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Market Research Report

SWITCHING FABRIC MARKET: THE JOYS AND CHALLENGES OF ASI Update June 2005

Published by Communications Industry Researchers, Inc. Contact us : +1-860-674-8796
Published 2005/06 Content info  
Product code CI30203
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Description TOC

This new report from CIR provides detailed volume and value forecasts for 2004 to 2008 for electronic and optical switching fabrics and devices. This report includes CIRs latest assessment of market shares for both telecom and data communications switching products and our analysis of where the key market opportunities lie. In presenting our latest forecasts for this sector, we also provide readers with our take on crucial industry issues such as the revival of telecom and IT spending, the shift to packet switching, the growing viability of solid-state optical switches, renewed interest in ROADMs, aggregation for high-speed LANs and SANs, and broadband wireless switching. We also examine how start-ups are still trying to make money in the module space.

The report discusses the role of both switches and related products in the long haul, metro core, access and enterprise segments and in both wireline and wireless networks. The trend towards standardization of switching fabrics and the future role of optical switching are also a major focus of this report. For each of the product types that we forecast, we include breakouts by data rate supported, technology used, and standards/features supported.

The forecasts in this report are derived from CIRs integrated forecasting database of the entire telecom and datacom value chain. The methodologies employed for compiling the database include our ongoing interview program with players at every level of that chain - service providers, equipment manufacturers, optical component manufacturers and semiconductor manufacturers as well as factors such as SEC filings, commercial real estate data, physical locations both in the public network and enterprise network and how network elements are configured in order to present a clear picture of the entire market from chassis to modules to components and chips.

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