Semiconductor Material Analysis 2009: Wet Chemical

Table of Contents

Chapter 1. Wet Chemical for Semiconductor

• 1. Introduction
• 2. Semiconductor Manufacturing Process
• 3. Cleaning
  • 3-1. Cleaning Process
  • 3-2. Wet Cleaning
• 4. Photolithography
  • 4-1. Photolithography Process
  • 4-2. Develop Photoresist
  • 4-3. PR Stripping
• 5. Etching
  • 5-1. Wet Etch Process
  • 5-2. Dry Etch Process
• 6. Copper Electroplating

Chapter 2. Major Semiconductor Maker

• 1. Semiconductor Maker
  • 1-1. Semiconductor Maker by Region
  • 1-2. Semiconductor by Product Category
• 2. Major Semiconductor Maker(25#)
  • 2-1. Intel, Samsung, Texas Instruments, Toshiba
  • 2-2. STMicroelectronics, TSMC, Hynix, Renesas, SONY
  • 2-3. NXP, AMD, Infineon, NEC, Freescale , Micron Technology, Fujitsu
  • 2-4. IBM, Elpida Memory, Panasonic, UMC, Sharp, Spansion, Powerchip, ProMOS, Nanya

Chapter 3. Worldwide Wet Chemical Market Trend

• 1. Worldwide Market Trend: 2008~2011
  • 1-1. Cleaning & Etching Material
  • 1-2. Stripper
  • 1-3. Developer (TMAH)
  • 1-4. Plating Solution: Cu & Au
  • 1-5. Overall
• 2. Market Trend by Region: 2008~2011
  • 2-1. Cleaning & Etching Material
  • 2-2. Stripper
  • 2-3. Developer (TMAH)
  • 2-4. Plating Solution: Cu & Au

Chapter 4. Market Trend in Korea

• 1. Fab Status
  • 1-1. Samsung: Product, Capa, Wafer Size, Input Wafer Trend, Information
  • 1-2. Hynix & Others: Product, Capa, Wafer Size, Input Wafer Trend, Information
• 2. Market Trend: HF
  • 2-1. Market Trend by Line : Volume
  • 2-2. Market Trend by Line : Amount
  • 2-3. Supply Chain
• 3. Market Trend: BHF(BOE)
  • 3-1. Market Trend by Line : Volume
  • 3-2. Market Trend by Line : Amount
  • 3-3. Supply Chain
• 4. Market Trend: H3PO4
  • 4-1. Market Trend by Line : Volume
  • 4-2. Market Trend by Line : Amount
  • 4-3. Supply Chain
• 5. Market Trend: H2SO4
  • 5-1. Market Trend by Line: Volume
  • 5-2. Market Trend by Line: Amount
  • 5-3. Supply Chain
• 6. Market Trend: H2O2
  • 6-1. Market Trend by Line: Volume
  • 6-2. Market Trend by Line: Amount
  • 6-3. Supply Chain
• 7. Market Trend: Stripper
  • 7-1. Market Trend by Line: Volume
  • 7-2. Market Trend by Line: Amount
  • 7-3. Supply Chain
• 8. Market Trend: Developer (TMAH)
  • 8-1. Market Trend by Line: Volume
  • 8-2. Market Trend by Line: Amount
  • 8-3. Supply Chain
• 9. Market Trend: Au Plating Solution
  • 9-1. Market Trend by Line: Volume
  • 9-2. Market Trend by Line: Amount
  • 9-3. Supply Chain
• 10. Market Trend: Cu Plating Solution
  • 10-1. Market Trend by Line: Volume
  • 10-2. Market Trend by Line: Amount
  • 10-3. Supply Chain

Chapter 5. Market Analysis

• 1. Market Analysis: Cleaning & Etching Material
  • 1-1. Market Forecast
  • 1-2. Price Trend : HF & BHF, H3PO4, H3PO4, H2SO4
  • 1-3. Industry Analysis
• 2. Market Analysis: Stripper
  • 2-1. Market forecast
  • 2-2. Price Trend
  • 2-3. Industry Analysis
• 3. Market Analysis: Cu Plating Solution
  • 3-1. Market Forecast
  • 3-2. Price Trend
  • 3-3. Industry Trend