Abstract
Wet Chemical: Cleaning Solution, Etching Solution, Stripper, Developer,
Plating Solution (Cu, Au)
In 2009, Displaybank Research Group prepared Research Report regarding the
Semiconductor Industry. First of all, we plan to cover chemical material, one
of key elements in the semiconductor industry. As the first for the ongoing
series, Displaybank has published “Semiconductor Chemical Material
Analysis: Wet Chemical” that discusses Cleaning and Etching Solutions
(H3PO4, HF, BHF (BOE), H2O2, H2SO4, and etc.), Developer (TMAH), Stripper,
Plating Solution (Cu and Au).
| 
View Cart
