration Needed for Next-Generation (Continued)
- Laminate for Lead Free Assembly
- Resins Improve Carrier Tape Productivity
- Resins Improve Carrier Tape Productivity (Continued)
- Cookson Launches Solder Flux
- Dow Corning Launches Flip-Chip Adhesive
- IS640 Laminates Intro at Isola
- Cute Enables Thinner Multilayer Laminates
- Dow Corning Intros Thermal Grease, Gel
- Dow Corning Intros Thermal Grease, Gel (Continued)
- EMI Gaskets with Conductive Adhesives
- PROCESS CHEMICALS AND GASES
- More Ammonia, Bulk Gases from Asia
- More Ammonia, Bulk Gases from Asia (Continued)
- TECHNOLOGY
- Cree Achieves Brightest White LED
- Dow Corning Intros Thermal Encapsulant
- Leadframe Technology Licensed by Psi
- NanoInk Licenses Patent Family
- Packaging Technologies From Du Pont
- MEC Offers Carbon-Fiber Piezo Bimorphs
- Soitec, ASM Produce 300 mm sSOI Wafers
- IBM Utilizes Strained Germanium
- NEC Intros High-k, FUSI Gate
- Higher Power in AlGaN/GaN HEMTs
- LED Array Sets Output Record
- Laminate Passes Lead-Free Testing
- Tecan Offers Package Lids
- Kyma Adds GaN Substrates
- HRL Licenses InP MMIC Technology
- Halogen-Free Elastomer for Damping
- Ultrasmall Thick-Film Resistor
- MEC Intros Multilayer Actuators
- High-Brightness LEDs From Lumileds, Osram
- High-Brightness LEDs From Lumileds, Osram (Continued)
- InSb Quantum Well Transistors are Ultrafast
- Rohm Planning ZnO LEDs
- TECHNOLOGY INSIGHT
- Ceramic Dielectric Materials In Electronics and Telecommunications
- Antenna Technology
- Ceramic Properties
- Other Applications
- The Future
- Enhanced Sputtering Targets For MRAM Applications
- Buffer Layers Tantalum
- Free Ferromagnetic Layer
- AlOx Tunneling Barrier
- Other Layers
- Conclusion
- Wafer-Level Packaging Technology for On-Chip Passives
- Alternating Layers
- Increased Performance
- Conclusion
- LIST OF TABLES
- Table 1 GLOBAL SALES FORECAST OF E-WASTE MARKET, THROUGH 2009 ($
MILLIONS)
- Table 2 WORLDWIDE MARKET FOR POWER SUPPLY AND MANAGEMENT SEMICONDUCTOR
DEVICES AND POWER MANAGEMENT SOFTWARE FOR ELECTRONICS, THROUGH 2010 ($
MILLIONS)
- LIST OF FIGURES
- Figure 1 GLOBAL SALES FORECAST OF E-WASTE MARKET, 2002-2004 AND 2009 ($
MILLIONS)
|
Related Report
|
View Cart
