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Market Research Report

Connector Imperatives to Support Next Generation Electronic Equipment

Published by Bishop & Associates, Inc. Contact us : +1-860-674-8796
Published 2008/01 Content info 159 pages
Product code BS59580
Price From  US $ 3500 Order/Price list
US $ 3500 Hard Copy
US $ 3850 Hard Copy + 1 Additional Print Copy
US $ 4550 PDF on CD-ROM (Multi-User Corporate License) & Hard Copy
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Description TOC

Table of Contents

Chapter 1 - Report Scope And Methodology

  • Methodology and Approach
  • Data Collection Forms:
  • Connector Imperatives to support Next Generation Electronic Equipment
  • Connector User
  • Connector Imperatives to support Next Generation Electronic Equipment
  • Connector Manufacturer

Chapter 2 - Introduction

Chapter 3 - Current Connector Technology

  • Universal Attributes of Future Connectors
  • Lead-Free Electronic Assemblies
  • Complete Families of Connectors
  • Multiple Sourced Connectors
  • High-Speed Performance Headroom
  • Accurate Performance Data and Models
  • Renewed Interest In The Use Of Alternative Card Architecture Including Mezzanine
  • And Midplane Configurations.

Chapter 4 - Connector Attributes, Computer, Telecom Markets

  • Computer / Telecom Industry
  • Connector Attribute: Increased Signal Density
  • Connector Industry Response
  • Increased Signal Density
  • Computer / Telecom Industry
  • Connector Attribute: Increased High-Speed Performance
  • Connector Industry Response
  • Increased High-Speed Performance
  • Computer / Telecom Industry
  • Connector Attribute: Improved Power Connectors
  • Connector Industry Response
  • Improved Power Connectors
  • Computer / Telecom Industry
  • Connector Attribute: Increased Connector Robustness
  • Connector Industry Response
  • Increased Connector Robustness
  • Computer / Telecom Industry
  • Connector Attribute: Standards Driven Interfaces
  • Connector Industry Response
  • Standards Driven Interfaces
  • Computer / Telecom Industry
  • Connector Attribute: Connectors Optimized for Orthogonal Midplanes
  • Connector Industry Response
  • Connectors Optimized for Orthogonal Midplanes
  • Computer / Telecom Industry
  • Connector Attribute: Improved Differential Skew Control
  • Connector Industry Response
  • Improved Differential Skew Control
  • Computer / Telecom Industry
  • Connector Attribute: High performance / Density Fiber Optic Connectors
  • Connector Industry Response
  • High performance / Density Fiber Optic Connectors
  • Computer / Telecom Industry
  • Connector Attribute: Increasing Use of Flex Interconnects
  • Connector Industry Response
  • Increasing Use of Flex Interconnects

Chapter 5 - Connector Attributes, Automotive

  • Automotive Market
  • Automotive Industry
  • Connector Attribute: Compliant Pin, Surface Mount and Compressive PCB Termination
  • Connector Industry Response
  • Compliant Pin, Surface Mount and Compressive PCB Termination
  • Automotive Industry
  • Connector Attribute: Lower Mating Force Connectors
  • Connector Industry Response
  • Lower Mating Force Connectors
  • Automotive Industry
  • Connector Attribute: Greater Variety Of Consumer Accessible Interfaces
  • Connector Industry Response
  • Greater Variety Of Consumer Accessible Interfaces
  • Automotive Industry
  • Connector Attribute: Low Cost Filtered Connectors
  • Connector Industry Response
  • |Low Cost Filtered Connectors|
  • Automotive Industry
  • Connector Attribute: “Integrated Connectors”
  • Connector Industry Response
  • “Integrated Connectors”
  • Automotive Industry
  • Connector Attribute: Increased use of Shielded and Coaxial Connectors
  • Connector Industry Response
  • Increased use of Shielded and Coaxial Connectors
  • Automotive Industry
  • Connector Attribute: Fiber Optic Connectors
  • Connector Industry Response
  • Fiber Optic Connectors
  • Automotive Industry
  • Connector Attribute: Standards Driven Interfaces
  • Connector Industry Response
  • Standards Driven Interfaces
  • Automotive Industry
  • Connector Attribute: Hybrid Connectors
  • Industry Response
  • Hybrid Connectors

Chapter 6 - Additional Issues

  • Protection Of Intellectual Property In The Global Marketplace
  • Impact of Wireless Technology on Copper Interfaces
  • Differential Impedance Changing From 100 to 85 ohms
  • Global Migration of System Design
  • Nanotechnology in Connector Fabrication
  • Connectors With Integrated ESD Protection
  • Non-Traditional Interfaces
  • Connections to Non-Conventional Materials

Chapter 7 - Connector Market Values

  • World Computer / Peripheral Connector Market By Geographic Region
  • World Telecom / Datacom Connector Market By Geographic Region
  • World Automotive Connector Market By Geographic Region
  • Market Forecast by Region of the World
  • Computer / Peripheral Connector Market Forecast
  • Computer / Peripheral Connector Market Share by Region - 2006
  • Computer / Peripheral Connector Market Share by Region - 2011
  • Telecom / Datacom Connector Market Forecast
  • Telecom / Datacom Connector Market Share by Region - 2006
  • Telecom / Datacom Connector Market Share by Region - 2011
  • Automotive Connector Market Forecast
  • Automotive Connector Market Share by Region - 2006
  • Automotive Connector Market Share by Region - 2011

Chapter 8 - Major Findings And Conclusions

  • Computer and Telecom Markets
  • Key ConsiderationsCost Drivers
  • Compressive Connectors
  • Resistance to Change
  • Gb/s Performance
  • Surface Mount
  • Scalability
  • Performance Headroom
  • Orthogonal Midplane Connectors
  • Industry Standards
  • Technical Support
  • Wireless Technology
  • Connector Content Value
  • Offshore Migration
  • Connector Technical Support
  • IP Protection
  • Mezzanine Connectors
  • Connector Support Tools
  • Performance Comparison
  • High-Speed Channel Metrics
  • 85-Ohm Differential Impedance
  • Increased Pin Density
  • Automotive Market
  • Key Consideration
  • Expanding Electronic Applications
  • EMI/ESD Connectors
  • Compliant Pin & Surface Mount Termination
  • Optic Connectors
  • Second Source
  • Consumer Interfaces
  • Connector Integration
  • General Observations
  • Environmental Standards
  • Industry Standards
  • Flex Circuitry
  • Nano Technology
  • Second Source Imperative
  • Emerging Markets
  • Incremental Advances
  • Continuing Trends

Appendix - Connector Definitions, Acronyms And Technologies

  • Ambient Temperature
  • Ampere
  • Anti-pad
  • ATCA
  • Attenuation
  • Bandwidth
  • BGA
  • Bit Error Rate
  • Blindmate Connector
  • BOM
  • Breakdown Voltage
  • Broadside Coupled
  • Bulk Resistance
  • Capacitance
  • Characteristic Impedance
  • Clearance Distance
  • Conductivity
  • Constriction Resistance
  • Contact Resistance
  • COTS
  • Creepage Distance
  • Crosstalk
  • Current
  • Current Rating
  • DC
  • D-to-D Converter
  • De-emphasis
  • Derating
  • Dielectric
  • Dielectric Constant
  • Distributed Power Architecture
  • Differential Signaling
  • Dry Circuit Resistance
  • Edge Coupled
  • EMC
  • EMI
  • EMS
  • EYE Patterns
  • GBIC
  • Heat Sink
  • Hot Swap
  • Inductance
  • Insertion Loss
  • Intersymbol Interference
  • I/O
  • Jitter
  • Joule
  • LAN
  • LGA
  • Loss Tangent
  • MEMS
  • Microstrip
  • MSA
  • N+1 Redundancy
  • Normal Force
  • ODM
  • OEM
  • Ohm
  • Ohm' s law
  • Operating Temperature
  • Parallel Signaling
  • PCB
  • Power
  • Propagation Delay
  • PTH
  • PICMG
  • PMC
  • Reflections
  • Resistance
  • Risetime
  • RoHS
  • S Parameter
  • SERDES
  • Serial Signaling
  • SFP
  • SIG
  • Signal Integrity
  • Single Ended Signaling
  • Skew
  • Skin Effect
  • Smith Chart
  • SPICE
  • Stripline
  • Supertemperature
  • Surge / inrush current
  • TDR
  • Telematics
  • Thermal Runaway
  • Transmission Line
  • VME
  • VoIP
  • Volt (V)
  • Watt
  • WiMax
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