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Market Research Report

Evolving High-Speed Mezzanine Connectors

Published by Bishop & Associates, Inc. Contact us : +1-860-674-8796
Published 2009/05 Content info 150 PAGES
Product code BS86463
Price From  US $ 3500 Order/Price list
US $ 3500 Hard Copy
US $ 3850 Hard Copy + 1 Additional Print Copy
US $ 4550 PDF on CD-ROM (Multi-User Corporate License) & Hard Copy
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Description TOC

Table of Contents

Chapter 1 Report Scope and Methodology

  • Report objectives
  • Study methodology
  • Data collection forms
  • Connector manufacturer survey
  • Connector user survey

Chapter 2 Introduction

  • Preface
  • Introduction

Chapter 3 High Speed Connector Basics

  • Common backplane architecture
  • Mezzanine card architecture
  • High-speed transmission line issues
  • Defining features of high-speed mezzanine connectors
  • Mezzanine connector selection criteria
  • Bandwidth rating of connectors
  • Performance measurements tools
  • Test and analysis equipment
  • Comparison of electrical performance
  • Design support provided by connector manufacturers

Chapter 4 The Need for Speed

  • Market drivers to higher speed interfaces
  • Speed vs. density
  • The influence of industry standards

Chapter 5 High Speed Interconnect System Elements

  • Driver and receiver technology
  • Printed circuit board materials
  • Printed circuit board design and fabrication

Chapter 6 High-Speed Connector And Market Trends 2006-2008

  • Key market trends
  • High-speed mezzanine family source chart

Chapter 7 High-Speed Mezzanine Connectors

  • Mezzanine connector architecture
  • Advantages of mezzanine packaging
  • Interface types
  • Mezzanine connector applications
  • Platform reference designs

Chapter 8 Overview Of Current High-Speed Mezzanine Connectors

  • Advanced Interconnections Corp. / Emulation Technology Inc.
  • Amphenol TCS - VHDM Stacker, XCede Stacker, NexLev
  • ERNI Components - MicroSpeed, MicroSpeed Blindmate,
  • MicroSpeed Power modules, ERmet Zd Stacker, Right-Angle PCI
  • Express connector
  • FCI - MEG-Array, GIG-Array, AirMax VS Stacker, TwinMezz
  • Fujitsu - FCN-260 BTB Series
  • Harting - Micro Card Edge Connector
  • Hirose - IT-1, IT-2, IT-3
  • Molex - Plateau HS Mezz, HD Mezz, SEARAY, VHDM Stacker
  • Samtec - Q-Series, EdgeRate, DP Array, IsoRate, SEARAY,
  • RAZOR Beam, RU8 Series
  • Tyco Electronics - Mictor, Step-Z, Multi-Gig RT StackerSTRADA-Mesa
  • Yamaichi Electronics USA - CNO99Series
  • AMC Connectors

Chapter 9 Mezzanine Connector Design Feature Charts

  • Introduction
  • Amphenol TCS - NexLev
  • ERNI - MicroSpeed
  • FCI - Meg-Array
  • FCI - Gig-Array
  • Fujitsu - FCN260
  • HARTING - Micro-Card Edge Mezzanine
  • Hirose - IT-2 Series
  • Hirose - IT-3 Series
  • Molex - Plateau H.S. Mezz
  • Molex - HD Mezz
  • Samtec - Q Series
  • Samtec - EdgeRate
  • Samtec - SEARAY
  • Samtec - RU-8.
  • Samtec - RAZOR Beam (SS4/ST4)
  • Samtec - RAZOR Beam (LSS)
  • Tyco Electronics - Mictor
  • Tyco Electronics - STRADA-Mesa
  • Yamaichi - CNO99

Chapter 10 Market Analysis / Forecasts

  • Measurement criteria
  • High Speed Mezzanine Connectors
  • World market 2007 -2013 by bandwidth segment
  • World market 2007 -2013 by geographic region
  • World market 2007 -2013 by end user

Chapter 11 High-Speed Connector Innovation

  • Introduction
  • PCB attachment
  • Techniz G-Flex
  • Verdant Electronics
  • TPL Group
  • Silicon Pipe
  • CHE-YU LI & Company
  • Paricon Technologies

Chapter 12 Major Findings And Conclusions

Appendix A Connector Terms And Definitions

Appendix B List Of Contributors

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