Abstract
Bishop and Associates, Inc. has just released a new 12-chapter, 214 page
research report providing a complete analysis of evolving high-speed mezzanine
connectors. Current connector market values and forecasts are provided by
bandwidth, region of the world, and end user market for the years 2007, 2008,
2009, and 2013.
Mezzanine architecture offers significant packaging advantages. System
density has become a critical issue for circuit designers and can be increased
by utilizing the space between daughtercards. Products can be effectively
partitioned to provide pluggable modules simplifying repair, customization and
upgrading. Printed circuit board routing issues can be simplified and layer
count reduced by spreading functions over larger board surface areas.
Industry demand for faster processing speeds have resulted in the transition
from single ended to high-speed serial differential signaling. This
conversion has required the upgrading of every element in the channel
including connectors. New mezzanine connectors have been introduced that are
designed to support differential signaling at speeds of up to 20 Gb/s. This
report reviews the leading high-speed mezzanine connectors now available on
the market, and provides detailed mechanical and electrical characteristics of
each product.
A variety of factors associated with high-speed channels have a major
influence on their behavior. Chapters are devoted to reviewing related system
elements including driver and receiver technology, printed circuit board
materials, as well as channel modeling, and performance measurement systems.
A new chapter focused on innovation provides examples of creative approaches
to addressing some of the challenges associated with interconnection and
packaging of next generation electronic equipment.
This market research report also includes several tutorial chapters on
connector and high-speed design issues that enable a non-technical reader to
gain from the information provided.
Technology
The level of technical support necessary to participate in the multi-gigabit
mezzanine connector market is exceptional and has become nearly as important
in the interface selection process as the performance of the interface itself.
The equipment and experience necessary to accurately document their
performance, as well as creating verified simulation models require
experienced expertise that takes years to develop.
Electronic systems are consuming more power resulting in the need to develop
elaborate thermal management schemes. Mezzanine connectors can either
increase the challenge or contribute to the solution. Several mezzanine
connectors have incorporated features that aid in transferring heat out of the
system. At least one new mezzanine connector family includes optional power
contacts.
Leading connector manufacturers have implemented a series of incremental
improvements that have boosted the published performance of their leading
backplane and mezzanine connectors. These advances together with significant
improvements in signal conditioning including equalization and pre-emphasis
have enabled connector bandwidth to keep pace with system demands.
Connector manufacturers who have developed expertise in the design and
manufacturer of high-speed connectors as well as established extensive
engineering support service departments have resulted in a stratified market
of industry leaders and those who may not be able to replicate these advanced
interfaces.
Designing 6+ Gb/s channels is not a trivial issue, causing many engineers to
rely on their chosen connector vendor to provide extensive product selection
and design support 24/7 on a global basis. Many of these new interfaces are
benefiting from better understanding of the behavior of high-speed signals
resulting in the refinement of the connector and its PCB launch.
Time domain test methods are being supplemented with frequency domain
S-parameter data to quantify the signal integrity of a channel.
The need for increased system packaging density has become a critical design
objective. Connector manufacturers are finding ways to design new mezzanine
connectors with contact pitch as close as 0.4mm with the ability to conduct
multi-gigabit signals.
Connector Market
Design engineers often prefer to utilize one interconnect system throughout
the product. Connector manufacturers have responded with complete
interconnect families that often include backplane, mezzanine and related
cables. Designers are able to understand the quirks of one connector type and
develop a close working relationship with a single supplier.
Commitment to a single interconnect family can present problems in insuring
adequate supply and market prices. Manufacturers of backplane connectors have
been establishing cross-licensing agreements to address this concern. Sole
sourcing has traditionally been less of a concern for mezzanine connectors,
but recent agreements on dual sourcing of the Samtec SeaRay, Hirose IT-3, and
Tyco Electronics STRADA Mesa connectors may portend a new direction.
The market has stratified with a select group of highly competitive connector
suppliers offering a full range of state-of-the-art interconnects. A
secondary tier of connector manufacturers are focused on supporting individual
segments of the market that requires less technical resources and / or may
offer a quicker return on investment.
Formal standards organizations as well as special interest groups are
developing a large number of specifications that define specific mezzanine
connectors. Many of these new standards have been introduced to support
high-speed serial signaling. There are advantages and challenges associated
with proliferation of overlapping specifications.
Mezzanine connectors tend to introduce less high-speed signal distortion than
backplane connectors making their design somewhat easier for second tier
connector suppliers to enter the market.
The current global economic recession has raised some serious questions about
the adoption rate of new high-speed mezzanine connectors. Leading connector
manufacturers are actively designing and introducing new mezzanine connectors
in anticipation of future market growth as well as well as achieving
recognition of industry leadership.
This market research report is the fourth in a continuing series of
investigations of this highly dynamic product segment. The advancement of
this technology together with experience gained in designing these unique
interfaces may set the stage for the evolution of all types of next generation
electronic connectors. Those suppliers who have consistently made the
necessary investment in resources to develop this expertise may emerge as the
only viable suppliers capable of supporting future application requirements.
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