World IC Socket Market

Table of Contents

Chapter 1 - The World IC Socket Connector Market

• IC Socket Connectors By Region (2006-2011)
• IC Socket Connectors By Market (2006-2011)
• IC Socket Market Size for Two Major Categories and Their Sub Categories
• 2006 IC Socket Sales - by Region by Product Line
• Major Manufacturers Of IC Socket Connectors
• Top Five IC Socket Manufacturers
• Tyco Electronics - 12%
• Molex Incorporated - 10.8%
• Foxconn (Hon Hai) - 3.5%
• FCI - 2.6%
• 3M - 1.9%
• Manufacturers Whose Major Focus is IC Sockets
• Aries Electronics - Test & Burn-in Sockets
• Chupond Precision Co. Ltd - Production Sockets
• Enplas Semiconductor Peripheral Corporation - Test & Burn-in Sockets
• Johnstech International - Test & Burn-in Sockets
• Loranger International Corp - Test & Burn-in
• Mill-Max - Test & Burn-in and Production Sockets
• Plastronics Socket Company - Test & Burn-in Sockets
• Sensata Technologies -Test & Burn-in Sockets
• Win Way Technology Pvt Ltd. - Test & Burn-in
• Yamaichi - Test & Burn-in and Production
• Worldwide List of IC Socket Manufacturers

Chapter 2 - IC Socket Connectors - Business And Technology Trends|

• IC Performance
• IC Device Packages
• Reasons For IC Sockets
• Economics of IC Socket Use
• IC Sockets as a Tool in Electronic Assembly
• IC Sockets Create Flexibility
• IC Sockets are Widely Used
• Business And Economic Considerations
• Our Electronics World
• International Expansion of the Global Market for IC Sockets
• Response From Countries Outside the US
• International Expansion of Electronic Companies Design Centers
• Proliferation of IC Socket Suppliers
• Mergers and Acquisitions
• Intellectual Property, a Key to IC Socket Development
• Small Companies Respond to Specialized Requirements
• Production Sockets Versus Test and Burn-in Sockets
• General
• The Necessity of Rapid Response for Test and Burn-in Applications
• Profitability in the IC Socket Market
• Technology Trends
• General
• The Affect of RoHS Requirements on IC Socket Manufacturers
• RoHS Compliance Not Universal
• ROHS Compliance Changes Processes and Products
• Standards Organizations
• Variations in Contacts and Interconnection Methods
• Move to Surface Mounting:
• Continued Need for More Connections
• Improved Performance Affects IC Packages
• The Trend to Test Multiple Devices at Once
• Life Cycle Performance Considerations
• Factors Affecting Cycles
• Metal Plating
• Contamination and Degradation
• Test Board Considerations
• Alignment
• Summary of Life Cycle Consideration
• Types of IC Sockets
• Single In-Line, SIP Sockets
• Dual In-Line, DIP Sockets
• QFP, Quad Flat Pack Sockets; PQFP, Plastic Quad Flat Pack Sockets; TQFP, Thin Quad Flat Pack Sockets
• QFN IC Sockets
• SOIC, Small Outline IC Sockets
• LCC, Leaded Chip Carrier and PLCC, Plastic Leaded Chip Carrier Sockets
• SOJ, Small Outline J-Lead Sockets
• Memory Module Sockets
• PGA, Pin Grid Array Sockets
• BGA, Ball Grid Array Sockets
• Coplanarity Issues
• Alignment Issues
• Fine Pitch Demands Superior Performance
• Custom Sockets Develop Into Standard Versions
• Styles of BGA Sockets
• Photos courtesy of E-Tec Interconnect
• Sockets Combine with Adapters
• BGA Sockets for Production Testing
• LGA, Land Grid Array Sockets
• Custom IC Sockets
• New and Future Trends in IC Sockets
• Future Trends
• Summary

Chapter 3 - IC Sockets - World Market By Region & Product Line

• North American IC Socket Market
• European IC Socket Market
• Japanese IC Socket Market
• Chinese IC Socket Market
• Asia/Pacific IC Socket Market
• ROW IC Socket Market
• Total IC Socket Market