Telecommunications Transceiver & Transponder Markets: The Next Five Years

Table of Contents

• E.1 Current Business Conditions in the Telecom Transceiver/Transponder Market
• E.2 Key Opportunities in the Telecom Modules Market
  • E.2.1 OC-768 Deployment Becoming a Reality
  • E.2.2 10 Gbps is Still the Sweet Spot for SONET/SDH
  • E.2.3 Opportunities, Standards and MSAs
  • E.2.4 New Opportunities for WDM and the Aging of SONET/SDH
  • E.2.5 Opportunities in PONs
• E.3 Summary of Forecasts
• E.4 Long-Term Direction for the Transceivers/Transponders Market: Life Beyond Telecom?

• 1.1 Background to Report
  • 1.1.1 Shifts in Applications: Video and Cloud Computing
  • 1.1.2 Shifts in Technology: OTN and 40/100-Gbps Backbones
• 1.2 Objectives and Scope of Report
• 1.3 Methodology of Report
• 1.4 Plan of Report

• 2.1 Transceivers and Transponders
  • 2.1.1 TOSAs and ROSAs
• 2.2 Enabling Technologies 2.2.1 Impact of Optical Integration and Silicon Photonics
  • 2.2.2 Influential Developments in Tunable Laser and Other WDM Technology
  • 2.2.3 WDM versus 40 Gbps
  • 2.2.4 Impact of New Dispersion Compensation Technology
• 2.3 Standards Evolution
  • 2.3.1 The ITU, OTN and the End of SONET
  • 2.3.2 Ethernet: How 40/100 GigE Will be Adapted to Public Networks
  • 2.3.3 Next PONs: WDM and 10 Gbps
• 2.4 MSA Evolution
  • 2.4.1 A Future for 300-pin and XENPAK?
  • 2.4.2 Whither XPAK and X2?
  • 2.4.3 The Role of XFP and SFP+ in the Public Network
  • 2.4.4 40-Gbps MSAs
  • 2.4.5 MSA for Tunable Transponders

• 3.1 Applications Drivers for Infrastructure Building in the Public Network
  • 3.1.1 Video
• 3.2 TOSA/ROSA Markets
• 3.3 Long-haul and Ultra-long Haul Networks
  • 3.3.1 Network Evolution
  • 3.3.2 Transponder/Transceiver Requirements
• 3.4 Metro Networks
  • 3.4.1 Network Evolution
  • 3.4.2 Transponder/Transceiver Requirements
• 3.5 Access Networks
  • 3.5.1 PON Developments
  • 3.5.2 Transponder/Transceiver Requirements
• 3.6 SONET/SDH Forecasts
• 3.7 WDM Forecasts
• 3.8 PON Forecasts

• 4.1 Introduction
• 4.2 Avanex
• 4.3 BinOptics
• 4.4 Bookham
• 4.5 CyOptics
• 4.6 Finisar
• 4.7 Intel (now Emcore)
• 4.8 JDSU
• 4.9 OCP (now Oplink)
• 4.10 Opnext
• 4.11 OpVista
• 4.12 PON Diplexer and Triplexer Suppliers
• 4.13 A Note on Asian Modules Makers

Acronyms and Abbreviations Used in this Report

• Exhibit E-1: Strategies in the FTTx Components and Modules Market
• Exhibit 2-1: New Laser Integrated Products for Parallel Solutions
• Exhibit 2-2: Types, Mechanisms and Suppliers of Telecom Tunable Lasers
• Exhibit 2-3: PON Technologies
• Figure 1-4: 10-Gig Transceiver/Transponder Form Factors
• Exhibit 3-1: The SONET/SDH Module Market by Data Rate
• Exhibit 3-2: OC-192 Module Markets by Reach: 2007-2013
• Exhibit 3-3: OC-192 Module Markets by MSA: 2007-2013
• Exhibit 3-4: OC-768 Module Markets by Reach: 2007-2013
• Exhibit 3-5: The WDM Module Market by Data Rate and CWDM/DWDM Breakout: 2007-2013
• Exhibit 3-6: 10 Gbps and Above WDM Module Markets by Reach: 2007-2013
• Exhibit 3-7: WDM Module Markets by MSA: 2007-2013
• Exhibit 3-8: Evolution of the FTTx (Millions of Subscribers Added in Year)
• Exhibit 3-9: PON Transceiver Markets: 2007-2013
• Exhibit 3-10: Worldwide Transmission Modules Markets: 2007-2013 ($ Millions)
• Exhibit 4-1: Selected Suppliers of Non-Commodity PON Transceivers