Table of Contents
Executive Summary
- S.1 Findings
- S.2 Forecast
- S.3 Market Trends
- S.4 Technology Trends
- S.5 Product Roadmaps
- S.6 Categories
- Tables
- S.1 Connector Barriers
- S.2 Industry Trends 1985-2015
- S.3 Industry Trends ? Bar Chart
- S.4 Sales by Market 1999-2009
- S.5 Mech. Parameters
- S.6 IC Socket Roadmap Example
Overview
- O.1 Introduction
- O.1 Interconnect Level
- O.2 Market Segments
- O.3 Connector Designs
- O.4 Business Forces
- O.5 Roadmap
- O.6 Industry Trends
- O.7 Outsourcing
- O.8 Major Trends
- O.9 Critical Areas NA, EU, JP
- O.10 US Gov Initiatives
- O.11 NEMI Roadmap
Chapter 1 - Technology Trends:
- 1.1 Connectors vs Other Comp.
- 1.2 Connecting Circuits
- 1.3 Electrical vs Electronic
- 1.4 Simpler Technology
- 1.5 Industry Standards
- 1.6 Electronics Technology
- 1.7 Moore's Law
- 1.8 Applications
- 1.9 Core Technologies
- 1.10 Mfg trends
- 1.11 Technology Roadblocks
- 1.12 Key Areas for Development
- 1.13 Key Takeaways
- Tables
Chapter 2 - Technology Road Mapping
- 2.1 What is a Roadmap
- 2.2 Roadmap Examples
- 2.3 Why Roadmap Long Term
- 2.4 Trade Secret Issues
- 2.5 Best Use of Roadmaps
- 2.6 Fundamentals of Road Mapping
- 2.7 Solving Real Problems - iNEMI
- 2.8 Connector Roadmap Outline
- 2.9 Sandia Labs Report
- Tables
- 2.1 Packaged MPU Chips
- 2.2 Processor Socket Roadmap
- 2.3 MPU Roadmap
- 2.4 Portable Sys Connector Roadmap
- 2.5 Memory Socket Example
Chapter 3 - Industry Trends
- 3.1 Scope
- 3.2 Definition
- 3.3 Market Characteristics
- 3.4 Future Market Characteristics
- 3.5 Market Size & Scope
- 3.6 Regional Mix
- 3.7 Long Term Growth Rates
- 3.8 IC vs Connector Market Performance.
- 3.9 Connector Markets 2004, 2009
- 3.10 Market Segment Trends
- 3.11 Regional Dynamics
- 3.12 Engineering Location Trends
- 3.13 Survey - Key Roadmap Trends
- 3.14 Key Trends & Roadblocks
- 3.15 Summary of Connector Trends
- 3.16 Other Key Points
- 3.17 Connectors in Wireless World
- 3.18 Connector Background
- 3.19 Outsourcing
- 3.20 Barriers to North Amer. Mfg
- 3.21 Forecast Scenarios 1985-2015
- Tables
- 3.1 Worldwide Connector Sales 2004-5
- 3.2 Connector Sales by Region 2005
- 3.3 % - 5 Yr Increments 1980-2010
- 3.4 $ - 5 Yr Growth Rates 1980-2005
- 3.5 $ 35 Yr Growth Cyclical 1980-2015
- 3.6 World Semi vs Connector Revenues
- 3.7 Industry Sales Performance. '95-05
- 3.8 Semi vs Connector Yr-Yr Change
- 3.9 Yr-Yr Change by Month
- 3.10 Connector Markets 2004
- 3.11 Connector Markets 2009
- 3.12 Sales Performance by Market 1999-2009
- 3.13 Global Sales by Market 1999-2009
- 3.14 Market Trends 01-05 vs. 05-09
- 3.15 Trends in OEM Markets
- 3.16 Taiwan IT Hardware Prod. in China
- 3.17 % Connector Engrg by Region
- 3.18 Roadmap Trends ? Survey Results
- 3.19 Mechanical Parameters 1985-2015
- 3.20 Connector Type Summary
- 3.21 Key Issues by Type
- 3.22 WiFi Bluetooth Penetration '05-'10
- 3.23 Offshoring of NA Assy 2000-'15
- 3.24 1985-2015 Forecast - Optimistic
- 3.25 1985-2015 Forecast ? Nominal
- 3.26 1985-2015 Forecast - Recession
- 3.27 Forecasting Turbulence
- 3.28 Forecasting Paradigms
Chapter 4 - Product Roadmaps
- 4.1 Test Sockets
- 4.2 Burn-In Sockets
- 4.3 IC Sockets for Production
- 4.4 Memory Sockets DIMM
- 4.5 Memory Sockets SODIMM
- 4.6 Intel Motherboards
- 4.7 Memory Card Receptacles
- 4.8 PCB Connectors ? PCI Express
- 4.9 PCB New Card/Express Card
- 4.10 Generic PC Board Connectors
- 4.11 Min Wire-to-Board FEC/FPC
- 4.12 Other WTB Connectors
- 4.13 Min Board Stacking
- 4.14 2mm Backplane Connectors
- 4.15 High Performance. Backplane Conn.
- 4.16 Fiber Optic Connectors
- 4.17 RF Coaxial Connectors
- 4.18 Electronic Power Connectors
- 4.19 PCB Terminal Blocks
- 4.20 IEC/NEMI Terminal Blocks
- 4.21 RJ11-45 IO Connectors
- 4.22 Ind. Ethernet Connectors
- 4.23 Automotive Connectors
- 4.24 USB/IEEE1394 IO Connectors
- 4.25 WiFi Bluetooth Penetration
- 4.26 More on Backplanes
- Tables
- 4.1 Test Sockets
- 4.2 Burn-In Sockets
- 4.3 IC Sockets for Production
- 4.4 Memory Sockets DIMM
- 4.5 Memory Sockets SODIMM
- 4.6 Intel Motherboards
- 4.7 Memory Card Receptacles
- 4.8 PCB Connectors ? PCI Express
- 4.9 PCB New Card/Express Card
- 4.10 Generic PC Board Connectors
- 4.11 Min Wire-to-Board FEC/FPC
- 4.12 Other WTB Connectors
- 4.13 Min Board Stacking
- 4.14 2mm Backplane Connectors
- 4.15 High Performance. Backplane Conn.
- 4.16 Fiber Optic Connectors
- 4.17 RF Coaxial Connectors
- 4.18 Electronic Power Connectors
- 4.19 PCB Terminal Blocks
- 4.20 IEC/NEMI Terminal Blocks
- 4.21 RJ11-45 IO Connectors
- 4.22 Ind. Ethernet Connectors
- 4.23 Automotive Connectors
- 4.24 USB/IEEE1394 IO Connectors
- 4.25 WiFi Bluetooth Penetration
- 4.26 Industry Standards - Backplanes
- 4.27 Impact of SMT
- 4.28 Market Forecast 2001-2006
- 4.29 Captive vs Outsourced Backplanes
- 4.30 Backplane Pricing Trend
- 4.31 Connectorized BP Roadmap
Chapter 5 - Forecast
- Tables
- 5.1 1985-2015 Forecast - Optimistic
- 5.2 1985-2015 Forecast - Nominal
- 5.3 1985-2015 Forecast - Recessionary
- 5.4 1985-2015 Comparisons
- 5.5 1985-2015 Cyclical Growth
- 5.6 Market Segment Performance. 2000-05
- 5.7 Market Segment Performance. 2005-10
- 5.8 Market Segment Performance. 2010-15
Chapter 6 - Electronics Market Roadmap
- 6.1 World Economic Trends
- 6.2 Automotive
- 6.3 Aerospace/Defense Systems
- 6.4 Board Assembly
- 6.5 Consumer Electronics
- 6.6 Digital Silicon
- 6.7 Displays
- 6.8 MEMS/Micro-Interconnect
- 6.9 Energy Storage - Batteries
- 6.10 Environmental Electronics
- 6.11 Final Assembly
- 6.12 Interconnect Substrates - PCBs
- 6.13 Interconnect Substrates ? Ceramic
- 6.14 Large Business Systems
- 6.15 Mass Data Storage
- 6.16 Modeling Simulation Design Tools
- 6.17 Fiber Optics
- 6.18 Electronic Packaging
- 6.19 Passive Devices
- 6.20 Portable Products
- 6.21 Thermodynamics
- Tables
- 6.1 GDP + Exchange Rates 2003-05
- 6.2 Per Capita Incomes 2005
- 6.3 China Auto Exports 2000-2010
- 6.4 Selected PCB Parameters 2003-15
- 6.5 NA & World Consumer 2002-14
- 6.6 Package Attributes 2003-15
- 6.7 CE Market Segments 2005-15
- 6.8 Top 20 Worldwide OEMs
- 6.9 Cell Phone Shipments 2002-15
- 6.10 On Chip Interconnects 2003-15
- 6.11 Chip Package Roadmap 2001-15
- 6.12 Semicon vs Connector $ 1980-15
- 6.13 Industry Sales Performanceorm. 1995-05
- 6.14 Display Market 2005-10
- 6.15 Battery Market Dynamics
- 6.16 Environmental Needs
- 6.17 Current PCB Mfg Capability
- 6.18 HDD Market 2005
- 6.19 Areal Density 1970-2010
- 6.20 Simulation Focus Areas
- 6.21 Periph Bus Speed 2005-15
- 6.22 IC Package IO Count 2005-15
- 6.23 IPD Features
- 6.24 Portable Roadmap 2003-15
- 6.25 Notebook PC Wattage
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