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Market Research Report

Chemical Mechanical Polishing (CMP) Equipment and Materials

Published by BCC Research Contact us : +1-860-674-8796
Published 2008/10 Content info 237 pages
Product code BC63233
Price From  US $ 4850 Order/Price list
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Description TOC

Abstract

SCOPE OF REPORT

This study provides an updated review of chemical mechanical polishing technology, including equipment and materials, and identifies current and potential applications for this technology.

BCC Research determines the current market status of chemical mechanical polishing, defines trends, and presents forecasts of growth over the next 5 years. Technological issues, including the latest process developments, are also discussed.

BCC Research analyzes the CMP industry on a worldwide basis from the standpoint of both manufacturing and consumption. In addition, the study examines commercial and public research activities in major regions of the world. Research objectives and areas of interest related to equipment, materials, and applications of chemical mechanical polishing are also outlined.

More specifically, BCC' s market analysis is divided into five parts.

In the first part, a historical review of the CMP process is provided, including an outline of recent events. In addition, the report supplies a revised and detailed description of a typical CMP process and of recent equipment and process upgrades. In this section, current and emerging applications of chemical mechanical polishing are also identified and divided by sector (i.e., electronics and optics).

The second part of the report entails a global market analysis of CMP equipment and materials. Current technical issues are described, followed by a review of related, recent technological developments and patent abstracts. Global revenues (sales data in M$) for CMP equipment and materials are presented by product type, application, and region, with actual data referring to the years 2006, 2007, and estimated data for the year 2008.

This section is completed by a presentation of market growth trends, based on industry growth, technological trends, and regional trends. Projected revenues for CMP equipment and materials are reported, with forecast CAGR (compound annual growth rate) for the period 2008 through 2013.

In the third part, covering global industry structure, the report provides a complete list of suppliers of CMP equipment and materials with a description of their products. The analysis includes a description of the geographical distribution of these firms and an evaluation of production versus consumption for CMP equipment and materials, always from a geographical standpoint. Detailed company profiles of the top industry players and relative market share for the five leading companies are also provided.

In the fourth part of this study, an analysis of industry competitiveness is performed. This analysis encompasses a review of global research and development activities, with profiles of the most important R&D players divided by region, and an outline of the most critical factors contributing to industry competitiveness.

The fifth and final section includes extensive U.S. patent analysis, with a summary of patents related to CMP equipment, materials, process, and applications, issued during the period 2006 through 2008. Patent analysis is performed by region, country, assignee, patent category, application, and material type.

METHODOLOGY and INFORMATION SOURCES

The technology section of this report is based on information derived from technical literature, related BCC' s reports, professional journals, author' s field experience, and online sources.

Global market analysis was performed by analyzing 85 manufacturers of equipment and materials used in chemical mechanical polishing, accounting for at least 95% of the global market. Data for each company were obtained by thoroughly analyzing SEC filings, internet web sites, annual reports, industry directories, industry magazines and catalogs, government sources, and other public sources.

Additional data were obtained from the direct contribution of primary sources, including: company executives, managers, engineers and other technical personnel representing manufacturers and developers of materials and equipment for chemical mechanical polishing; representatives of academia and trade associations; and industry market analysts.

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