Advanced Laser Applications for Next-Generation FPD Manufacturing Process

Table of Contents

1. LASER TECHNOLOGY OUTLINE

• 1.1 CHARACTERISTIC OF LASER
  • 1.1.1 Definition and Characteristic of Laser
  • 1.1.2 Oscillation Principle of Laser
• 1.2 ADVANCED LASER FOR FPD PRODUCTION
  • 1.2.1 Semi-Conductor Laser
  • 1.2.2 Solid Laser
  • 1.2.3 Gas Laser
  • 1.2.4 Femto second Laser
• 1.3 BASIC COMPOSITION OF FPD LASER EQUIPMENT
  • 1.3.1 Laser and Optical System
  • 1.3.2 Laser Synthesis System Equipment
• 1.4 APPLICATION FIELD OF ADVANCED LASER
  • 1.4.1 FPD Related Laser Application
  • 1.4.2 Electric/Electronic/Solar Cell Related Laser Application
• 1.5 RECENT LASER TECHNOLOGY DEVELOPMENT TREND

2. FPD MARKET TRENDS AND COST ANALYSIS

• 2.1 FPD MARKET TRENDS
  • 2.1.1 TFT-LCD Market Trend
  • 2.1.2 PDP Market Trend
• 2.2 MANUFACTURING COST & ASP COMPARISON OF FPD
  • 2.1.1 42Inch FHD PDP vs. TFT-LCD
  • 2.1.2 50Inch FHD PDP vs. 52Inch FHD TFT-LCD

3. NEXT-GENERATION FPD PROCESS USINGN LASER PATTERNING TECHNOLOGY

• 3.1 MASKLESS EXPOSURE
  • 3.1.1 Polygon Mirror Based Technology
  • 3.1.2 Spatial Light Modulator (SLM) Based Technology
    • 3.1.2.1 DMD Based Maskless Exposure
    • 3.1.2.2 GLV Based Maskless Exposure
  • 3.1.3 LDW, Laser Direct Writing, Based Technology
  • 3.1.4 Equipment Maker Trend
    • 3.1.4.1 ASML
    • 3.1.4.2 DNS, Dainippon Screen
    • 3.1.4.3 Hitachi Via
    • 3.1.4.4 Index Technology
    • 3.1.4.5 LG Electronics/LG Display
    • 3.1.4.6 Micronic Laser Systems
    • 3.1.4.7 Orbotech
    • 3.1.4.8 ORC Manufacturing
    • 3.1.4.9 SDI/Samsung Electronics
    • 3.1.4.10 Ball Semiconductor
  • 3.1.5 SLM(Spatial Light Modulator) Maker Trend
    • 3.1.5.1 Texas Instrument
    • 3.1.5.2 Silicon Light Machines
    • 3.1.5.3 Micronic Laser Systems
    • 3.1.5.4 Fraunhofer IPMS
  • 3.1.6 Panel Maker Trend
    • 3.1.6.1 Samsung Electronics
    • 3.1.6.2 LG Display
    • 3.1.6.3 Samsung SDI
    • 3.1.7 Patent Trend
• 3.2 LASER DIRECT PATTERNING TECHNOLOGY
  • 3.2.1 ITO (Indium Tin Oxide) Direct Patterning
  • 3.2.2 Laser Selective Etching for LCD and Flexible Display Production
• 3.3 LASER INDUCED METHOD FOR OLED ORGANIC FILM DIRECT PATTERNING
  • 3.3.1 RIST(Radiation Induced Sublimination Transfer) Technology by KODAK
  • 3.3.2 LITI(Laser Induced Thermal Imaging) Technology by Samsung SDI
  • 3.3.3 LIPS (Laser Induced Pattern-wise Sublimation) Technology by SONY
• 3.4 TITLER AND ID MARKER
  • 3.4.1 PDP Panel ID Marking Using UV Laser
  • 3.4.2 LCD Panel Titling Using Laser Exposure Technology
  • 3.4.3 High Quality Next-Generation Titler Technology

4. ADVANCED LASER APPLICATION TECHNOLOGY FOR FPD PRODUCTION

• 4.1 LASER CRYSTALLIZATION FOR LTPS (LOW TEMPERATURE POLY SILICON)
  • 4.1.1 Eximer Laser Based Technology (ELA, SLS, TDX)
  • 4.1.2 Solid Laser Based Technology (SELAX, Green Laser, CLC)
  • 4.1.3 Semi-Conductor Laser Based Technology (dLTA: Diode Laser Thermal Annealing)
• 4.2 LASER REPAIR TECHNOLOGY
  • 4.2.1 Laser Array Repair
  • 4.2.2 Laser CVD Repair (Electrode Open Repair)
• 4.3 LASER GLASS CUTTING TECHNOLOGY
  • 4.3.1 Glass Cutting Technology Using CO2 Laser
  • 4.3.2 Next-Generation Laser Cutting Technology Using Hybrid Method
• 4.4 LASER FRIT SEALING AND PACKAGING TECHNOLOGY
  • 4.4.1 AMOLED Frit Sealing Technology Using Semi-Conductor Laser
  • 4.4.2 Next-Generation FPD Packaging Technology Using Laser

5. INDEX

• 5.1 TABLE
• 5.2 FIGURE