Report: Connector Technology Roadmap Report TOC

Overview

Report Purpose
Report Contents
Attached NEMI Roadmap Chapter Index
Connector Overview
Roadmap Definition
Industry Trends
Outsourcing
Major Trends - Systems 2003-2013
Major Trends - Packaging/Interconnect
Critical Areas for North America
Key Areas inferred from NEMI Roadmap
Acknowledgements

Chapter 1

Technology Roadmapping Process
Roadmapping Discipline
EMI Roadmap Process
Early Roadmapping Proponents - Intel Example
Example - IC Substrate Roadmap
Confidential Info
Time
Outline for a Connector Roadmap
Example - Memory Socket Roadmap
Roadmap Manuscript from Sandia Labs
Acknowledgements

Chapter 2

Connector Technology Review
Introduction
Separable vs. Hard Connections
Transition to Electronic Component
Key Technology Drivers
Key Areas for Connector Development
Roadblocks
High Performance packaging Impact
Intel BBUL Packaging Example
Parallel to Serial Busses
Generic High Speed Roadmap
Core Technology Competencies
Contact Physics
Micro-Contacts
Base Metals
Contacts & Plating
Plastics
Manufacturing & Assembly
Mfg Summary
Final Word
Acknowledgements

Chapter 3

Connector Roadmap Overview & Market
Scope
Definition
Market
Worldwide Connector Sales
Market Sector Increases/Decreases
Sales Performance Selected Markets
North American Decline in Mfg
Key Trends & Roadblocks
Key Dynamics
Taiwan IT Hardware
Response to Offshore Mfg
Summary of Possible Actions
Summary of Connector Trends by Type
Connector Trends Table
Key Issues by Type
Other Key Points
Connector Background
Definition
Connector Applications Illustration
Market Dynamics
World Market 1999-2003
Share by Market
Outsourcing Phenomenon
Barriers to North American Mfg
Offshore Movement of Connector Mfg
Incentives to Relocate
World Connector Market Forecast Scenarios 2003-2013
World and Regional Connector Market Roadmap 2002 - 2013 $
Acknowledgments

Chapter 4

Connector Technology Roadmap
Connector Technology
Electro-Mechanical Connection
Transition to Electronics
General Roadmap Trend
Key Technology Roadblocks
Parallel to Serial
Precursor to Fiber
Generic High Speed Roadmap
High Speed Barriers
Core Competencies
Importance
Micro-Contacts & MEMS
Base Metals
Metal Fabrication
Plating Technology
Substrate Plating
Tin Plating
Precious Metal
Pb-Free Soldering
Pb-Free Alloys
Lubricants
Polymers
Manufacturing
Insert Molding
Dual Injection Molding
Connector Assembly
Major Trends
Odd-Shape Component Placement
Automation
Automation Definitions
Automation Levels
Philosophy of Automation
Historical Model
Influence of Outsourcing
China Manufacturing
Electronic Assembly by Region
China Mfg by Market Segment 2001-2006
Mfg Summary
Acknowledgements

Chapter 5

Connector Roadmaps
Generic PC Board Connectors
Connectorized Backplanes
High Speed Transmission Issues
Transmission Lines
Characteristic Impedance
Cross-Talk
Moore' Law
Differential Signaling
Skin Effect
High Speed Connector Impact
Connector Density by Type
Speed vs. Density
Performance Measurement Systems
Near End Cross-Talk
TDR
S-Parameters
Eye Plots
Spice Analysis
3D Field Solvers
Test Boards
Software
Test Documentation
Effects of Telecom & IT Downturn
Connector Attachment Technology
Board Designs for Press-Fit
Global B/P PWB Technology
Increased layer Count & Board Thickness
Board Size
Through Hole B/P Board Size
Aspect Ratios
Surface Finishes
Press-Fit Limitations
Limits of Technology - Press-Fit
PWB Materials
GHz Speeds
Common B/P Architectures
Traditional
Card Cage
Mid-Plane
Orthogonal
Industry Standards
Industry Stds. Backplanes
Surface Mount
Limits to Introduction of New Technology
Impact of SMT Connector Design
Printed Circuit Board Design & Fabrication
Emerging Technology - Beyond 10GHz
- Internally Shielded Connectors
- Low Loss Laminates
- Microvia
- Paradigm Shift: ASIC Noise Control
- Adaptive Equalizers
- Driver & Receiver Technology
Market Forecast Gb Backplane Connectors
Miniature Backplane Systems
Optical Backplane Systems
Discrete Fiber
Polymer Waveguides
Flexible Glass
Barriers to Implementation
Shift to Offshore Mfg
Captive vs. Outsourced Backplane Assembly
Pricing Trends
Connectorized B/P Roadmap
Power Connectors
Anatomy of a Power Contact
Power Connector Performance Criteria
Hot Swap Performance
Power Categories
Power Capacity
Configuration
Form Factor
Ratings
Parameter Roadmap
Power/Heat Reduction Efforts
Thermal Management
Bus Bars
World Forecast of Electronic Power Connectors 2002-2007
Power Connector Forecast by Market
Mezzanine Connectors
Flex, Pad, other High Performance
High Perf. Stacking Connector Roadmap
Rt. Angle High Perf. Stacking Connector Roadmap
IC Sockets
PGA Sockets
PGA Barriers
LGA Sockets
LGA Barriers
Universal Socket Technology
Memory Sockets
Memory Socket Roadmap
Memory Socket Barriers
Test & Burn-In Connectors
Test
Multiple Package Test
Wafer Scale
Pad Pitches
Burn-In
Key Points
Reduction - Elimination of Burn-In
Costly Solutions
Acknowledgements

Chapter 6

NEMI Roadmap Trends
Automotive
Defense Systems
Board Assembly
Board Assembly Roadmap
Consumer Electronics
Consumer Product Attributes
Digital Silicon
On-Chip Interconnects
Si Chip-Package Roadmap
Displays
Market Shares of Various Display Technologies
Energy Storage
Energy Storage Market Dynamics
Battery Applications
Environmental Electronics
Final Assembly
Needs from NEMI Analysis of Final Assembly
Interconnect Substrates PWBs
PWB Manufacturing
Inorganic Substrates
LTCC Substrates
Large Business Systems
Mass Data Storage
World Market - Disk Drives
Modeling, Simulation & Design Rules
Electro-Optics
Optical Module Revenue
Conceptual EO Packaging
Packaging
Peripheral Bus Speed
Package IO Count
Passive Devices
IPD Usage +/-
Portable Products
Portable Roadmap & Connector Content
Key Parameters for Handheld Devices
RF Components
Thermodynamics
Notebook Power Dissipation Example
Acknowledgements