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Market Research Report

Strategic Analysis of the Chinese VLSI Design Services and Semiconductor Packaging Markets

Published by Frost & Sullivan Contact us : +1-860-674-8796
Published 2007/04 Content info 149 Pages
Product code FS51021
Price From  US $ 7000 Order/Price list
US $ 7000 Web Access (Regional License)
US $ 7500 Hard Copy & Web Access (Regional License)
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Description TOC

Table of Contents

1. TABLE OF CONTENT

Table of Content

  • 1. Table of Content

2. EXECUTIVE SUMMARY

VLSI Design Services Market Overview

  • 1. VLSI Design Services Market Overview

Challenges - The VLSI Design Service Industry

  • 1. Challenges - The VLSI Design Service Industry

Semiconductor Packaging Market Overview

  • 1. Semiconductor Packaging Market Overview

Challenges - The Semiconductor Packaging Industry

  • 1. Challenges - The Semiconductor Packaging Industry

3. CHINESE VLSI DESIGN SERVICES MARKET

Market Definition

  • 1. VLSI Design Services Market Definitions
  • 2. Technology Definitions

Business Models

  • 1. Time and Material Model
  • 2. Fixed Price Model
  • 3. Dedicated Engagement Model
  • 4. Offshore Outsource Model
  • 5. Conclusions

Design Service Models and Design Chain Evolution

  • 1. Design Service Models
  • 2. Design Chain
  • 3. Design Service Superstore

Market Dynamics

  • 1. Industry Challenges
  • 2. Market Drivers
  • 3. Market Restraints

Trends

  • 1. Overview
  • 2. ASIC Design Starts
  • 3. ASIC Design Starts by Process Technology
  • 4. ASIC Design Trends
  • 5. ASIC Performance Trends
  • 6. FPGA Design Trends
  • 7. FPGA Performance Trends
  • 8. ASSP and Structured ASIC Design Starts
  • 9. Next Generation Product Price
  • 10. Pricing Trends

VLSI Design Services - Opportunities

  • 1. Opportunities
  • 2. Total Available Market Opportunity - Semiconductor Consumption

VLSI Design Services Market

  • 1. Salient Features of the Market
  • 2. Revenue Analysis
  • 3. Total VLSI Design Services Revenue
  • 4. VLSI Design Services Organizations Breakout

Geographic Analysis

  • 1. Regional Distribution
  • 2. Revenue Analysis by Geographic Region
  • 3. Total VLSI Design Services Revenues by Geographic Region
  • 4. Yangtze Delta
  • 5. Beijing Tianjin and Bohai Bay Around
  • 6. Pearl River Delta
  • 7. West China
  • 8. ASIC Design Gate Count by Geographic Region
  • 9. FPGA Design Gate Count by Geographic Region
  • 10. ASIC Process Technology by Geographic Region
  • 11. Employee Strength by Geographic Region
  • 12. China versus India - An Analysis

Strategic Recommendations

  • 1. Strategic Recommendations

4. CHINESE SEMICONDUCTOR PACKAGING MARKET

Market Definition

  • 1. Semiconductor Packaging Market Definitions

Technology Trends

  • 1. Current Major Packaging Technologies
  • 2. Emerging Technologies
  • 3. Major Applications of Semiconductor Packaging
  • 4. Input/Output Count and Package Size Matrix
  • 5. Technology Development of Packaging
  • 6. Trend of Packaging Requirement
  • 7. Packaging Trends

Market Dynamics

  • 1. Industry Challenges
  • 2. Market Drivers
  • 3. Market Restraints

SWOT Analysis of Semiconductor Packaging in China

  • 1. Strength
  • 2. Weakness
  • 3. Opportunities
  • 4. Threats

Semiconductor Packaging - Opportunities

  • 1. Opportunities Overview
  • 2. Opportunities: Trend of Packaging Outsourcing
  • 3. Available Market Opportunity: Semiconductor Consumption
  • 4. Available Market Opportunity: Foundry

Semiconductor Packaging - Revenues

  • 1. Salient Features of the Market
  • 2. Total Semiconductor Packaging Revenue
  • 3. Total Semiconductor Packaging Revenue by Technology

Revenue Forecasts by Technology

  • 1. Semiconductor Packaging Revenue Forecasts - Transistor Outline
  • 2. Semiconductor Packaging Revenue Forecasts - Dual In-line Package
  • 3. Semiconductor Packaging Revenue Forecasts - Small Out-line Package
  • 4. Semiconductor Packaging Revenue Forecasts - Quad Flat Package
  • 5. Semiconductor Packaging Revenue Forecasts - Ball Grid Array
  • 6. Semiconductor Packaging Revenue Forecasts - Pin Grid Array
  • 7. Semiconductor Packaging Revenue Forecasts - Chip Scale Package

Competitive Analysis

  • 1. Regional Distribution of Participants
  • 2. Market Share Analysis
  • 3. Key Competitive Factors

Company Profile of Key Market Participants

  • 1. Company Profile of Key Market Participants

Strategic Recommendations

  • 1. Strategic Recommendations
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