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Market Research Report

Semiconductor Material Analysis 2009: Gas Chemical

Published by DisplayBank Contact us : +1-860-674-8796
Published 2009/09 Content info  
Product code DISE102555
Price From  US $ 7000 Order/Price list
US $ 7000 Hard Copy
US $ 7000 PDF By E-mail
Delivery Time
PDF by E-Mail
Approx. 1-2 business days
Hard Copy/CD-ROM
Approx. 3-4 business days
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Description TOC

Abstract

In 2009, Displaybank newly publishes Research Reports for the Semiconductor Industry. Among our plans to publish reports regarding the material which is one of the key elements in the semiconductor industry focusing especially on chemical material, Displaybank' s Semiconductor Report series #4, ' Semiconductor Material Analysis 2009: Gas Chemical' is now available.

  • * This report deal with 6 most heavily used gases (NF3, SiH4, DCS, NH3, WF6, CF Gas)
  • * CF Gas includes CF4, C2F6 and C3F8

Chapter 1. Chemical Vapor Deposition

  • Types and Roles of Gas Chemical
  • CVD Process, Dry Etching, Chamber Cleaning Process Introductionz

Chapter 2. Major Semiconductor Maker

  • Major Semiconductor Maker List by Region (Excluding Fabless Makers)
  • 25 major semiconductor makers' Line information and manufactured products. (Intel, Samsung Electronics, Texas Instrument and Toshiba' s wafer Line Capa information by inch & manufactured product classification)

Chapter 3. Worldwide Gas Chemical Market Trend

  • Market trend and forecast (half-yearly basis) from 2008 to 2011 for Gas Chemical in Semiconductor Manufacturing Process in both Unit and Revenue base
  • Worldwide market trend and forecast (half-yearly basis) from 2008 to 2011 for NF3, SiH4, NH3, DSC, WF6 and CF Gas in both Unit and Revenue base
  • Regional segmentation of market trend and forecast from 2008 to 2011 (half-yearly basis) for the 6 items by device in regions including US (North America), Europe, Korea, Japan, Taiwan, China and others in both Unit and Revenue base

Chapter 4. Market Trend in Korea

  • Samsung Electronics, Hynix and other makers' per-Line information (Inch, Capa, Wafer injection quantity on half-year based, Manufactured product, Changes/Updates in Line)
  • Usages in Quantity for NF3, SiH4, DCS, NH3, WF6, CF(CF4, C2F6, C3F8, etc) by each Fab. (Actual usage in 2008 for half-yearly basis & expected usage in 2009 for half-yearly basis)
  • Supplier Analysis based on Each Fab
  • Suppliers by each product category for Samsung Electronics and Hynix & monthly average usage based on 2Q, 3Q of 2009)

Chapter 5. Market Analysis

  • Competition Angle Analysis by Each Item
  • Price Analysis for Each Item
  • Business Issues & Trend Analysis for Each Item
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