Wireless M2M and Mobile Broadband Devices

Table of Contents

Table of Contents

List of Figures

Executive summary

1. Wireless M2M and mobile broadband data technology

• 1.1 Wireless and GPS chipsets
  • 1.1.1 Wireless chipsets
  • 1.1.2 GPS chipsets
• 1.2 Network communication technologies
  • 1.2.1 Short and medium range wireless network technologies
  • 1.2.2 Cellular mobile communication technologies
• 1.3 Wireless M2M data modules and terminals
  • 1.3.1 M2M data modules
  • 1.3.2 M2M terminals and devices
• 1.4 Mobile broadband modules and terminals
  • 1.4.1 PC cards and ExpressCards
  • 1.4.2 Embedded modules
  • 1.4.3 Desktop modems and routers

2. Wireless chipset and GPS vendors

• 2.1 Wireless chipset vendor profiles
  • 2.1.1 Agere Systems
  • 2.1.2 Analog Devices
  • 2.1.3 Freescale
  • 2.1.4 Infineon
  • 2.1.5 NXP Semiconductors
  • 2.1.6 Qualcomm
  • 2.1.7 Texas Instruments
• 2.2 GPS chipset and module vendor profiles
  • 2.2.1 Fastrax
  • 2.2.2 Global Locate
  • 2.2.3 SiRF
  • 2.2.4 Trimble
  • 2.2.5 u-blox

3.M2M module and terminal vendors

• 3.1 Siemens Wireless Modules
  • 3.1.1 Product strategy
  • 3.1.2 Market strategy
• 3.2 Wavecom
  • 3.2.1 Product strategy
  • 3.2.2 Market strategy
• 3.3 Motorola
  • 3.3.1 Product strategy
  • 3.3.2 Market strategy
• 3.4 Enfora
  • 3.4.1 Product strategy
  • 3.4.2 Market strategy
• 3.5 Telit
  • 3.5.1 Product strategy
  • 3.5.2 Market strategy
• 3.6 Kyocera Wireless
• 3.7 Sagem
• 3.8 SIM Technology
• 3.9 Wireless M2M terminal vendors
  • 3.9.1 Alpha Micro
  • 3.9.2 Blue Tree Wireless Data
  • 3.9.3 CalAmp
  • 3.9.4 Dr. Neuhaus
  • 3.9.5 Falcom
  • 3.9.6 Owasys
  • 3.9.7 Telesincro
  • 3.9.8 Telular
  • 3.9.9 BOX Telematics
  • 3.9.10 CI Omnibridge
  • 3.9.11 Cobra Automotive Technologies
  • 3.9.12 DigiCore
  • 3.9.13 MetaSystem
  • 3.9.14 Trackm8
  • 3.9.15 Trafficmaster
  • 3.9.16 Viasat
  • 3.9.17 WebTech Wireless

4.Mobile broadband vendors

• 4.1 Option
  • 4.1.1 Product strategy
  • 4.1.2 Market strategy
• 4.2 Novatel Wireless
  • 4.2.1 Product strategy
  • 4.2.2 Market strategy
• 4.3 Sierra Wireless
  • 4.3.1 Product strategy
  • 4.3.2 Market strategy
• 4.4 Ericsson
• 4.5 Huawei
• 4.6 Nokia
• 4.7 ZTE
• 4.8 Wireless broadband gateway and modem vendors
  • 4.8.1 4G Systems
  • 4.8.2 AnyDATA
  • 4.8.3 Digi International
  • 4.8.4 Sarian Systems
  • 4.8.5 Topex
  • 4.8.6 Zadako

5.Hardware and wireless data communication integration

• 5.1 Vehicle telematics
  • 5.1.1 OnStar
  • 5.1.2 Crown Telecom 24Horas vehicle telematics service
  • 5.1.3 The European eCall initiative
• 5.2 Utility metering and AMM
  • 5.2.1 Drivers and barriers for AMM in Europe and North America
  • 5.2.2 AMM infrastructure
  • 5.2.3 AMM system integration
• 5.3 WWAN connectivity for mobile computing
  • 5.3.1 Module integration process
  • 5.3.2 Key notebook and embedded module vendors
  • 5.3.3 Dell and Novatel Wireless

6. Worldwide market forecasts and trends

• 6.1 Wireless M2M market summary
• 6.2 Vehicle telematics
• 6.3 Utility meters
• 6.4 Retail and banking
• 6.5 Security systems
• 6.6 Other M2M applications
• 6.7 Embedded mobile broadband modules for notebooks and UMPCs

Glossary

List of Figures

• Figure 1.1: Examples of wireless module chipset vendors, by IC function
• Figure 1.2: Selection of GPS chipset, module and board vendors
• Figure 1.3: Examples of unlicensed radio bands worldwide
• Figure 1.4: Wireless technology range versus throughput
• Figure 1.5: Cellular wireless standards
• Figure 1.6: Cost versus time diagram for wireless technology integration
• Figure 1.7: Natural size wireless M2M modules
• Figure 1.8: Examples of M2M terminal vendors
• Figure 1.9: HSDPA PC card, PCI Express Mini Card and wireless desktop router
• Figure 2.1: Key wireless chipset vendors
• Figure 2.2: Examples of ADI' s wireless chipsets
• Figure 2.3: Examples of Freescale wireless platforms
• Figure 2.4: Examples of Infineon wireless ICs
• Figure 2.5: Examples of NXP wireless ICs
• Figure 2.6: Examples of Qualcomm wireless chipsets
• Figure 2.7: Examples of Texas Instruments wireless chipsets
• Figure 2.8: Fastrax iTrax MP OEM receiver modules
• Figure 2.9: Global Locate integrated GPS ICs
• Figure 2.10: SiRF chips for wireless applications
• Figure 2.11: Examples of Trimble GPS modules and tracking devices
• Figure 2.12: Low power, high sensitivity chip solutions from u-blox
• Figure 3.1: Principal cellular M2M communication module vendors
• Figure 3.2: Siemens range of wireless modules and terminals
• Figure 3.3: Open AT Software environment
• Figure 3.4: Wavecom range of wireless modules and terminals
• Figure 3.5: Motorola' s range of wireless modules
• Figure 3.6: Examples of Enfora' s range of wireless modules and terminals
• Figure 3.7: Telit range of CDMA/GSM/GPRS modules
• Figure 3.8: Sagem wireless M2M modules
• Figure 3.9: SIM Technology' s wireless modules
• Figure 3.10: CalAmp Skybility product overview
• Figure 3.11: Falcom GSM/GPRS product overview
• Figure 4.1: Wireless connectivity solution vendors for the mobile computing market
• Figure 4.2: PC card and PCI Express Mini Card embedded module
• Figure 4.3: Wireless connectivity device revenues (Worldwide 2006)
• Figure 4.4: Examples of Option' s wireless connectivity products
• Figure 4.5: Novatel Wireless' range of wireless embedded modules and ExpressCards
• Figure 4.6: Examples of Sierra Wireless embedded wireless modules and PC cards
• Figure 4.7: Huawei' s range of wireless modules and data cards
• Figure 5.1: Registered vehicles and annual sales, EU 23+2 and North America
• Figure 5.2: Sales of OnStar equipped vehicles and OnStar subscribers
• Figure 5.3: eCall establishment and lifecycle
• Figure 5.4: Household power consumption and retail prices (Europe and North America)
• Figure 5.5: Advanced metering penetration by state (USA 2006)
• Figure 5.6: Mixed multipoint and point-to-point AMM infrastructure
• Figure 5.7: Embedded module integration process
• Figure 5.8: Major notebook and wireless module vendors
• Figure 6.1 Worldwide wireless M2M module shipments forecast by application
• Figure 6.2: Wireless M2M module shipments by region (2006- 2011)
• Figure 6.3: Shipments of vehicle telematics units (2006- 2011)
• Figure 6.4: Shipments of wireless M2M modules for utility metering (2006- 2011)
• Figure 6.5: Shipments of wireless M2M modules for retail and banking (2006- 2011)
• Figure 6.6: Shipments of wireless M2M modules for security systems (2006- 2011)
• Figure 6.7: Shipments of wireless M2M modules for other segments (2006- 2011)
• Figure 6.8: Shipments of embedded notebook broadband modules (2006- 2011)
• Figure 6.9: Worldwide notebook and UMPC shipments and WWAN module attach rate