Report: Semiconductor Processing Equipment TOC

I. INTRODUCTION, METHODOLOGY & PRODUCT DEFINITIONS

II. EXECUTIVE SUMMARY

1. Outlook II-1

Table 1: World Market for Semiconductor Processing Equipment (2000-2010): Geographic Regions Ranked by Growth- Asia-Pacific, Rest of World, Canada, US, Japan, and Europe (includes corresponding Graph/Chart) II-1
Table 2: World Market for Semiconductor Processing Equipment (2000-2010): Product Segments Ranked by Growth - CMP Equipment, Test and Metrology Equipment, Packaging Equipment, Epitaxy Equipment, Furnace and RTP, Dielectric CVD Equipment, Lithography Equipment, Ion Implant Equipment, Wafer Deposition Equipment, Others, and Etch Equipment (includes corresponding Graph/Chart) II-2

2. Semiconductor Industry Overview II-3

Historical Perspective II-3
Worldwide Semiconductor Market -- An Overview II-4
Factors Influencing the Market II-4
Semiconductor Growth Declines Due to US Economic Slowdown II-4
Semiconductor Industry Benefits from Growth in Telecommunications II-4
Outlook for Semiconductor Market II-5

3. Semiconductor Equipment Market II-6

Market Snapshots II-6
Moving to 300 Millimeter Wafer Equipment II-6
2001 -- A Year of Mixed Fortunes II-6
Competitive Landscape II-7
Table 3: Leading Players in the Worldwide Semiconductor Equipment Manufacturing Market (2003 & 2004): Annual Sales in US$ Thousand for Applied Materials, Tokyo Electron Ltd., Nikon Corporation, KLA-Tencor, ASML, Dainippon Screen Mfg., Novellus Systems, Hitachi High-Tech., and Advantest (includes corresponding Graph/Chart) II-7
Table 4: Leading Players in the Worldwide Etch Market (2003 & 2004): Percentage Breakdown of Value Sales for Lam Research, Tokyo Electron, Applied Materials, Hitachi and Others (includes corresponding Graph/Chart) II-8
Table 5: Leading Players in the Worldwide Chemical Mechanical Planarization (CMP) Market (2003 & 2004): Percentage Breakdown of Value Sales for Applied Materials, Ebara Corp, Novellus Systems and Others (includes corresponding Graph/Chart) II-8
Table 6: Leading Players in the Worldwide Plasma Deposition Market (2003 & 2004): Percentage Breakdown of Value Sales for Applied Materials, Novellus Systemsand Others (includes corresponding Graph/Chart) II-9
Convergence of Four Major Wafer-Processing Technology Transitions II-9
Table 7: Growth of the Four Transitions Over the Next Few Years (includes corresponding Graph/Chart) II-9
Table 8: Worldwide Leading Suppliers of Wafer Processing Equipment (2003-2004) -- Market Shares for Varian Semiconductor Equipment, Axcelis Technologies, Inc,ASML, Dainippon Screen Mfg. Co., Ltd, Tokyo Electron Limited, Novellus Systems, Inc, ASM International, Canon Inc, Nikon Corp, Applied Materials and Others (includes corresponding Graph/Chart) II-10
Industry Structure of Semiconductor Equipment II-10
Wafer Cleaning: A Significant Manufacturing Process II-11
New Challenges for Wafer Cleaning II-12
Processing Steps: FEOL and BEOL II-12
FEOL to the Rescue II-12

4. Semiconductor Processing Equipment: Product Overview II-15

Semiconductor Processing Equipment II-15
Chemical Mechanical Planarization (CMP) Equipment II-15
Other Planarization Techniques II-15
CMP Vs. Conventional Techniques II-16
Damascene CMP II-16
Dielectric CVD Equipment II-17
Epitaxy Equipment II-17
Etch Equipment II-17
Fundamentals of Etching II-17
Ion Beam Etch Equipment II-18
Rapid Thermal Processing (RTP) Equipment II-19
Ion Implant Equipment II-19
High Current Implantation II-20
Lithography Equipment II-20
Lithography Technology II-21
Lithography Process Equipment II-21
SCALPEL Lithography Equipment II-22
Wafer Deposition Equipment II-22
Semiconductor Packaging Equipment II-22
Table 9: Leading Vendors for Semiconductor Packaging/Assembly Equipment (2000-2001) -- MarketShares for Kulicke & Soffa, Tokyo Seimitsu, ASM Pacific,Advantest, Tokyo Electron Limited, Shinkawa, BE Semiconductor, Fico, ESEC, Delta D esign,Dai-Ichi Seiko, and Others (includes corresponding Graph/Chart) II-23
Test and Metrology Equipment II-24
Others II-24

5. Regulatory Environment II-25

Semiconductor Equipment and Materials International (SEMI) II-25
Growth Prospects from MEMS Fabrication Sector II-25

6.Technological Developments II-27

MKS Instruments Develops LIQUOZON® Smart Ozonated Water Delivery System II-27
Stratus Vertical Wafer Electro-Deposition System II-27
WS-600 - Single Wafer Spin Processing Equipment II-27
Ingenio -- An Advanced Process Control (APC) System II-27
TEL and Clariant Develop Surfactant Rinse Solutions II-28
SUSS Unveils Nano PREP Technology II-28
Roll-to-Roll Manufacturing (R2R) -- A Continuous Production Process II-28
Ultra Stress Free Copper Polishing Technology II-28

7. Product Innovations/Developments II-29

Varian Semiconductor Releases VIISta HC Ion Implanter II-29
Varan Semiconductor Unleashes VIISta 810XE Ion Implanter II-29
Applied Materials Introduces New SEMVisionEG2 Family II-29
SUSS MicroTec AG Unveils SUSS PM8WLR ProbeShield System II-30
Advantest Launches New T5501 Memory Test System II-30
Advantest Introduces New T6372 LCD Driver Test System II-30
Advantest Unveils Advanced Mixed-Signal Test System T7722 II-30
Advantest Launches Memory Test System T5377S II-30
Applied Materials Unveils Applied Endura® CuBS II II-31
Applied Materials Introduces QuantumEX ion implanter II-31
MKS Unleashes RGAs of IP Series II-31
KLA-Tencor Launches the eS31 II-31
KLA-Tencor Unveils SpectraCDE00 II-31
Wafer Level Test Solution from Advantest and SUSS MicroTec II-32
ESI Launches Model 9830 Laser Semiconductor Processing System II-32
Unaxis Semiconductors Rolls Out MASK ETCHER IV II-32
SUSS Introduces New Wafer Level LED Test System II-32
Varian Releases Three New Ion Implanters II-32
Nanometrics Offers OCD Metrology Capability on
Nanometrics 9300 Advanced Metrology System II-33
Wafer-Processing Components and Equipment from Secure & Pure II-33
SUSS Unveils New Bonding System II-33
Next-Generation 300mm Process Etching Chamber from TEL II-34
New 300mm Wafer Prober from TEL II-34
TEL and IBM Jointly Develop TERA II-34
TEL and Teseda Introduce DFT System II-35
New Products for Advanced Packaging Metrology from Foothill II-35
Applied Epi Announces Introduction of 2G Molecular Beam Epitaxy Tools II-35
New Orion Family of CVD from Trikon II-36
Nanometrics Introduces an Automated Film Metrology System II-36
Nanometrics Launches NanoUDIETechnology II-37
Trikon Launches Delta fxPEII-37
Trikon Widens Plasma Etch Kitty with Two New Products II-37
Thomas West Unveils New Generation CMP Pads II-38
SpeedFam-IPEC Introduces New Rotational CMP System II-38
SpeedFam-IPEC Releases New Universal CMP System II-39
New Lithography Systems from Silicon Valley Group II-39
Trikon Unveils New Electrostatic Chuck II-40

8. Recent Industry Activity II-41

MKS Instruments to Acquire Ion Systems II-41
Applied Materials Acquires IP and Technology of SCP Global II-41
ASM International Join Hands with IMEC II-41
ASM Pacific in Alliance with Microbonds II-41
Genus Merges with AIXTRON II-41
Trikon to Merge with Aviza Technology II-42
Genus Merges with AIXTRON ADS II-42
Aviza Technology and Trikon Technologies Enter into Merger Agreement II-42
WaferMasters Inc. Acquires the Intellectual Property Rights to SRTF Technology II-42
Applied Materials Collaborates with IMEC II-42
ASM Inks a Licensing Agreement with Veeco II-43
ASML Signs a Licensing Agreement with Toshiba II-43
ESI Selects KVD II-43
Applied Materials Acquires Treatment Systems Business of ATMI II-43
Applied Material Takes Over Metron Technology II-43
ASM International Completes Synergistic Purchase of NuTool, Inc. II-44
ASM International Acquires Ginitech, Ltd. II-44
Novellus Takes Over Angstron Systems, Inc. II-44
Mattson Technology, Inc. Snaps Up Vortek Industries, Ltd. II-44
MKS Forms a Strategic Alliance with Umetrics II-45
Mattson Alliances with TEL II-45
Applied Materials Collaborates with DuPont Photomasks II-45
IMEC Collaborates with ASML II-45
IBM Enters into an Agreement with SUSS II-45
Varian Semiconductor Inks an Agreement with ISE II-46
Cadence Enters into a Licensing Agreement with ASML II-46
SUSS MicroTec Inks Agreement with Unitive II-46
ASM International Plans to Establish Wafer Processing Equipment Plant in Singapore II-46
Lam Research Stops CMP Systems Development II-46
SensoNor Awards Contract to SUSS MicroTec II-47
Adventest Sets Up New Company, Adventest (Thailand) Ltd II-47
Applied Materials Bags Order from UMCi II-47
Mattson Strikes Additional Orders from Samsung II-47
UMCi Selects Varian Semiconductor as High Current Ion Implant Supplier II-47
ITRI Opts New SUSS NPS 200 II-48
Tegal Delivers 6510 Series Critical Silicon Etch System II-48
Varian Ships VIIStaE80HP to a Major Taiwanese 300mm Fab II-48
Oxford Instruments Analytical Acquires Assets of Thermo VG Semicon II-48
TEL forms Strategic Alliance with ASML II-48
Tegal Concludes Purchase Agreement with Simplus Systems II-49
Fairchild Semiconductor Inks Agreements with Lite-On Technology II-49
Oregon Micro Systems Signs a Supply Agreement II-49
Dainippon Screen Enters into an Agreement with ASML Holding II-49
TEL and Nikon Sign Agreement II-49
Adept Technology Receives Wafer Handling Contract from MSP Corporation II-50
SUSS Bags Lithography/Bonding Package Order from microFAB Bremen II-50
Mattson Wins Orders from a Major Taiwanese Foundry II-50
Mattson Receives Additional Orders for Strip Systems II-50
International Sematech Assigns Order for RTP System II-51
Varian Strikes Multiple Orders from Samsung II-51
Axcelis Technologies Bags $18 million Contract from Inotera Memories II-51
Mattson Wins Follow-on Orders for Strip Systems from Tower Semiconductor II-51
Varian Obtains Ion Implant Order II-51
Mattson Strikes Multi-Million Dollar Orders from a Leading European Chipmaker II-51
Varian Receives High and Medium Current Ion Implanter Orders II-52
Electro Scientific Industries Wins Order from a Major Taiwanese 300mm DRAM manufacturer II-52
Genus Gains Purchase Order from a Major US Data Storage Manufacturer II-52
Mattson Receives Multi-Million Order for Strip Systems II-52
Varian Bags Orders from Seven Asian Customers II-52
Implant Sciences Enhances Semiconductor Processing Business to Foray into Chip Production Market II-53
TEL Cuts Workforce II-53
Swagelok Restructures Sales and Service Division II-53
Varian Offers Productivity Plus Upgrade II-53
TEL Consolidates Service and Support Divisions II-53
Tegal Widens Patent Portfolio II-53
TEL Dissolves Consolidated Subsidiary II-54
Tegal Sells EndeavorEUVEPVD Cluster Tool II-54
Varian Ships High-Energy and Medium Current Systems to ASMC II-54
Tegal Sells Endeavor PVD Cluster Tool II-54
SUSS MicroTec Completes Installation of Wafer Bonder II-54
SECAP Completes Installation of 300 mm Electroplated Wafer Bumping Line II-55
Mattson Installs RTP Systems at Elpida Memory's 300 mm Fab II-55
ASE Commences Installation of SUSS Multiple 300 mm Lithography Systems II-55
IMEC Installs New SUSS PAV150 System II-55
AmberWave Signs a Licensing and Development Agreement with Aixtron II-55
Mattson Technology Signs an Agreement with Metron II-56
Lam Research Signs Multi-Million Contract with SMIC II-56
SpeedFam-IPEC Receives Order for its 300-mm CMP Tool II-56
SpeedFam Receives Order for 200-mm MomentumESystem... II-56
ESI Obtains Order for Laser Processing Equipment from GTC II-57
MKS Bags RGA Purchase Order from Dominion II-57
Therma-Wave Establishes a New Sales and Service Office in China II-58
Sela Installs MC600 MicroCleaving System at Hitachi II-58
Nanometrics Releases New Version of its NanoNet Technology II-58
PRI Acquires WaferState Controls, Inc... II-59
TEL Acquires Timbre technologies II-59
Isonics Acquires Silicon-On-Insulator Wafer Business of SEI II-59
CFM Merges with Mattson Technology II-60
Trikon Inks Commercial Supply Agreements with ASM II-60
Nanometrics Receives a Patent for Integrated Metrology II-60
Tegal Bags Follow-On Order from GCT II-61
Inficon Supplies FabGuard Sensor Integration and Analysis System to Sematech II-61
ESI Gains Order for Model 9350 from Dominion II-61
Mattson Receives Multi-Million Orders from European Semiconductor Manufacturer II-62
Applied Materials Establishes a New Facility and Training Center in Shanghai II-62
Tru-Si Gains an Order for its ADP Chemical Dry Etch Equipment II-62
Trikon Bags a New Order from COM DEV for Etch Equipment II-63
Veeco Forms Strategic Alliance with Seagate II-63
CVC Merges with Veeco II-63
Knights Technology Enters Distribution Agreement with SingaTrust II-64
Lam Grabs a US$33 Million Contract from SSMC II-64
SpeedFam Bags Multiple System Order II-64
Trikon Attains PVD and Etch Equipment Orders from TriQuint II-64
Varian Expands Manufacturing Capacity at its UK-Based Plant II-65
SpeedFam-IPEC Expands its Manufacturing Facility in Arizona II-65

9. Focus on Select Players II-66

Advantest (Japan) II-66
Applied Materials, Inc. (USA) II-66
ASM International N.V. (The Netherlands) II-66
ASM Pacific Technology Ltd (China) II-67
ASML Holding NV (The Netherlands) II-67
Canon Inc. (Japan) II-67
Dainippon Screen Mfg.(Japan) II-67
Electro Scientific Industries Inc (USA) II-68
Genus, Inc (USA) II-68
Hitachi High-Technologies Corporation (Japan) II-68
KLA-Tencor Corporation (USA) II-68
Lam Research Corporation (USA) II-69
Mattson Technology, Inc (USA) II-69
MKS Instruments, Inc. (USA) II-69
Nikon Corporation (Japan) II-69
Novellus Systems, Inc. (USA) II-70
STMicroelectronics (Switzerland) II-70
SUSS MicroTec AG (Germany) II-70
Tegal Corporation (USA) II-70
Tokyo Electron Limited (Japan) II-70
Trikon Technologies (UK) II-71
Varian Semiconductor Equipment Associates, Inc (USA) II-71

10. Global Market Perspective II-72

Table 10: World Recent Past, Current & Future Analysis for Semiconductor Processing Equipment by Geographic Region -- US, Canada, Japan, Europe, Asia-Pacific (excluding Japan), and Rest of World Markets Independently Analyzed with Annual Sales Figures in US$ Million for Years 2000 through 2010 (includes corresponding Graph/Chart) II-72
Table 11: World 10-Year Perspective for Semiconductor Processing Equipment by Geographic Region -- Percentage Breakdown of Dollar Sales for US, Canada, Japan, Europe, Asia-Pacific (excluding Japan), and Rest of World Markets for Years 2000, 2005 & 2010 (includes corresponding Graph/Chart) II-72
Table 12: World Recent Past, Current & Future Analysis for CMP Equipment by Geographic Region -- US, Canada, Japan, Europe, Asia-Pacific (excluding Japan), and Rest of World Markets Independently Analyzed with Annual Sales Figures in US$ Million for Years 2000 through 2010 (includes corresponding Graph/Chart) II-73
Table 13: World 10-Year Perspective for CMP Equipment by Geographic Region -- Percentage Breakdown of Dollar Sales for US, Canada, Japan, Europe, Asia-Pacific (excluding Japan), and Rest of World Markets for Years 2000, 2005 & 2010 (includes corresponding Graph/Chart) II-73
Table 14: World Recent Past, Current & Future Analysis for Dielectric CVD Equipment by Geographic Region -- US, Canada, Japan, Europe, Asia-Pacific (excluding Japan), and Rest of World Markets Independently Analyzed with Annual Sales Figures in US$ Million for Years 2000 through 2010 (includes corresponding Graph/Chart) II-74
Table 15: World 10-Year Perspective for Dielectric CVD Equipment by Geographic Region -- Percentage Breakdown of Dollar Sales for US, Canada, Japan, Europe, Asia-Pacific (excluding Japan), and Rest of World Markets for Years 2000, 2005 & 2010 (includes corresponding Graph/Chart) II-74
Table 16: World Recent Past, Current & Future Analysis for Epitaxy Equipment by Geographic Region -- US, Canada, Japan, Europe, Asia-Pacific (excluding Japan), and Rest of World Markets Independently Analyzed with Annual Sales Figures in US$ Million for Years 2000 through 2010 (includes corresponding Graph/Chart) II-75
Table 17: World 10-Year Perspective for Epitaxy Equipment by Geographic Region -- Percentage Breakdown of Dollar Sales for US, Canada, Japan, Europe, Asia-Pacific (excluding Japan), and Rest of World Markets for Years 2000, 2005 & 2010 (includes corresponding Graph/Chart) II-75
Table 18: World Recent Past, Current & Future Analysis for Etch Equipment by Geographic Region -- US, Canada, Japan, Europe, Asia-Pacific (excluding Japan), and Rest of World Markets Independently Analyzed with Annual Sales Figures in US$ Million for Years 2000 through 2010 (includes corresponding Graph/Chart) II-76
Table 19: World 10-Year Perspective for Etch Equipment by Geographic Region -- Percentage Breakdown of Dollar Sales for US, Canada, Japan, Europe, Asia-Pacific (excluding Japan), and Rest of World Markets for Years 2000, 2005 & 2010 (includes corresponding Graph/Chart) II-76
Table 20: World Recent Past, Current & Future Analysis for Furnace and RTP Equipment by Geographic Region -- US, Canada, Japan, Europe, Asia-Pacific (excluding Japan), and Rest of World Markets Independently Analyzed with Annual Sales Figures in US$ Million for Years 2000 through 2010 (includes corresponding Graph/Chart) II-77
Table 21: World 10-Year Perspective for Furnace and RTP Equipment by Geographic Region -- Percentage Breakdown of Dollar Sales for US, Canada, Japan, Europe, Asia-Pacific (excluding Japan), and Rest of World Markets for Years 2000, 2005 & 2010 (includes corresponding Graph/Chart) II-77
Table 22: World Recent Past, Current & Future Analysis for Ion Implant Equipment by Geographic Region -- US, Canada, Japan, Europe, Asia-Pacific (excluding Japan), and Rest of World Markets Independently Analyzed with Annual Sales Figures in US$ Million for Years 2000 through 2010 (includes corresponding Graph/Chart) II-78
Table 23: World 10-Year Perspective for Ion Implant Equipment by Geographic Region -- Percentage Breakdown of Dollar Sales for US, Canada, Japan, Europe, Asia-Pacific (excluding Japan), and Rest of World Markets for Years 2000, 2005 & 2010 (includes corresponding Graph/Chart) II-78
Table 24: World Recent Past, Current & Future Analysis for Lithography Equipment by Geographic Region -- US, Canada, Japan, Europe, Asia-Pacific (excluding Japan), and Rest of World Markets Independently Analyzed with Annual Sales Figures in US$ Million for Years 2000 through 2010 (includes corresponding Graph/Chart) II-79
Table 25: World 10-Year Perspective for Lithography Equipment by Geographic Region -- Percentage Breakdown of Dollar Sales for US, Canada, Japan, Europe, Asia-Pacific (excluding Japan), and Rest of World Markets for Years 2000, 2005 & 2010 (includes corresponding Graph/Chart) II-79
Table 26: World Recent Past, Current & Future Analysis for Wafer Deposition Equipment by Geographic Region -- US, Canada, Japan, Europe, Asia-Pacific (excluding Japan), and Rest of World Markets Independently Analyzed with Annual Sales Figures in US$ Million for Years 2000 through 2010 (includes corresponding Graph/Chart) II-80
Table 27: World 10-Year Perspective for Wafer Deposition Equipment by Geographic Region -- Percentage Breakdown of Dollar Sales for US, Canada, Japan, Europe, Asia-Pacific (excluding Japan), and Rest of World Markets for Years 2000, 2005 & 2010 (includes corresponding Graph/Chart) II-80
Table 28: World Recent Past, Current & Future Analysis for Packaging Equipment by Geographic Region -- US, Canada, Japan, Europe, Asia-Pacific (excluding Japan), and Rest of World Markets Independently Analyzed with Annual Sales Figures in US$ Million for Years 2000 through 2010 (includes corresponding Graph/Chart) II-81
Table 29: World 10-Year Perspective for Packaging Equipment by Geographic Region -- Percentage Breakdown of Dollar Sales for US, Canada, Japan, Europe, Asia-Pacific (excluding Japan), and Rest of World Markets for Years 2000, 2005 & 2010 (includes corresponding Graph/Chart) II-81
Table 30: World Recent Past, Current & Future Analysis for Test and Metrology Equipment by Geographic Region -- US, Canada, Japan, Europe, Asia-Pacific (excluding Japan), and Rest of World Markets Independently Analyzed with Annual Sales Figures in US$ Million for Years 2000 through 2010 (includes corresponding Graph/Chart) II-82
Table 31: World 10-Year Perspective for Test and Metrology Equipment by Geographic Region -- Percentage Breakdown of Dollar Sales for US, Canada, Japan, Europe, Asia-Pacific (excluding Japan), and Rest of World Markets for Years 2000, 2005 & 2010 (includes corresponding Graph/Chart) II-82
Table 32: World Recent Past, Current & Future Analysis for Other Semiconductor Processing Equipment by Geographic Region -- US, Canada, Japan, Europe, Asia-Pacific (excluding Japan), and Rest of World Markets Independently Analyzed with Annual Sales Figures in US$ Million for Years 2000 through 2010 (includes corresponding Graph/Chart) II-83
Table 33: World 10-Year Perspective for Other Semiconductor Processing Equipment by Geographic Region -- Percentage Breakdown of Dollar Sales for US, Canada, Japan, Europe, Asia-Pacific (excluding Japan), and Rest of World Markets for Years 2000, 2005 & 2010 (includes corresponding Graph/Chart) II-83

III. MARKET

1. The United States III-1

A. Market Analysis III-1
Current and Future Analysis III-1
US--Second Largest Semiconductor Equipment Market III-1
Focus on Leading Players III-1
Applied Materials, Inc. III-1
Electro Scientific Industries Inc III-1
Genus, Inc III-2
KLA-Tencor Corporation III-2
Lam Research Corporation III-2
Mattson Technology, Inc III-3
MKS Instruments, Inc. III-3
Novellus Systems, Inc III-3
Tegal Corporation III-3
Varian Semiconductor Equipment Associates, Inc III-4
Product Innovations/Developments III-4
Strategic Developments III-11
B. Market Analytics III-28
Table 34: US Recent Past, Current & Future Analysis for Semiconductor Processing Equipment by Product Segment -- CMP Equipment, Dielectric CVD Equipment, Epitaxy Equipment, Etch Equipment, Furnace and RTP, Ion Implant Equipment, Lithography Equipment, Wafer Deposition Equipment, Packaging Equipment, Test and Metrology Equipment, and Others Markets Independently Analyzed with Annual Sales Figures in US$ Million for Years 2000 through 2010 (includes corresponding Graph/Chart) III-28
Table 35: US 10-Year Perspective for Semiconductor Processing Equipment by Product Segment -- Percentage Breakdown of Dollar Sales for CMP Equipment, Dielectric CVD Equipment, Epitaxy Equipment, Etch Equipment, Furnace and RTP, Ion Implant Equipment, Lithography Equipment, Wafer Deposition Equipment, Packaging Equipment, Test and Metrology Equipment, and Others Markets for 2000, 2005 & 2010 (includes corresponding Graph/Chart) III-29

2. Canada III-30

Market Analysis III-30
Current and Future Analysis III-30
Table 36: Canadian Recent Past, Current & Future Analysis for Semiconductor Processing Equipment by Product Segment -- CMP Equipment, Dielectric CVD Equipment, Epitaxy Equipment, Etch Equipment, Furnace and RTP, Ion Implant Equipment, Lithography Equipment, Wafer Deposition Equipment, Packaging Equipment, Test and Metrology Equipment, and Others Markets Independently Analyzed with Annual Sales Figures in US$ Million for Years 2000 through 2010 (includes corresponding Graph/Chart) III-30
Table 37: Canadian 10-Year Perspective for Semiconductor Processing Equipment by Product Segment -- Percentage Breakdown of Dollar Sales for CMP Equipment, Dielectric CVD Equipment, Epitaxy Equipment, Etch Equipment, Furnace and RTP, Ion Implant Equipment, Lithography Equipment, Wafer Deposition Equipment, Packaging Equipment, Test and Metrology Equipment, and Others Markets for 2000, 2005 & 2010 (includes corresponding Graph/Chart) III-31

3. Japan III-32

A. Market Analysis III-32
Current and Future Analysis III-32
Industry Overview III-32
Market Dynamics III-32
Historic Review III-33
Competitive Factors III-33
Focus on Leading Players III-34
Advantest III-34
Canon Inc III-34
Dainippon Screen Mfg III-34
Hitachi High-Technologies Corporation III-34
Nikon Corporation III-34
Tokyo Electron Limited III-35
Product Innovations/Developments III-35
Strategic Developments III-37
B. Market Analytics III-39
Table 38: Japanese Recent Past, Current & Future Analysis for Semiconductor Processing Equipment by Product Segment -- CMP Equipment, Dielectric CVD Equipment, Epitaxy Equipment, Etch Equipment, Furnace and RTP, Ion Implant Equipment, Lithography Equipment, Wafer Deposition Equipment, Packaging Equipment, Test and Metrology Equipment, and Others Markets Independently Analyzed with Annual Sales Figures in US$ Million for Years 2000 through 2010 (includes corresponding Graph/Chart) III-39
Table 39: Japanese 10-Year Perspective for Semiconductor Processing Equipment by Product Segment -- Percentage Breakdown of Dollar Sales for CMP Equipment, Dielectric CVD Equipment, Epitaxy Equipment, Etch Equipment, Furnace and RTP, Ion Implant Equipment, Lithography Equipment, Wafer Deposition Equipment, Packaging Equipment, Test and Metrology Equipment, and Others Markets for 2000, 2005 & 2010 (includes corresponding Graph/Chart) III-40

4. Europe III-41

Market Analysis III-41
Current and Future Analysis III-41
Table 40: European Recent Past, Current & Future Analysis for Semiconductor Processing Equipment by Geographic Region -- France, Germany, Italy, United Kingdom, Spain, Russia, and Rest of Europe Markets Independently Analyzed with Annual Sales Figures in US$ Million for Years 2000 through 2010 (includes corresponding Graph/Chart) III-41
Table 41: European Recent Past, Current & Future Analysis for Semiconductor Processing Equipment by Product Segment -- CMP Equipment, Dielectric CVD Equipment, Epitaxy Equipment, Etch Equipment, Furnace and RTP, Ion Implant Equipment, Lithography Equipment, Wafer Deposition Equipment, Packaging Equipment, Test and Metrology Equipment, and Others Markets Independently Analyzed with Annual Sales Figures in US$ Million for Years 2000 through 2010 (includes corresponding Graph/Chart) III-42
Table 42: European 10-Year Perspective for Semiconductor Processing Equipment by Geographic Region -- Percentage Breakdown of Dollar Sales for France, Germany, Italy, United Kingdom, Spain, Russia, and Rest of Europe Markets for Years 2000, 2005 & 2010 (includes corresponding Graph/Chart) III-43
Table 43: European 10-Year Perspective for Semiconductor Processing Equipment by Product Segment -- Percentage Breakdown of Dollar Sales for CMP Equipment, Dielectric CVD Equipment, Epitaxy Equipment, Etch Equipment, Furnace and RTP, Ion Implant Equipment, Lithography Equipment, Wafer Deposition Equipment, Packaging Equipment, Test and Metrology Equipment, and Others Markets for 2000, 2005 & 2010 (includes corresponding Graph/Chart) III-44

4a. France III-45

Market Analysis III-45
Current and Future Analysis III-45
Table 44: French Recent Past, Current & Future Analysis for Semiconductor Processing Equipment by Product Segment -- CMP Equipment, Dielectric CVD Equipment, Epitaxy Equipment, Etch Equipment, Furnace and RTP, Ion Implant Equipment, Lithography Equipment, Wafer Deposition Equipment, Packaging Equipment, Test and Metrology Equipment, and Others Markets Independently Analyzed with Annual Sales Figures in US$ Million for Years 2000 through 2010 (includes corresponding Graph/Chart) III-45
Table 45: French 10-Year Perspective for Semiconductor Processing Equipment by Product Segment -- Percentage Breakdown of Dollar Sales for CMP Equipment, Dielectric CVD Equipment, Epitaxy Equipment, Etch Equipment, Furnace and RTP, Ion Implant Equipment, Lithography Equipment, Wafer Deposition Equipment, Packaging Equipment, Test and Metrology Equipment, and Others Markets for 2000, 2005 & 2010 (includes corresponding Graph/Chart) III-46

4b. Germany III-47

A. Market Analysis III-47
Current and Future Analysis III-47
SUSS MicroTec AG -- A Key German Player III-47
Product Innovations/Developments III-47
Strategic Developments III-48
B. Market Analytics III-50
Table 46: German Recent Past, Current & Future Analysis for Semiconductor Processing Equipment by Product Segment -- CMP Equipment, Dielectric CVD Equipment, Epitaxy Equipment, Etch Equipment, Furnace and RTP, Ion Implant Equipment, Lithography Equipment, Wafer Deposition Equipment, Packaging Equipment, Test and Metrology Equipment, and Others Markets Independently Analyzed with Annual Sales Figures in US$ Million for Years 2000 through 2010 (includes corresponding Graph/Chart) III-50
Table 47: German 10-Year Perspective for Semiconductor Processing Equipment by Product Segment -- Percentage Breakdown of Dollar Sales for CMP Equipment, Dielectric CVD Equipment, Epitaxy Equipment, Etch Equipment, Furnace and RTP, Ion Implant Equipment, Lithography Equipment, Wafer Deposition Equipment, Packaging Equipment, Test and Metrology Equipment, and Others Markets for 2000, 2005 & 2010 (includes corresponding Graph/Chart) III-51

4c. Italy III-52

Market Analysis III-52
Current and Future Analysis III-52
Table 48: Italian Recent Past, Current & Future Analysis for Semiconductor Processing Equipment by Product Segment -- CMP Equipment, Dielectric CVD Equipment, Epitaxy Equipment, Etch Equipment, Furnace and RTP, Ion Implant Equipment, Lithography Equipment, Wafer Deposition Equipment, Packaging Equipment, Test and Metrology Equipment, and Others Markets Independently Analyzed with Annual Sales Figures in US$ Million for Years 2000 through 2010 (includes corresponding Graph/Chart) III-52
Table 49: Italian 10-Year Perspective for Semiconductor Processing Equipment by Product Segment -- Percentage Breakdown of Dollar Sales for CMP Equipment, Dielectric CVD Equipment, Epitaxy Equipment, Etch Equipment, Furnace and RTP, Ion Implant Equipment, Lithography Equipment, Wafer Deposition Equipment, Packaging Equipment, Test and Metrology Equipment, and Others Markets for 2000, 2005 & 2010 (includes corresponding Graph/Chart) III-53

4d. The United Kingdom III-54

A. Market Analysis III-54
Current and Future Analysis III-54
Trikon Technologies -- A Key UK Stalwart III-54
Strategic Developments III-54
B. Market Analytics III-56
Table 50: UK Recent Past, Current & Future Analysis for Semiconductor Processing Equipment by Product Segment -- CMP Equipment, Dielectric CVD Equipment, Epitaxy Equipment, Etch Equipment, Furnace and RTP, Ion Implant Equipment, Lithography Equipment, Wafer Deposition Equipment, Packaging Equipment, Test and Metrology Equipment, and Others Markets Independently Analyzed with Annual Sales Figures in US$ Million for Years 2000 through 2010 (includes corresponding Graph/Chart) III-56
Table 51: UK 10-Year Perspective for Semiconductor Processing Equipment by Product Segment -- Percentage Breakdown of Dollar Sales for CMP Equipment, Dielectric CVD Equipment, Epitaxy Equipment, Etch Equipment, Furnace and RTP, Ion Implant Equipment, Lithography Equipment, Wafer Deposition Equipment, Packaging Equipment, Test and Metrology Equipment, and Others Markets for 2000, 2005 & 2010 (includes corresponding Graph/Chart) III-57

4e. Spain III-58

Market Analysis III-58
Current and Future Analysis III-58
Table 52: Spanish Recent Past, Current & Future Analysis for Semiconductor Processing Equipment by Product Segment -- CMP Equipment, Dielectric CVD Equipment, Epitaxy Equipment, Etch Equipment, Furnace and RTP, Ion Implant Equipment, Lithography Equipment, Wafer Deposition Equipment, Packaging Equipment, Test and Metrology Equipment, and Others Markets Independently Analyzed with Annual Sales Figures in US$ Million for Years 2000 through 2010 (includes corresponding Graph/Chart) III-58
Table 53: Spanish 10-Year Perspective for Semiconductor Processing Equipment by Product Segment -- Percentage Breakdown of Dollar Sales for CMP Equipment, Dielectric CVD Equipment, Epitaxy Equipment, Etch Equipment, Furnace and RTP, Ion Implant Equipment, Lithography Equipment, Wafer Deposition Equipment, Packaging Equipment, Test and Metrology Equipment, and Others Markets for 2000, 2005 & 2010 (includes corresponding Graph/Chart) III-59

4f. Russia III-60

Market Analysis III-60
Current and Future Analysis III-60
Table 54: Russian Recent Past, Current & Future Analysis for Semiconductor Processing Equipment by Product Segment -- CMP Equipment, Dielectric CVD Equipment, Epitaxy Equipment, Etch Equipment, Furnace and RTP, Ion Implant Equipment, Lithography Equipment, Wafer Deposition Equipment, Packaging Equipment, Test and Metrology Equipment, and Others Markets Independently Analyzed with Annual Sales Figures in US$ Million for Years 2000 through 2010 (includes corresponding Graph/Chart) III-60
Table 55: Russian 10-Year Perspective for Semiconductor Processing Equipment by Product Segment -- Percentage Breakdown of Dollar Sales for CMP Equipment, Dielectric CVD Equipment, Epitaxy Equipment, Etch Equipment, Furnace and RTP, Ion Implant Equipment, Lithography Equipment, Wafer Deposition Equipment, Packaging Equipment, Test and Metrology Equipment, and Others Markets for 2000, 2005 & 2010 (includes corresponding Graph/Chart) III-61

4g. Rest of Europe III-62

A. Market Analysis III-62
Current and Future Analysis III-62
Focus on Leading Players III-62
ASM International N.V. (The Netherlands) III-62
ASML Holding NV (The Netherlands) III-62
STMicroelectronics (Switzerland) III-63
Strategic Developments III-63
B. Market Analytics III-65
Table 56: Rest of Europe Market for Semiconductor Processing Equipment -- Recent Past, Current & Future Analysis by Product Segment for CMP Equipment, Dielectric CVD Equipment, Epitaxy Equipment, Etch Equipment, Furnace and RTP, Ion Implant Equipment, Lithography Equipment, Wafer Deposition Equipment, Packaging Equipment, Test and Metrology Equipment, and Others Markets Independently Analyzed with Annual Sales Figures in US$ Million for Years 2000 through 2010 (includes corresponding Graph/Chart) III-65
Table 57: Rest of Europe10-Year Perspective for Semiconductor Processing Equipment by Product Segment -- Percentage Breakdown of Dollar Sales for CMP Equipment, Dielectric CVD Equipment, Epitaxy Equipment, Etch Equipment, Furnace and RTP, Ion Implant Equipment, Lithography Equipment, Wafer Deposition Equipment, Packaging Equipment, Test and Metrology Equipment, and Others Markets for 2000, 2005 & 2010 (includes corresponding Graph/Chart) III-66

5. Asia-Pacific III-67

A. Market Analysis III-67
Current and Future Analysis III-67
Asia-Pacific -- Mirroring Growth III-67
Strategic Developments III-67
B. Market Analytics III-69
Table 58: Asia-Pacific Market for Semiconductor Processing Equipment -- Recent Past, Current & Future Analysis by Geographic Region for Taiwan, Korea, and Rest of Asia-Pacific Markets Independently Analyzed with Annual Sales Figures in US$ Million for Years 2000 through 2010 (includes corresponding Graph/Chart) III-69
Table 59: Asia-Pacific Market for Semiconductor Processing Equipment -- Recent Past, Current & Future Analysis by Product Segment for CMP Equipment, Dielectric CVD Equipment, Epitaxy Equipment, Etch Equipment, Furnace and RTP, Ion Implant Equipment, Lithography Equipment, Wafer Deposition Equipment, Packaging Equipment, Test and Metrology Equipment, and Others Markets Independently Analyzed with Annual Sales Figures in US$ Million for Years 2000 through 2010 (includes corresponding Graph/Chart) III-70
Table 60: Asia-Pacific 10-Year Perspective for Semiconductor Processing Equipment by Geographic Region -- Percentage Breakdown of Dollar Sales for Taiwan, Korea, and Rest of Asia-Pacific Markets for 2000, 2005 & 2010 (includes corresponding Graph/Chart) III-71
Table 61: Asia-Pacific 10-Year Perspective for Semiconductor Processing Equipment by Product Segment -- Percentage Breakdown of Dollar Sales for CMP Equipment, Dielectric CVD Equipment, Epitaxy Equipment, Etch Equipment, Furnace and RTP, Ion Implant Equipment, Lithography Equipment, Wafer Deposition Equipment, Packaging Equipment, Test and Metrology Equipment, and Others Markets for 2000, 2005 & 2010 (includes corresponding Graph/Chart) III-72

5a. Taiwan III-73

Market Analysis III-73
Current and Future Analysis III-73
Table 62: Taiwanese Market for Semiconductor Processing Equipment -- Recent Past, Current & Future Analysis by Product Segment for CMP Equipment, Dielectric CVD Equipment, Epitaxy Equipment, Etch Equipment, Furnace and RTP, Ion Implant Equipment, Lithography Equipment, Wafer Deposition Equipment, Packaging Equipment, Test and Metrology Equipment, and Others Markets Independently Analyzed with Annual Sales Figures in US$ Million for Years 2000 through 2010 (includes corresponding Graph/Chart) III-73
Table 63: Taiwanese 10-Year Perspective for Semiconductor Processing Equipment by Product Segment -- Percentage Breakdown of Dollar Sales for CMP Equipment, Dielectric CVD Equipment, Epitaxy Equipment, Etch Equipment, Furnace and RTP, Ion Implant Equipment, Lithography Equipment, Wafer Deposition Equipment, Packaging Equipment, Test and Metrology Equipment, and Others Markets for 2000, 2005 & 2010 (includes corresponding Graph/Chart) III-74

5b. Korea III-75

A. Market Analysis III-75
Current and Future Analysis III-75
Korean Semiconductor Equipment Market III-75
Historical Background III-75
Players in the Market III-76
B. Market Analytics III-77
Table 64: Korean Market for Semiconductor Processing Equipment -- Recent Past, Current & Future Analysis by Product Segment for CMP Equipment, Dielectric CVD Equipment, Epitaxy Equipment, Etch Equipment, Furnace and RTP, Ion Implant Equipment, Lithography Equipment, Wafer Deposition Equipment, Packaging Equipment, Test and Metrology Equipment, and Others Markets Independently Analyzed with Annual Sales Figures in US$ Million for Years 2000 through 2010 (includes corresponding Graph/Chart) III-77
Table 65: Korean 10-Year Perspective for Semiconductor Processing Equipment by Product Segment -- Percentage Breakdown of Dollar Sales for CMP Equipment, Dielectric CVD Equipment, Epitaxy Equipment, Etch Equipment, Furnace and RTP, Ion Implant Equipment, Lithography Equipment, Wafer Deposition Equipment, Packaging Equipment, Test and Metrology Equipment, and Others Markets for 2000, 2005 & 2010 (includes corresponding Graph/Chart) III-78

5c. Rest of Asia-Pacific III-79

A. Market Analysis III-79
Current and Future Analysis III-79
Developing Economies Spur Demand III-79
China -- A Burgeoning Market III-79
B. Market Analytics III-80
Table 66: Rest of Asia-Pacific Market for Semiconductor Processing Equipment -- Recent Past, Current & Future Analysis by Product Segment for CMP Equipment, Dielectric CVD Equipment, Epitaxy Equipment, Etch Equipment, Furnace and RTP, Ion Implant Equipment, Lithography Equipment, Wafer Deposition Equipment, Packaging Equipment, Test and Metrology Equipment, and Others Markets Independently Analyzed with Annual Sales Figures in US$ Million for Years 2000 through 2010 (includes corresponding Graph/Chart) III-81
Table 67: Rest of Asia-Pacific 10-Year Perspective for Semiconductor Processing Equipment by Product Segment -- Percentage Breakdown of Dollar Sales for CMP Equipment, Dielectric CVD Equipment, Epitaxy Equipment, Etch Equipment, Furnace and RTP, Ion Implant Equipment, Lithography Equipment, Wafer Deposition Equipment, Packaging Equipment, Test and Metrology Equipment, and Others Markets for 2000, 2005 & 2010 (includes corresponding Graph/Chart) III-81

6. Rest of World III-82

Market Analysis III-82
Current and Future Analysis III-82
Table 68: Rest of World Market for Semiconductor Processing Equipment -- Recent Past, Current & Future Analysis by Product Segment for CMP Equipment, Dielectric CVD Equipment, Epitaxy Equipment, Etch Equipment, Furnace and RTP, Ion Implant Equipment, Lithography Equipment, Wafer Deposition Equipment, Packaging Equipment, Test and Metrology Equipment, and Others Markets Independently Analyzed with Annual Sales Figures in US$ Million for Years 2000 through 2010 (includes corresponding Graph/Chart) III-82
Table 69: Rest of World 10-Year Perspective for Semiconductor Processing Equipment by Product Segment -- Percentage Breakdown of Dollar Sales for CMP Equipment, Dielectric CVD Equipment, Epitaxy Equipment, Etch Equipment, Furnace and RTP, Ion Implant Equipment, Lithography Equipment, Wafer Deposition Equipment, Packaging Equipment, Test and Metrology Equipment, and Others Markets for 2000, 2005 & 2010 (includes corresponding Graph/Chart) III-83

IV. COMPETITION

1. ADE Corporation (USA) IV-1
Table 70: Annual Sales Analysis: 2003-2004 (In US$ million) IV-1
Table 71: Annual Sales Analysis by Geographic Region: 2003-2004 (In US$ million) IV-2
Table 72: Quarterly Sales Analysis: 2003-2004 (In US$ million) IV-2
2. Advanced Energy Industries UK Ltd. (UK) IV-5
3. Advanced Systems Automation Ltd. (Singapore) IV-5
4. Advantest Corporation (Japan) IV-6
5. AEM-Evertech Holdings Ltd. (Singapore) IV-7
6. Agilent Technologies, Inc. (USA) IV-8
Table 73: First Quarter Sales Analysis: 2004-2005 (Q1) (In US$ million) IV-10
Table 74: Annual Sales Analysis by Geographic Region: 2004-2005 (Q1) (In US$ million) IV-11
Table 75: Annual Sales Analysis: 2003-2004 (In US$ million) IV-11
Table 76: Annual Sales Analysis by Quarter: 2003-2004 (In US$ million) IV-11
Table 77: Annual Sales Analysis by Segment: 2003-2004 (In US$ million) IV-12
Table 78: Annual Sales Analysis by Geographical Region: 2003-2004 (In US$ million) IV-12
7. Aixtron AG (Germany) IV-22
Table 79: First Quarter Sales Analysis: 2004-2005 (Q1) (In € million) IV-23
Table 80: Annual Sales Analysis: 2003-2004 (In € million) IV-23
Table 81: Annual Sales Analysis by Geographic Region: 2003-2004 (In € million) IV-23
8. Akrion LLC (USA) IV-30
9. Alphasem AG (Switzerland) IV-32
10. Amtech Systems, Inc. (USA) IV-33
Hoffman, P. R., Machine Products (USA) IV-33
11. Applied Materials (USA) IV-34
Table 82: Nine Months Sales Analysis: 2005-2004 (Nine Months Ended, July) (In US$ million) IV-35
Table 83: Nine Months Sales Analysis by Geographic Region: 2004-2005 (Nine Months Ended, July) (In US$ million) IV-35
Table 84: Annual Sales Analysis: 2003-2004 (In US$ million) IV-36
Table 85: Annual Sales Analysis by Geographic Region: 2003-2004 (In US$ million) IV-36
Applied Materials France Sarl (France) IV-48
Applied Materials GmbH (Germany) IV-48
Applied Materials Ireland (Ireland) IV-49
Applied Materials Israel Ltd. (Israel) IV-49
Applied Materials Italy Srl (Italy) IV-49
Applied Materials Korea Co., Ltd. (Korea) IV-50
Table 86: Quarterly Sales Analysis: 2004-2005 (Q1) (In US$ billion) IV-50
Table 87: Quarterly Sales Analysis: 2004-2003 (In US$ billion) IV-50
Applied Materials Ltd. (UK) IV-53
12. Ase Test, Inc. (Taiwan) IV-54
13. ASM International NV (The Netherlands) IV-55
ASM Assembly Products BV (The Netherlands) IV-57
14. ASML Holding NV (The Netherlands) IV-58
15. Assembleon Singapore Pte., Ltd. (Singapore) IV-59
16. Astec Halbleitertechnologie GmbH (Germany) IV-60
17. ASTI Holdings Limited (Singapore) IV-61
18. Asyst Technologies, Inc. (USA) IV-62
19. ATMI, Inc. (USA) IV-63
Table 88: First Quarter Sales Analysis: 2004-2005 (Q1) (In US$ million) IV-63
Table 89: Annual Sales Analysis: 2003-2004 (In US$ million) IV-64
Table 90: Quarterly Sales Analysis: 2003-2004 (In US$ million) IV-64
Table 91: Annual Sales Analysis by Geographic Region: 2003-2004 (In US$ million) IV-64
20. August Technology Corporation (USA) IV-69
21. Automated Environmental Solutions, Inc. (USA) IV-69
22. Axcelis Technologies, Inc. (USA) IV-70
23. Axic, Inc. (USA) IV-74
24. Brankamp (UK) Ltd. (UK) IV-79
25. Brewer Science, Inc. (USA) IV-80
26. Brooks Automation, Inc. (USA) IV-85
27. Cabot Microelectronics Corporation (USA) IV-86
28. Calx, Inc. (USA) IV-87
29. Canary Technology Services, Inc. (USA) IV-87
30. Canon, Inc. (Japan) IV-88
Table 92: First Quarter Sales Analysis: 2004-2005 (Q1) (In ¥ billion) IV-89
Table 93: First Quarter Sales Analysis by Product: 2004-2005 (Q1) (In ¥ billion) IV-89
Table 94: First Quarter Sales Analysis by Geographic Region: 2004-2005 (Q1) (In ¥ billion) IV-89
Table 95: Annual Sales Analysis: 2003-2004 (In ¥ billion) IV-90
Table 96: Annual Sales Analysis by Product: 2003-2004 (In ¥ billion) IV-90
Table 97: Annual Sales Analysis by Geographic Region: 2003-2004 (In ¥ billion) IV-90
Canon USA, Inc. (USA) IV-92
Canon Semiconductor Equipment Division (USA) IV-96
31. CHA Industries, Inc. (USA) IV-97
32. Chart Applied Technologies (USA) IV-98
33. Chelmsford Precision Services (UK) IV-98
34. Credence System Corporation (USA) IV-99
35. Cuel Inspection (UK) IV-100
36. Cybeq Systems (USA) IV-100
37. Dainippon Screen Mfg. Co., Ltd. (Japan) IV-101
38. Daitron, Inc. (USA) IV-105
39. Dallas Ceramics, Inc. (USA) IV-105
40. Dexon Mfg., Div. of La Calhene, Inc. (USA) IV-105
41. Diagnosys Ltd. (UK) IV-106
42. Dpveen Co., Inc. (USA) IV-106
43. E & M Designs (UK) IV-106
44. E/G Electro-Graph, Inc. (USA) IV-107
45. Ebara Technologies, Inc. (USA) IV-108
46. Egyptian Micro Electronic Manufacturing (Egypt) IV-109
47. Electro Scientific Industries, Inc. (USA) IV-110
48. Electroglas, Inc. (USA) IV-114
49. Electronic Micro Systems Ltd. (UK) IV-116
50. Elite Automatic Co., Ltd. (Taiwan) IV-117
51. EMC Industries (USA) IV-117
52. Entegris, Inc. (USA) IV-118
53. Envirco Corporation (USA) IV-118
54. ESC International (USA) IV-119
55. Ets Eberle SA (France) IV-119
56. F & K Delvotec Bondtechnik GmbH & Co., Kg. (Singapore) IV-119
57. Fala Technologies, Inc. (USA) IV-119
58. FEI Company (USA) IV-120
59. Fluidix, Inc. (USA) IV-120
60. Fortrend Corporation (USA) IV-121
61. FSI International, Inc. (USA) IV-122
Table 98: Half Yearly Sales Analysis: 2004-2005 (H1) (In US$ million) IV-123
Table 99: Annual Sales Analysis: 2003-2004 (In US$ million) IV-123
62. Gallant Precision Machining Co., Ltd. (Taiwan) IV-125
63. General Production Devices (USA) IV-126
64. Genmark Automation Inc (USA). IV-126
65. Genus, Inc. (USA) IV-127
66. Gitup Industries Corporation (Taiwan) IV-128
67. Graphite Die Mold, Inc. (USA) IV-128
68. H-Square (USA) IV-129
69. Harmonic Drive Technologies - Teijin Seiko Boston, Inc. (USA) IV-130
70. Hitachi High-Technologies Corporation (Japan) IV-133
Table 100: Annual Sales Analysis: 2004-2005 (In ¥ billion) IV-133
Table 101: Annual Sales Analysis By Business Segment: 2004-2005 (In ¥ billion) IV-133
Table 102: Annual Sales Analysis by Geographic Region: 2004-2005 (In ¥ billion) IV-134
71. Honeywell Electronic Materials (USA) IV-135
72. Horiba, Ltd. (Japan) IV-136
73. Hualon Microelectronics Corporation (Taiwan) IV-141
74. Ibis Technology Corporation (USA) IV-142
75. Icos Vision Systems NV (Belgium) IV-144
76. Imtec Acculine, Inc. (USA) IV-147
77. Integrated Dynamics Engineering, Inc. (USA) IV-149
78. Integrated Materials, Inc. (USA) IV-150
79. Intergen, Inc. (USA) IV-150
80. International Micro Industries, Inc. (USA) IV-151
81. Ishii Tool & Engineering Corporation (Japan) IV-151
82. Isotech Design, Inc. (USA) IV-152
83. IVS, Inc. (USA) IV-152
84. Iwaki Semiconductor Co., Ltd. (Japan) IV-152
Waki Walchem Corporation (USA) IV-153
85. Iwatani International Corporation (Japan) IV-156
86. JM Industries, Inc. (USA) IV-158
87. Jade Corp., The (USA) IV-159
88. JC'S Chunson Limited (Taiwan) IV-159
89. Jeol Ltd. (Japan) IV-160
Table 103: Annual Sales Analysis: 2003-2005 (In ¥ billion) IV-161
Table 104: Annual Sales Analysis by Segment: 2004-2005 (In ¥ billion) IV-161
Table 105: Annual Sales Analysis by Geographic Region: 2004-2005 (In ¥ billion) IV-161
Table 106: Annual Sales Analysis by Segment: 2003-2004 (In ¥ billion) IV-161
Table 107: Annual Sales Analysis by Geographic Region: 2003-2004 (In ¥ billion) IV-161
Jeol USA, Inc. (USA) IV-166
Jeol (Europe) SA (France) IV-167
Jeol (UK) Ltd. (UK) IV-169
90. Jipelec SA (France) IV-170
91. Jon Goldman Associates, Inc. (USA) IV-170
92. JYI Hwang Shing Electric & Machinery Co. (Taiwan) IV-171
93. KA Shin Techonologies (S) Pte., Ltd (Singapore). IV-171
94. Karl Suss France SA (France) IV-171
95. Kawasho Corporation (Japan) IV-172
96. Keteca Singapore Pte., Ltd. (Singapore) IV-174
97. Kinetico-Engineered System Division (USA) IV-174
98. Kingroup Automation Industry Corporation (Taiwan) IV-175
99. Kissler GmbH (Germany) IV-175
100. KLA-Tencor Corporation (USA) IV-176
Table 108: Annual Sales Analysis: 2004-2005 (In US$ million) IV-176
Table 109: Annual Sales Analysis by Geographic Region: 2004-2005 (In US$ million) IV-177
KLA. - Tencor (Israel) IV-179
KLA Tencor France Sarl (France) IV-179
101. Kovex Corporation (USA) IV-180
102. Koyo Densyo Co., Ltd. (Japan) IV-180
103. Koyo Thermo Systems Co., Ltd. (Japan) IV-180
104. Kulicke & Soffa Industries, Inc. (USA) IV-181
Kulicke & Soffa (Israel) Ltd. (Israel) IV-186
Kulicke & Soffa Singapore, Inc. (Singapore) IV-186
Micro-Swiss, Ltd. (Israel) IV-187
105. Kurt J. Lesker Company (USA) IV-188
106. Kyocera Industrial Ceramics Corporation (USA) IV-194
107. Kyushu Electronics Systems Inc (Japan). IV-195
108. La Mantia Machine Co., Inc. (USA) IV-196
109. Lam Research Corporation (USA) IV-197
Table 110: Annual Sales Analysis: 2004-2005 (In US$ million) IV-197
Table 111: Annual Sales Analysis by Geographic Region: 2004-2005 (In US$ million) IV-198
Lam Research Korea Ltd. (Korea) IV-199
110. Lapmaster International (USA) IV-200
111. Lintec Singapore Pte., Ltd. (Singapore) IV-200
112. Long-Light Machinery Co., Ltd. (TAIWAN) IV-201
113. Lorlin Test Systems (USA) IV-201
114. LTX Corporation (USA) IV-202
115. Ludl Electronic Products Ltd. (USA) IV-203
116. M Tech Co., Ltd. (Japan) IV-203
117. Machining Solutions Corporation (USA) IV-204
118. Mania Tecnologie Italia, SpA (Italy) IV-204
119. Manufacturing Integration Technology Pte., Ltd. (Singapore) IV-204
120. Materials Development Corporation (USA) IV-205
121. Mattson Technology, Inc. (USA) IV-206
Table 112: First Quarter Sales Analysis: 2004-2005 (Q1) (In US$ million) IV-207
Table 113: Annual Sales Analysis: 2003-2004 (In US$ million) IV-207
Mattson International GmbH (Germany) IV-209
Mattson Technology Ltd. (UK) IV-209
Mattson Thermal Products GmbH (Germany) IV-209
122. MC-Soft, MEler (Switzerland) IV-210
123. Mechatronic Systemtechnik GmbH (Austria) IV-211
124. Mesa West, Inc. (USA) IV-212
125. Metro Automation, Inc. (USA) IV-213
126. Metron Technology, Inc. (USA) IV-213
127. MFM Technology, Inc. (USA) IV-214
128. MGI Electronics, Inc . (USA) IV-214
129. Microspec Technologies Ltd. (Israel) IV-215
130. MKS Instruments, Inc. (USA) IV-216
Table 114: Half Yearly Sales Analysis: 2004-2005 (H1) (In US$ million) IV-216
Table 115: Annual Sales Analysis: 2003-2004 (In US$ million) IV-217
Table 116: Annual Sales Analysis by Geographic Region: 2003-2004 (In US$ million) IV-217
131. Modular Process Technology Corporation (USA) IV-220
132. Montreal Hydraulique, Inc. (Canada) IV-221
133. Moore Technologies (USA) IV-222
134. MRL Industries (USA) IV-223
135. Mykrolis Corporation (USA) IV-224
Table 117: First Half Sales Analysis: 2004-2005 (H1) (In US$ million) IV-224
Table 118: Quarterly Sales Analysis: 2003-2004 (In US$ million) IV-224
136. N&K Technology, Inc. (USA) IV-228
137. Mnano-Master, Inc (USA). IV-228
138. Newport Corporation (USA) IV-229
139. Nikon Corporation (Japan) IV-230
Nikon Precision Europe GmbH (Germany) IV-234
140. Nor-Cal Products, Inc. (USA) IV-235
141. Nova Measuring Instruments Ltd. (Isarael) IV-235
142. Novellus Systems, Inc. (USA) IV-236
143. Ontra Co., Ltd. (Taiwan) IV-239
144. Orbis Technologies Ltd. (UK) IV-240
145. ORC Science, Inc. (USA) IV-240
146. Oxford Instruments PLC (UK) IV-241
Table 119: Annual Sales Analysis: 2003-2005 (In UK£ million) IV-243
Table 120: Annual Sales Analysis by Segment: 2003 --2004 (In £ million) IV-243
Table 121: Annual Geographical Sales Analysis: 2003-2004 (In £ million) IV-243
147. Oxford Plasma Technology Ltd. (UK) IV-264
148. Ozone Engineering, Inc. (USA) IV-264
149. Pacific Western Systems, Inc. (USA) IV-265
150. Pall Corporation (USA) IV-266
151. Pentadyne-Pentaflex, Inc. (USA) IV-267
152. Pfeiffer Vacuum (Schweiz) AG (Switzerland) IV-268
153. Photronics, Inc. (USA) IV-269
154. Pillar Industries (USA) IV-270
155. PKL (Korea) IV-271
156. Planar Concern of Precise Ingineering State Research Ent. (Belarus) IV-272
157. Plasma-Therm, Inc. (USA) IV-272
158. Plassys SA (France) IV-273
159. Polaron CVT Ltd. (England) IV-274
160. Poly Design, Inc. (USA) IV-278
161. Poly-Flow Engineering, Inc. (USA) IV-279
162. PPI Technologies, Inc. (USA) IV-281
163. Precision Group (UK) IV-282
164. Presi (France) IV-283
165. Pro-Line (USA) IV-283
166. Pyramid engineering services co. Ltd (UK). IV-284
167. Quantronix Inc (USA). IV-284
168. Quart Comercial E Industrial Ltda . (Brazil) IV-285
169. Quintel Corporation (USA) IV-285
170. Regroup Industries, Inc. (USA) IV-285
171. Resec Systems, Inc. (USA) IV-286
172. Riber SA (France) IV-286
173. Rite Track, Inc. (USA) IV-287
174. Ritter & Co. Anlagenbau GmbH (Germany) IV-290
175. Rmb Products, Inc. (USA) IV-290
176. Robotic Vision Systems, Inc. (USA) IV-291
177. Rodel Europe GmbH (Germany) IV-293
178. Rofin-Baasel, Inc. (USA) IV-294
179. Rudolph Technologies, Inc. (USA) IV-295
180. Sagitta Israel Ltd. (Israel) IV-299
181. Saint Eloi Mecanique Outillage (France) IV-300
182. Saint-Gobain Quartz (USA) IV-301
183. Samco International, Inc. (USA) IV-307
184. Ismeca Europe SA (Switzerland) IV-308
185. Scientific Systems Ltd. (Ireland) IV-308
186. SCP Global Technologies, Inc. (USA) IV-309
187. Semes Co., Ltd. (Korea) IV-311
188. Semiconductor Equipment Corporation (USA) IV-311
189. Semitool, Inc. (USA) IV-312
190. SEZ Holding Ltd. (Switzerland) IV-320
Table 122: Annual Sales Analysis: 2003-2004 (In CHF thousand) IV-320
Table 123: Annual Sales Analysis by Geographic Segment: 2003-2004 (In CHF thousand) IV-321
SEZ AG (Austria) IV-323
SEZ America, Inc. (USA) IV-323
191. SGL Carbon Corporation (USA) IV-324
192. Shinko Electric Co., Ltd. (Japan) IV-325
193. Sierra Instruments, Inc. (USA) IV-327
194. Sinkusu Co., Ltd. (Japan) IV-328
195. SNR System Pte., Ltd. (Singapore) IV-329
196. Socem-Elec (France) IV-329
197. Solent Semiconductor Services Ltd. (UK) IV-330
198. Solid State Equipment Corporation (USA) IV-331
199. Solitec Wafer Processing, Inc (USA). IV-336
200. Soung Yih Machinery Ind Co., Ltd. (Taiwan) IV-336
201. Speciality Coating Systems, Inc. (USA) IV-337
202. Speed Line Accel (USA) IV-339
203. Speedfam-Ipec, Inc. (USA) IV-340
204. Speedline Technologies, Inc. (USA) IV-343
Speedline Technologies GmbH (Germany) IV-343
205. SPT Asia Pte., Ltd (Singapore). IV-344
206. Stainless Design Corporation (USA) IV-344
207. Stangl Semiconductor Equipment AG (Germany) IV-345
208. Steag AG (Germany) IV-347
Table 124: Annual Sales Analysis: 2003-2004 (In € million) IV-347
Table 125: Annual Sales Analysis by Business Segment: 2003-2004 (In € million) IV-347
Steag Hamatech AG (Germany) IV-350
Steag Microtech GmbH (Germany) IV-351
Steag RTP Systems (USA) IV-352
Steag RTP Systems GmbH IV-352
209. STK Technorogy Co., Ltd. (Japan) IV-353
210. STMicroelectronics NV (Switzerland) IV-354
Table 126: Half Yearly Sales Analysis: 2004-2005 (H1) (In US$ million) IV-359
Table 127: Annual Sales Analysis: 2003-2004 (In US$ million) IV-359
211. Strasbaugh (USA) IV-363
212. Super Components (Singapore) Pte Ltd (Singapore) IV-364
213. Supin Ent Co., Ltd. (Taiwan) IV-365
214. Surface Technology Systems PLC (UK) IV-366
215. Suss MicroTec AG (Germany) IV-369
Suss MicroTec AG (Germany) IV-371
216. T & C Plastic Drain Co., Inc. (USA) IV-372
217. Taiyo Techno Ltd. (Japan) IV-372
218. Teca-Print USA Corporation (USA) IV-373
219. Tech, Inc. (USA) IV-373
220. Technical Glass Products, Inc. (USA) IV-373
221. Tec-Sem AG (Switzerland) IV-374
222. Tecvac Ltd. (UK) IV-376
223. Tegal Corporation (USA) IV-377
Table 128: Annual Sales Analysis: 2004-2005 (In US$ Million) IV-377
Table 129: Annual Sales Analysis by Geographical Region: 2003-2004 (In US $ Million) IV-377
224. Tek Pak, Inc. (USA) IV-379
225. Tektronix Espaola SA (Spain) IV-380
226. Tek-Vac Industries, Inc. (USA) IV-381
227. Teradyne, Inc. (USA) IV-382
228. Terra Universal, Inc. (USA) IV-386
229. Test Innovation SA (France) IV-387
230. Tevet Process Control Technologies Ltd. (Israel) IV-387
231. Thermal Circuits, Inc. (USA) IV-388
232. Therma-Wave, Inc. (USA) IV-389
233. Thermocraft, Inc. (USA) IV-390
234. Tiyoda-Serec Corporation (USA) IV-390
235. Tokyo Craft Co., Ltd. (Japan) IV-391
236. Tokyo Electron Limited (Japan) IV-392
Table 130: Nine Months Sales Analysis: 2004-2005 (Nine Months Ended December) (In ¥ billion) IV-393
Table 131: Annual Sales Analysis: 2003-2004 (In ¥ billion) IV-393
Tokyo Electron Arizona, Inc. (USA) IV-396
Tokyo Electron Europe Ltd . (UK) IV-396
237. Tokyo Seimitsu Co., Ltd. (Japan) IV-397
238. Ton San Machinery Corporation (Taiwan) IV-398
239. Torr International, Inc. (USA) IV-398
240. Tosei Engineering Corporation (Japan) IV-399
241. Trikon Technologies, Inc. (UK) IV-400
Table 132: Half Yearly Sales Analysis: 2004-2005 (H1) (In US$ million) IV-400
Table 133: Annual Sales Analysis: 2003-2004 (In US$ million) IV-401
Trikon Technologies, Inc . (UK) IV-402
Trikon Technologies SARL (France) IV-402
242. TSI Protherm (USA) IV-403
243. U.S. Dynamics Corporation (USA) IV-403
244. Ultra Beam Lithography (USA) IV-404
245. Ultron Systems, Inc. (USA) IV-404
246. Ulvac Technologies, Inc. (USA) IV-405
247. Unaxis Holding, Inc. (Switzerland) IV-408
Table 134: Half Yearly Sales Analysis: 2005-2004 (H1) (In CHF million) IV-409
Table 135: Half Yearly Sales Analysis By Segments (H1): 2005-2004 (In CHF million) IV-409
Table 136: Annual Sales Analysis: 2003-2004 (In CHF million) IV-409
Unaxis Assembly & Packaging (Switzerland) IV-410
Unaxis Balzers Ltd-Balzers Ltd. (Switzerland) IV-412
Unaxis France SA (France) IV-414
Unaxis Wafer Processing (USA) IV-415
248. Ushio America, Inc. (USA) IV-416
249. Vaco Micro Technologies (France) IV-416
250. Varian Semiconductor Equipment Associates, Inc. (USA) IV-417
Table 137: Nine Months Sales Analysis: 2004-2005 (Nine Months Ended in July) (In US$ million) IV-417
Table 138: Nine Months Sales Analysis by Segment: 2004-2005 (Nine Months Ended in July) (In US$ million) IV-418
Table 139: Annual Sales Analysis: 2003-2004 (In US$ million) IV-418
251. Veeco Instruments, Inc. (USA) IV-419
Veeco Instruments Ltd. (UK) IV-422
252. Versatronics (UK) IV-423
253. Victor Associates, Inc. (USA) IV-423
254. VIP Air Conditioning, Inc. (USA) IV-423
255. Vitechnology (France) IV-424
256. Vortek Industries Ltd. (Canada) IV-424
257. Wafer Processing Systems (USA) IV-424
258. Wafermasters, Inc. (USA) IV-425
259. Watkins Johnson International Japan Co., Ltd. (Japan) IV-425
260. Watlow Electric Manufacturing Company (USA) IV-426
261. Wavemat, Inc. (USA) IV-426
262. Wentworth Laboratories Ltd. (UK) IV-427
263. Wild GesmbH (Austria) IV-429
264. Winfield Tech., Inc. (USA) IV-429
265. Wire Cut Company, Inc. (USA) IV-430
266. World Circuit Technology, Inc. (USA) IV-431
267. Xandex, Inc. (USA) IV-432
268. Xi'an Changfeng Science & Technology Industrial Co . (China) IV-434
269. Xi'an Renown Electronics Co., Ltd. (China) IV-434
270. Xiron, Inc. (USA) IV-434
271. Yeagle Technology, Inc. (USA) IV-435
272. Yield Engineering Systems Inc (USA). IV-435
273. Yi-Zone Co., Ltd. (Taiwan) IV-435
274. Ziemann & Urban GmbH (Germany) IV-436
275. Zilix Technologies Pte., Ltd. (Singapore) IV-436
276. Zygo Corporation (USA) IV-437

Semiconductor Processing Equipment

Table of Contents

I. INTRODUCTION, METHODOLOGY & PRODUCT DEFINITIONS

II. EXECUTIVE SUMMARY

1. Outlook II-1

2. Semiconductor Industry Overview II-3

3. Semiconductor Equipment Market II-6

4. Semiconductor Processing Equipment: Product Overview II-15

5. Regulatory Environment II-25

6.Technological Developments II-27

7. Product Innovations/Developments II-29

8. Recent Industry Activity II-41

9. Focus on Select Players II-66

10. Global Market Perspective II-72

III. MARKET

1. The United States III-1

2. Canada III-30

3. Japan III-32

4. Europe III-41

4a. France III-45

4b. Germany III-47

4c. Italy III-52

4d. The United Kingdom III-54

4e. Spain III-58

4f. Russia III-60

4g. Rest of Europe III-62

5. Asia-Pacific III-67

5a. Taiwan III-73

5b. Korea III-75

5c. Rest of Asia-Pacific III-79

6. Rest of World III-82

IV. COMPETITION