Abstract
Bishop and Associates, Inc. has just released a new 13-chapter research report
providing a complete analysis of Evolving High-Speed Connectors. This new
report details backplane, midplane, and high-speed backplane cable assemblies.
Connector values are provided for each category for the years 2007, 2008,
2009, and 2013, as well as region of the world.
Connectors designed to operate in multi-gigabit applications have proliferated
over the past four years providing system designers greatly expanded
interconnect options and performance levels. Advances in connector as well as
signal conditioning technology have pushed interface bandwidth from 3 Gb/s to
20+ Gb/s, with at least one supplier introducing a 40 Gb backplane connector.
This market research report addresses the many aspects of the high-speed
interconnect market from what is driving demand for faster channels, to
defining the key characteristics of the leading connector families that are
currently available. Detailed market estimates and forecasts extending to
2013 for backplane and cable connectors by application and region of the world
are featured.
A variety of factors associated with high-speed channels have a major
influence on their behavior. Chapters are devoted to reviewing related system
elements including driver and receiver technology, printed circuit board
materials, as well as channel modeling, and performance measurement systems.
A new chapter focused on innovation provides examples of new creative
approaches to addressing some of the challenges associated with
interconnection and packaging of next generation electronic equipment.
This market research report also includes several tutorial chapters on
connector and high-speed design issues that enable a non-technical reader to
gain from the information provided.
Technology
Bandwidth demands are increasing resulting in greater challenges to satisfying
signal integrity requirements. At the same time packaging density puts more
contacts in closer proximity to each other creating potential for increased
crosstalk and signal degradation.
Systems consume more power that generates more heat. Connectors must be
designed to support power / thermal management schemes.
Emerging standards such as the Intel Quick-Path Interconnect are driving
changes in both current as well as future high-speed connectors and have
implications for every element in the channel.
High-speed copper cable assemblies that incorporate passive or active
equalization techniques are expanding the anticipated practical bandwidth and
length limitations of just a few years ago.
Designing 6 Gb/s channels is not a trivial issue, causing engineers to rely on
their chosen connector vendor to provide extensive selection and design
support 24/7 on a global basis.
Connector manufacturers are working closely with suppliers of driver and
receiver chips to demonstrate performance in faster and longer channels.
Connector Market
Connector users want a clear performance migration path to support,
anticipated bandwidth needs of their next generation equipment. This is
driving connector manufacturers to provide multi-tiered product families that
can enable product upgrades without changing product families or even PCB
circuit layout.
Reliance on a single source for critical components is no longer acceptable.
High-speed connector manufacturers have responded by cross-licensing many of
their flagship product families to product mechanically and electrically
identical interfaces. This process has allowed each supplier to offer a broad
range of products at market driven prices.
The market has stratified with a select group of highly competitive connector
suppliers offering a full range of state-of-the-art interconnects. A
secondary tier is focused on supporting individual segments of the market that
requires less technical resources and / or may offer a quicker return on
investment.
The pace of new connector induction has been exceptional over the past two
years, with more products in the development pipeline. Many of these new
interfaces are benefiting from better understanding of the behavior of
high-speed signals resulting in the refinement of the connector and its PCB
launch.
This market research report is the third in a continuing series of
investigations of this highly dynamic product segment. The advancement of
this technology together with experience gained in designing these unique
interfaces may set the stage for the evolution of all types of next generation
electronic connectors. Those suppliers who have consistently made the
necessary investment in resources to develop this expertise may emerge as the
only viable suppliers capable of supporting future application requirements.
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