Solar Grade-Silicon, Ingot, Wafer Technology and Market Trend

Table of Contents

1. Introduction

• 1.1. Renewable Energy and Photovoltaic
• 1.2. Low-cost Strategy for Solar cell
• 1.3. Poly Silicon Process

2. Poly silicon Technologies

• 2.1. Metallurgical Grade-Silicon (MG-Si) Process
• 2.2. Solar Grade-Silicon (SoG-Si) Process
• 2.3. Current Technologies (Siemens Process)
  • 2.3.1. Siemens Process using TCS (TrichloroSilane)
  • 2.3.2. Siemens Process using MS (Monosilane)
  • 2.3.3. Hydrogen reduction Process using Tetrachlorosilane
• 2.4. Alternative Technologies 1 (FBR, VLD, FSR Process)
  • 2.4.1. Fluidized Bed Reactor (FBR) : MEMC, Wacker, REC etc.
  • 2.4.2. Vapor to Liquid Deposition (VLD) : Tokuyama
  • 2.4.3. Free Space Reactor (FSR) : Joint Solar Silicon
• 2.5. Alternative Technologies 2 (Metallurgical Process)
  • 2.5.1. Acid Leaching
  • 2.5.3. SOLSILC Process (Netherlands, Norway)
  • 2.5.4. UMG-Si Process (Elkem, Norway)
  • 2.5.5. Vacuum Refining Process (Kawasaki Steel Corporation, Japan)
• 2.5.6. Dow Corning' s route - NREL

3. Ingot/ Wafer Process

• 3.1. Ingot Process
  • 3.2.1. Czochralski Process (CZ)
  • 3.2.2. Float-Zone Process (FZ)
• 3.3. Multicrystalline ingot
  • 3.3.1. Block Casting Process
  • 3.3.2. Electromagnetic Casting Process
• 3.4. Wafering Process
• 3.5. New Wafer Technology
  • 3.5.1. Ribbon Wafer
  • 3.5.2. Ribbon Wafer (Type I)
  • 3.5.3. Ribbon Wafer (Type =±)
  • 3.5.4. EFG (Edge-defined Film Growth, type 1)
  • 3.5.5. SR (String Ribbon, type 1)
  • 3.5.6. DW (Dentric Web, type 1)
  • 3.5.7. RGS (Ribbon Growth on Substrate, type 2)
  • 3.5.8. CDS (Crystallization on Dipped Substrate, type 2)
  • 3.5.9. SSP Ribbon ( Silicon sheets from powder )
• 3.6. Thin Wafer
  • 3.6.1. DFT (Direct Film Transfer)
  • 3.6.2. SLIM (Stress-Induced Lift-off Method)

4. Polysilicon Manufacturers Status

• 4.1. Current Producer
  • 4.1.1. Hemlock Semiconductor (HSC)
  • 4.1.2. Wacker Chemi
  • 4.1.3. Renewable Energy Corporation (REC)
  • 4.1.4. Tokuyama
  • 4.1.5. Monsanto Electronic Materials (MEMC)
  • 4.1.6. Mitsubishi Materials Corporation (MMC)
  • 4.1.7. Sumitomo
• 4.2. New Entrants - Current Technologies
  • 4.2.1. Silicium De Provence (SilPro)
  • 4.2.3. Other Korean
  • 4.2.4. Isofoton and ENDESA
  • 4.2.5. Hoku Scientific
  • 4.2.6. M. Setek
  • 4.2.7. LDK Solar
  • 4.2.8. Emei
  • 4.2.9. LuoYang China Silicon
  • 4.2.10. Sichuan Xinguang
  • 4.2.11. Nitol Solar
• 4.3. New Entrants-Alternative Technologies
  • 4.3.1. Elkem Solar
  • 4.3.2. Joint Solar Silicon (JSSI)
  • 4.3.3. Solarvalue AG
  • 4.3.4. Dow Corning
  • 4.3.5. Becancour Silicon (BSI)
  • 4.3.6. AE Polysilicon

5. Ingot/Wafer Producers

• 5.1. PCMP (Podolsky Chemical & Metallurgical Plant)
• 5.2. Pillar JSC
• 5.3. PV Crystalox Solar
• 5.4. M. Setek
• 5.5. REC-Sitech, Scanwafer
• 5.6. Wacker Shott Solar
• 5.7. MEMC
• 5.8. Silicon Ltd (Soetlorodsk)
• 5.9. Swiss Wafer
• 5.10. Solar World
• 5.11. Kyocera
• 5.12. ASi Industries GmbH

6. Poly-Si Market Forecast (2007~2012)

• 6.1. poly-Silicon Production & Capacity
• 6.2. p-Si supply & Demand forecast for solar cell
• 6.3. p-Si Production & Capacity by company
• 6.4. Poly Silicon Price (Contract, Spot)
• 6.5. poly-Silicon Revenue forecast (Solar)
• 6.6. poly Silicon Production Cost by Technology
• 6.7. poly-Silicon Capacity by Region
• 6.8. poly-Silicon Production Forecast by Region
• 6.9. poly-Silicon production by technology
• 6.10. UMG-Si
• 6.11. Ingot/Wafer Production
• 6.12. Wafer Revenue