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Market Research Report

Future Handset Connectivity Technologies

Published by Berg Insight AB Contact us : +1-860-674-8796
Published 2008/06 Content info 100 PAGES
Product code BER69427
Price From  US $ 2250 Order/Price list
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Description TOC

Table of Contents

Table of Contents

List of Figures

Executive summary

1. Handset connectivity technologies

  • 1.1 Wireless communication technologies
    • 1.1.1 Personal area and local area network technologies
    • 1.1.2 Cellular mobile communication technologies
    • 1.1.3 Spectrum and interference
    • 1.1.4 Technical comparison
  • 1.2 Broadcast connectivity technologies
    • 1.2.1 Radio
    • 1.2.2 Mobile TV
    • 1.2.3 GPS
  • 1.3 Handset platforms and connectivity integration
    • 1.3.1 Handset hardware and software platforms
    • 1.3.2 Horizontal and vertical integration of connectivity technologies
  • 1.4 Single chip versus discrete chip integration
  • 1.5 Handset value-chain overview
    • 1.5.1 Cellular chipset vendors
    • 1.5.2 Connectivity chipset vendors
    • 1.5.3 Handset OS and software vendors
    • 1.5.4 Handset manufacturers
  • 1.6 Drivers and barriers to integration
    • 1.6.1 Bluetooth
    • 1.6.2 WLAN
    • 1.6.3 UWB
    • 1.6.4 NFC

2. Bluetooth in mobile phones

  • 2.1 Overview of the Bluetooth technology
    • 2.1.1 Bluetooth specifications
    • 2.1.2 Bluetooth applications and profiles
  • 2.2 Bluetooth and other connectivity technologies
    • 2.2.1 Bluetooth and FM radio
    • 2.2.2 Bluetooth and WLAN
    • 2.2.3 Bluetooth and GPS
    • 2.2.4 Bluetooth and cellular baseband integration
  • 2.3 Company profiles
    • 2.3.1 Broadcom
    • 2.3.2 CSR
    • 2.3.3 Infineon Technologies
    • 2.3.4 Qualcomm

3. Wireless LAN in mobile phones

  • 3.1 Overview of Wireless LAN
    • 3.1.1 WLAN standards
    • 3.1.2 WLAN in mobile phones
  • 3.2 WLAN and Bluetooth coexistence
  • 3.3 Company profiles
    • 3.3.1 Atheros Communications
    • 3.3.2 Marvell
    • 3.3.3 Nanoradio
    • 3.3.4 Redpine Signals
    • 3.3.5 STMicroelectronics and NXP wireless joint venture
    • 3.3.6 Texas Instruments

4. NFC and UWB technologies

  • 4.1 Overview of NFC and UWB technologies
  • 4.2 Near Field Communication technology and standards
    • 4.2.1 NFC modes
    • 4.2.2 NFC solution architecture and chipsets
  • 4.3 Ultra wideband technology and standards
    • 4.3.1 WiMedia Alliance
    • 4.3.2 Certified Wireless USB
  • 4.4 Company profiles
    • 4.4.1 Alereon
    • 4.4.2 Artimi
    • 4.4.3 Gemalto
    • 4.4.4 Innovision
    • 4.4.5 Inside Contactless
    • 4.4.6 NXP Semiconductors
    • 4.4.7 Realtek
    • 4.4.8 Sony
    • 4.4.9 Staccato Communications
    • 4.4.10 Wisair
    • 4.4.11 WiQuest Communications

5. Handset manufacturers

  • 5.1 Nokia
  • 5.2 Samsung Electronics
  • 5.3 Motorola
  • 5.4 Sony Ericsson
  • 5.5 LG Electronics
  • 5.6 Research In Motion
  • 5.7 HTC
  • 5.8 Second tier handset vendors
    • 5.8.1 Acer/E-TEN
    • 5.8.2 Apple
    • 5.8.3 ASUSTeK
    • 5.8.4 BenQ
    • 5.8.5 Fujitsu
    • 5.8.6 Gigabyte
    • 5.8.7 Hewlett Packard
    • 5.8.8 i-mate
    • 5.8.9 Mio Technology
    • 5.8.10 NEC
    • 5.8.11 Palm
    • 5.8.12 Panasonic
    • 5.8.13 Sagem
    • 5.8.14 Sharp
    • 5.8.15 Toshiba

6. Market trends and forecasts

  • 6.1 Market trends
  • 6.2 Worldwide handset sales
  • 6.3 Handset shipments by connectivity standard
  • 6.4 IC vendor market shares
  • 6.5 Connectivity IC shipment forecasts
  • 6.6 Connectivity IC revenue forecasts

Glossary

List of Figures

  • Figure 1.1: Range versus throughput for wireless communication technologies
  • Figure 1.2: Performance comparison
  • Figure 1.3: Mobile phone hardware and software platform
  • Figure 1.4: GPS handset and service value chain
  • Figure 2.1: Examples of Bluetooth profiles
  • Figure 2.2: Overview of key Bluetooth chipset developers for handsets
  • Figure 2.3: Examples of Broadcom connectivity chipsets
  • Figure 2.4: Examples of CSR connectivity chipsets
  • Figure 2.5: Examples of Infineon connectivity chipsets
  • Figure 2.6: Examples of Qualcomm GSM/EGPRS/HSDPA wireless chipsets
  • Figure 3.1: IEEE 802.11 WLAN standards
  • Figure 3.2: Overview of mobile WLAN chipset developers
  • Figure 3.3: Examples of Atheros Communications' connectivity chipsets
  • Figure 3.4: Examples of STMicroelectronics' connectivity chipsets
  • Figure 3.5: Examples of Texas Instruments connectivity chipsets
  • Figure 4.1: UWB spectrum and band groups
  • Figure 5.1: Tier 1 mobile phone and smartphone manufacturers (World 2007)
  • Figure 5.2: Nokia handset sales and market share
  • Figure 5.3: Nokia WLAN, GPS or NFC-enabled GSM/WCDMA handsets
  • Figure 5.4: Samsung handset sales and market share
  • Figure 5.5: Samsung WLAN enabled handsets
  • Figure 5.6: Motorola handset sales and market share
  • Figure 5.7: Motorola handsets with WLAN or GPS
  • Figure 5.8: Sony Ericsson handset sales and market share
  • Figure 5.9: LG handset sales and market share
  • Figure 5.10: RIM handset sales and market share
  • Figure 5.11: RIM BlackBerry smartphones
  • Figure 5.12: GPS and WLAN-enabled HTC handsets
  • Figure 6.1: Worldwide handset sales by technology (World 2006- 2012)
  • Figure 6.2: Number of handset models available by connectivity technology
  • Figure 6.3: Handset shipments by connectivity technology (World 2004- 2007)
  • Figure 6.4: Market shares, Bluetooth ICs for mobile phones (2007)
  • Figure 6.5: Market shares, WLAN ICs for mobile phones (2007)
  • Figure 6.6: Handset sales by connectivity technology and attach rates (World 2007- 12)
  • Figure 6.7: Connectivity solution revenues by technology (World 2007- 2012)
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