Table of Contents
- Executive Summary
- Introduction
- Asia Foundry Overview
- Factors Driving Semiconductor Capacity in Asia
- 300mm Fabs in Asia
- Semiconductor Process Development Alliances and Joint Ventures
- Asia Capex Overview
- Asia Semiconductor Manufacturing Capacity by Country, 2006- 2011
- Asia Semiconductor Manufacturing Capacity
- Foundry Process Technology Comparison
- Taiwan Semiconductor Manufacturing Overview
- TSMC
- UMC
- Powerchip Semiconductor Corporation (PSC)
- ProMOS Technologies
- Winbond
- Nanya Technology and Inotera Memory
- South Korea Semiconductor Manufacturing Overview
- Samsung
- Hynix
- MagnaChip
- DongbuAnam
- China Semiconductor Manufacturing Overview
- Singapore Semiconductor Manufacturing Overview
- Japan Semiconductor Manufacturing Overview
- Malaysia Semiconductor Manufacturing Overview
- Others
- Conclusion
- Methodology
- Related In-Stat Reports
List of Tables
- Table 1. Asia 300mm Fabs, 2006
- Table 2. Asia Upcoming 300mm Fabs
- Table 3. Asia Foundry Capital Expenditure, 2003- 2007, (US$ in Billions)
- Table 4. Asia Memory Capital Expenditure, 2003- 2007 (US$ in Billions)
- Table 5. TSMC Fabs Overview
- Table 6. TSMC Process Technology Trend, 2003- 2007
- Table 7. UMC Fabs Overview
- Table 8. UMC Process Technology Trend, 2003- 2007
- Table 9. Taiwan Memory Fabs Overview
- Table 10. Samsung Fabs Overview
- Table 11. Hynix Fabs Overview
- Table 12. MagnaChip Fabs Overview
- Table 13. DongbuAnam Fabs Overview
- Table 14. SMIC Fabs Overview
- Table 15. SMIC Process Technology Trend, 2003- 2007
- Table 16. Other Leading Fabs in China
- Table 17. Chartered Fabs Overview
- Table 18. Chartered Process Technology Trend, 2003- 2007
- Table 19. Singapore Other Leading Fabs
- Table 20. Japan 300mm Fabs Overview
- Table 21. Malaysia Fabs Overview
List of Figures
- Figure 1. Asia Semiconductor Manufacturing Capacity, 2006 (200mm-eq.
Wafers⁄Month, in Thousands)
- Figure 2. 300mm Wafer Share in Asia Semiconductor Manufacturing Capacity,
2006 (in 200mm-eq. Wafers)
- Figure 3. Asia Foundry Capital Expenditure, 2003- 2007, (US$ in Billions)
- Figure 4. Asia Memory Capital Expenditure, 2003- 2007, (US$ in Billions)
- Figure 5. Asia Semiconductor Manufacturing Capacity, 2006- 2011 (200mm-eq.
Wafers⁄Month, in Thousands)
- Figure 6. Foundry Capacity Comparison by Process Technology, 2006
- Figure 7. Taiwan Semiconductor Manufacturing Capacity, 2006- 2011
(200mm-eq. Wafers⁄Month, in Thousands)
- Figure 8. TSMC Process Technology Trend, 2003- 2007
- Figure 9. UMC Process Technology Trend, 2003- 2007
- Figure 10. South Korea Semiconductor Manufacturing Capacity, 2006- 2011
(200mm-eq. Wafers⁄Month, in Thousands)
- Figure 11. China Semiconductor Manufacturing Capacity, 2006- 2011
(200mm-eq. Wafers⁄Month, in Thousands)
- Figure 12. SMIC Process Technology Trend, 2003- 2007
- Figure 13. Singapore Semiconductor Manufacturing Capacity, 2006- 2011
(200mm-eq. Wafers⁄Month, in Thousands)
- Figure 14. Chartered Process Technology Trend, 2003- 2007
- Figure 15. Japan Semiconductor Manufacturing Capacity, 2006- 2011
(200mm-eq. Wafers⁄Month, in Thousands)
- Figure 16. Malaysia Semiconductor Manufacturing Capacity, 2006- 2011
(8-inch-eq. Wafers⁄Month, in Thousands)
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