Abstract
The semiconductor assembly and test market continues its shift to Asia. The
outsourcing of assembly and test to subcontractors has been increasing
consistently. The outsourced SAT market is expected to grow at a CAGR of
10.3%, which is higher than the global semiconductor growth rates. The IDMs do
not find it cost effective to operate the packaging operation during the
downturns. Also, the capital expenditure required for advanced packaging is
prohibitive.
This report highlights the assembly and test capacity for different countries
in the Asia region including their OSAT revenues. It provides a breakdown of
the OSAT revenues by different application areas and package types with a
five-year forecast.
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