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Market Research Report

2009 Sensors and MEMS

Published by Databeans, Inc. Contact us : +1-860-674-8796
Published 2009/02 Content info 96 PAGES
Product code DATA90112
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Description TOC

Abstract

A sensor is any device that measures a physical quantity and converts it into a signal which can be read by a human observer or by an instrument. The highest growth and demand is currently stemming from the automotive market, while process control industries are following closely behind. Numerous sensors are now making their way into telecommunications products consumer electronics as well, making them key growth catalysts for the next several years. Sensors based on MEMS technologies and smart sensors are currently the focus of current sensor development in these high growth fields. Databeans classifies the sensors market into three categories of products including temperature sensors, pressure sensors, and magnetic field sensors.

Micro Electro Mechanical Systems or "MEMS" are devices produced on a nano scale. MEMS devices include a grouping of several product types on the market including: Accelerometers, Microfluidic, Optical MEMS, and Other MEMS and Actuators (such as MEMS Resonators, Bio-MEMS, and Microphones). Major MEMS suppliers include familiar names such as Texas Instruments, HP, Canon, Robert Bosch, and others. Currently, major MEMS application segments are Inkjet printers, which use piezoelectrics or thermal bubble ejection to deposit ink on paper, followed by optical communications components, consumer applications, and some automotive applications, including gyroscopes for stability control and accelerometers for airbag deployment in the case of collision.

Today, the market for MEMS is growing exponentially into new consumer applications, including devices for the Nintendo Wii and Apple iPhone, along with DLP televisions and microphones used in laptops, digital cameras, and mobile phones. While MEMS manufacturing continues to be dominated by used semiconductor equipment, there is a migration to new 200mm lines and select new tools, including etch and bonding for certain MEMS applications.

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