Table of Contents:
Executive Summary
- E.1 Strategies for Success in the WLAN Chipset Market
- E.2 WLAN Chipset Market Leaders
- E.3 Innovative Start-Ups
Chapter One Introduction
- 1.1 Objectives of the Report
- 1.2 WLANs: From Here to Maturity
- 1.2.1 WLANs for Business: Have WLANs Will Travel!
- 1.2.2 WLANs and the Need for Home Networks
- 1.2.3 Other WLAN Opportunities: Is That All There Is?
- 1.3 Scope of Report
- 1.4 Methodology and Information Sources
- 1.5 Plan of Report
Chapter Two What WLAN Equipment Companies Want from Chip Suppliers: A Survey
of Major Users
- 2.1 Survey Methodology
- 2.2 Key Factors in Choosing a WLAN Chipset Supplier
- 2.3 Customers' Technical/ Performance Requirements for WLAN Chipsets
- 2.4 Customer Views of Current and Future Standards Compliance Requirements
- 2.5 Customer Views of Special Requirements for WLAN Chipsets for Use in
Corporate LANs
- 2.6 New Types of WLAN Chipsets Required by Customers
- 2.7 Customer Mindshare of Leading Chipset Suppliers
- 2.8 Who are the Most Promising Start-Ups in the Eyes of Customers?
- 2.9 Customer Views of Chipset Pricing
- 2.10 Customer Views on Major WLAN Chipset Suppliers: Perceived Competitive
Advantages in Technology, Cost, Customer Responsiveness, and Plans for Product
Evolution
- 2.11 Key Supplier Relationships Identified by Customers
Chapter Three The WLAN Chip Business: Structure and Strategies
- 3.1 WLAN Chip Strategies for a New Era: No Middle Road
- 3.2 802.11: a, b and g
- 3.3 Prospects for Today's Market Leaders
- 3.3.1 Where to from 802.11b?
- 3.3.2 Leadership in the 802.11a market
- 3.3.3 Leadership in the 802.11g market
- 3.3.4 Leadership in the Multiprotocol Chipset Market
- 3.3.5 Established Customer Relationships of Today's Market Leaders
- 3.4 Can Other Current Players in 802.11 Market Still Succeed?
- 3.5 New Directions: How Start-Ups Plan to Make Money Enhancing 802.11
- 3.5.1 802.11, Bluetooth and Other Wireless Standards
- 3.5.2 802.11 and VoIP
- 3.5.3 Opportunities in the Consumer Electronics Market
- 3.5.4 Chipsets for Business and Service Provider Environments
- 3.5.5 Adding Processing Power
- 3.6 Materials Issues: CMOS, SiGe and GaAs
Chapter Four Five-Year Market Forecasts for WLAN Chips
- 4.1 Forecasting Philosophy
- 4.2 Pricing Analysis
- 4.3 Market Forecasts by Application
- 4.3.1 Home Networking
- 4.3.2 Mobile Computing
- 4.3.3 Enterprise Networking
- 4.4 Market Forecasts by Protocols Supported
- 4.5 Forecast of Multimedia and VoIP Enabled Chipsets
- 4.6 Forecast by Type of End Product
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