System on a Chip

Table of Contents

I. INTRODUCTION, METHODOLOGY & PRODUCT DEFINITIONS

• Study Reliability and Reporting Limitations
• Disclaimers
• Data Interpretation & Reporting Level
• Quantitative Techniques & Analytics
• Product Definitions and Scope of Study

II. EXECUTIVE SUMMARY

1. Market Highlights

2. System-On-A-Chip: A Major Breakthrough in

• Global System-on-a-Chip Market
• SoCs Grow at the Expense of Standalone Chips
• North America Dominates, Asia-Pacific Witnesses Fastest Growth
• Table 1: Global SoCs Market by Geographic Region/ Country: Percentage Share Breakdown for US, Canada, Japan, Europe, Asia-Pacific (Excluding Japan) and Rest of World for 2007 & 2010(includes corresponding Graph/Chart)
• Table 2: Global SoCs Market: Geographic Region/Country Ranked by Growth for US, Canada, Japan, Europe, Asia- Pacific (Excluding Japan), and Rest of World (includes corresponding Graph/Chart)
• SoCs Based on Embedded IP Steals the Limelight
• SoCs Based on Standard Cells Grows with Moderate Rate
• Table 3: Global SoCs Market by Product Type: Percentage Share Breakdown for SoCs Based on Standard Cell, and SoCs Based on Embedded IPs for 2007 & 2010
• Table 4: Global SoCs Market: Product Types Ranked by Growth for SoCs Based on Embedded IP, and SoCs Based on Standard Cell
• Computers and Communications Lead End-use Category
• Table 5: Global SoCs Market by End-use Application: Percentage Share Breakdown for Computers, Communication Equipment, Consumer Electronics Devices, Automotive Applications and Others for 2007 & 2010 (includes corresponding Graph/Chart)
• Table 6: Global SoCs Market: End-Use Applications Ranked by Growth for Consumer Electronics Devices, Automotive Applications, Computers, Communication Equipment and Others (includes corresponding Graph/Chart)
• Consumer Electronics Products on a High Growth Track
• Increasing Usage of SoC Solutions in Medical Field

3. Progression of the SoC Market

4. Factors Driving S-o-C Market

• Increasing Need for Compactness and High Speed
• New End-Use Devices Spark Up SoCs Market
• Innovations Drive Growth
• Growing Demand for 90-nm Technology
• Customization to Meet Client' s Requirements
• Advent of Three-Dimensional Chips
• SoC IP Designs Witness Rising Demand

5. Competitive Overview

• Leading Players in the SoC Market
• Players in Hard Disk Drive SoCs Market - A Recent Past Perspective
• Table 7: Global Hard Disk Drives (HDD) SoCs Market: (2005): Percentage Share Breakdown by Company for Agere, Marvell and STMicroelectronics (includes corresponding Graph/Chart)

6. Industry Challenges

• High Costs, a Major Deterrent
• Time-to-Market Pressures
• Verification Challenges
• Testers - A Solution to the Challenge
• IP Compatibility Issue
• Issues Related to Marketing of ICs
• Customer & Software Support and Staffing Challenges

7. Market Trends & Issues

• Embedded Software to Power System-on-a-Chip (SoC) Solutions
• Advanced ESL Design-For-Verification Solution to Reduce Verification Time for Complex SoCs
• Dual-Core Processors Gain Ground
• ASIC Designs for Supersystems Make a Foray
• Development of IP Market
• Emergence of System-above-Chip (SaC) Market
• Advent of Lab-on-a-Chip (LoC) Technology
• Standardization to Drive the Market
• SoCs Surpasses Standalone Chip in Terms of Price
• Development of Reusable IPs
• Innovations Address Power Leakage and Multiple Tasks Handling
• Consolidation Fuels Growth
• Growth in the Semiconductor Manufacturing Equipment Sector
• Multi-Tasking Microprocessors Gain Significance
• EDA and Silicon Intellectual-Property (IP), Two Burgeoning Sectors
• PLD Market Demand - A Recent Past Perspective
• Table 8: Global Programmable Logic Device (PLD) Market: (2005): Percentage Share Breakdown by Company for Xilinx, Altera and Others (includes corresponding Graph/Chart)
• Customizable Analog IPs Add New Dimension to Complex SoCs
• FPGA Makes Inroads in the Semiconductor Chips Market
• Development of Premanufactured ASICs, and Flash- and SRAM- Series of FPGAs
• Innovative Design Configuration of FPGAs
• Emergence of Three-Tier Design Approach of FPGA-Based Chips
• Evolution of System-On-A-Programmable Chip (SOPC)
• Wide Application of SoCs in Mobile Phones and Broadband Networks
• Standard Logic and Interface Equipment Prevails
• Compact Size of Logic Devices Favors Growth

8. Product Overview

• SoC - Emerging Technology in the Global Semiconductor Industry
• Components of SoC
• System-on-a-Chip (SoC) Block Diagram
• SoC Design Benefits
• "Second-Generation" SoCs
• ASIC SSOC - A New Dimension
• SoC Device Types
• Standard Cells
• Embedded IP
• Micro Logic IP
• Memory IP
• ASIC/PLD IP
• Analog IP & Other Components
• Standards for SoCs
• SoC Processor Types
• Soft Instruction Processors
• Configurable Processors
• Total Design Strategies for SoCs
• Architecture Strategy
• Design-for-Test Strategy
• Validation Strategy
• Synthesis and Back-End Strategy
• Integration Strategy

9. SoC End-Use Applications

• Computers
• Communications Equipment
• Consumer Electronics Devices
• Automotive Applications
• Others
• Industrial Automation & Military
• Medical & Office Devices
• CRM and Hearing Aid Products Dominate the Category
• New Mixed-Signal Radio-Frequency (RF) Technology Design
• SoC-Equipped Nanorobots

10. SoC Intellectual Property (IP)

• Interconnect - A Growing Sector of Semiconductor IP Market

11. System-in-Package (SIP): A Potential Threat

• SiP Market

12. Semiconductor Industry Overview

• Global Semiconductor Industry - Witnessing Rapid Growth
• The Moore' s Law Gives Rise to Sophisticated, Faster and Cheaper Chips
• Technology Advancements Provide Necessary Impetus
• Semiconductor Industry by Geographic Markets
• Asia and the US - Two Major Semiconductors Market
• Leading Semiconductor Players - A Recent Past Perspective
• Table 9: Global Semiconductors Market by Leading Players (2005): Market Share Breakdown by Company for Intel, Samsung, Renesas, Texas Instruments, Toshiba, STMicroelectronics and Others (includes corresponding Graph/Chart)
• Semiconductors Market by End-Use Sectors - A Recent Past Perspective
• Table 10: Global Semiconductors Market (2005): Percentage Share Breakdown by End-Use Sector for EDP, Telecom, Industrial, Automotive, Consumer and Military & Others (includes corresponding Graph/Chart)
• Integrated Circuits and Fabless Market - A Recent Past Perspective
• IC Market
• Table 11: Global Market for IC Design Houses Using Foundry Services (2005): Percentage Share Breakdown by Region for South Korea, Japan, China, Taiwan and Rest of World (includes corresponding Graph/Chart)
• Fabless Market
• Table 12: Global Fabless Market (2005): Percentage Share Breakdown by Region for North America, Asia Pacific, Europe and Rest of World (includes corresponding Graph/Chart)
• Table 13: Global Fabless Market (2005): Percentage Share Breakdown by Company for Qualcomm, Broadcom, NVidia, ATI, SanDisk, Agilent Xilinx, Marvell, MediaTek, Altera and Others (includes corresponding Graph/Chart)
• MEMS Market
• Table 14: Global Micro-Electromechanical Systems (MEMS) Market (2005): Percentage Share Breakdown by Product Type for Actuators and Sensors

13. SoC Technological Developments by

• System-on-a-Chip (SoC) for Printers
• W-OFDM-SoCs
• Xilinx® Virtex™ FPGAs and Embedded Solutions
• EPON-Based System-on-a-Chip (SoC)
• RapidChip® SoC Prototyping Platform
• Analog Devices Othello-E Transceiver
• True System-on-a-Chip (SoC)

14. Product Developments & Launches

• Broadcom Unveils Advanced Encoder/Transcoder SoC Solution
• Broadcom Showcases High Definition Set-Top Box System-on-a-Chip
• Broadcom Unveils a Single Chip DBS Set-Top-Box Solution
• GCT Semiconductor Unveils SoC Solution Supporting WiMAX and WiFi Functionality
• Infineon Releases CAT-iq™ Wireless Engine
• Broadcom Showcases a Whole New Range of SoC Solutions for Mobile Devices
• NVIDIA Introduces an Innovative Applications Processor
• Samsung Introduces Single-Chip Decoder
• Toshiba Introduces SoC Solution for ATSC LCD HDTVs
• Broadcom Uncovers Reference Design Platform for HD Optical Disc Players
• Broadcom Introduces Digital-to-Analog Adapter
• STMicroelectronics Introduces ' ST21NFCA' - SoC Solution for the NFC Market
• Broadcom Unveils SoC Solutions for the Mobile TV Market
• New Series of IC Tuners from Infineon
• TI Integrates Bluetooth®, FM and GPS Technologies on to a Single Chip
• STMicroelectronics Releases Bluetooth® and FM-Radio SoC Solution
• Upgraded Version of 90-Namnometer Reference Flow from SMIC and Synopsys
• Syntax-Brillian Opts Digital TV SoC Solution from Broadcom
• Broadcom Showcases BCM7400B SoC
• Marvell Introduces Bluetooth Single-Chip Solution
• D2 Technologies Unveils Embedded VoIP Software
• Broadcom Rolls Out the New BCM4325 Single-Chip
• Westinghouse Digital Selects BCM3560 SoC Solution
• Broadcom Releases the BCM7118 Single Chip
• Infineon Launches 3G ADSL2+ SoC
• ARC International Launches New VRaptor™ Media Architecture
• MOSAID Rolls Out Memorize™ and Fractional-N PLL
• Starport Systems Unleashes SoC Solution for Gen2 UHF RFID Readers
• Alvand Technologies Unveils SoC Humming-B™ Family of Tuners
• MagnaChip Releases MC531EA SoC Imaging Solution
• Genesis Microchip Unveils the Chaplin DTV family of ICs
• PMC-Sierra Unveils the PAS65311 GPON ONT Reference Design Solution
• STMicroelectronics Unleashes the SPEAr Head600 and SPEAr Plus600 ICs
• CAST, Inc. Rolls Out the SOC Kernels
• ARM and Northwest Logic' s PCI-SIG-compliant solution
• Cypress Releases The PSoC Express 2.1
• Texas Instruments Unveils Single-Chip NaviLink™ 5.0 Solution
• Sonics Launches New Version of SonicsMX® SMART Interconnect™ Solution
• SanDisk to Roll Out 8-Gb & 16Gb MLC NAND Flash Memory Chip
• Broadcom Launches BCM7440 Blu-ray/HD DVD SoC Solution
• Freescale Launches PowerQUICC™ III Processor Line
• Freescale Introduces Multicore MPC8572 Family
• Freescale Unveils the MPC8323E Processor
• GCT Semiconductor Releases Monlothic Single Chip
• National Semiconductor and ARM Launch PWI 2.0 Specification
• NEC Electronics Rolls Out UX7LSeD Technology
• NEC Electronics Launches MP201 Single-Chip Application Processor
• NEC Electronics Introduces 55nm Standard CMOS Process Technology
• National Semiconductor LM5071 Single Chip Solution
• Synopsys Unveils DesignWare® Mobile Storage
• Denali' s Databahn™ Product Released for NAND Flash Memory Devices
• Pixelplus Unleashes PM1001 and PO4030 SoC Solutions
• Adventiq' s Launches KVM System-On-A-Chip Product
• Semtech Corporation Rolls Out SX8801R SoC for Data Acquisition
• Key ASIC Unleashes the KeySoC™ Platform
• Summit Unleashes the Panorama™ in Three Configurations
• Micronas Unveils a New Audio SoC Solution for TV - Manufacturers
• LTRIM Technologies Launches Latest Genre of DC-DC Converter IP Blocks
• Silistix' s New Chip Area Interconnection (CHAIN) Scheme
• SigmaTel Unleashes the STDC3000 SoC Controller Solution
• Chipcon Releases the ' CC1110' SoC Solution for Wireless Payment Systems
• Atmel® Corporation Launches its All-Format DVD SoC
• Pixelplus Releases the 1.3 Megapixel Image Sensor PO5130 SoC
• Broadcom Introduces SoC Power Management Unit
• FMA Launches the Mobile WiMAX System-on- Chip (SoC) Solution
• DSP Group Unveils A New System-on-a-Chip Solution
• IP Cores Introduces Two Advanced Encryption Standard (AES) Based Security IP Cores
• PMC-Sierra Unveils Multi-Service MIPS-based Processor SoC Solution
• Conexant Releases ADSL2plus Central Office SoC Solution
• TI Releases VoIP System-on-a-Chip Solution
• Zoran Unveils System-on-Chip Approach 5 family of Processors
• DAFCA Releases ClearBlue™ version 2006.1 Product Suite
• TEK Microsystems and QinetiQ RTES Jointly Develop the JazzStore SoC™
• LG to Design SoCs by Employing Apache' s RedHawk-EV Solution
• Faraday Unveiled the FIE7010- an MP3 Player SoC Platform
• Pixelplus Releases Second Generation of SoC Image Sensors
• PMC-Sierra Launches the PM5336 ARROW 2488
• Provigent Introduces Development Kit for Wireless PTP Systems
• Renesas Unveils Transistor Technology Using Hybrid CMIS Transistors
• Renesas Unleashes the "SH7774" SoC Solution for Car Navigation Devices
• Renesas Introduces Chip-on-Chip Technology
• S2C Releases Two Models of Rapid FPGA Prototyping Solution Series
• Samsung Electronics Unveils System-on-Chip Solution for Hybrid Drive
• STMicroelectronics Introduces the T90 System-on- Chip (SoC) Solution
• Synopsys Develops PCI Express to AMBA 2.0 AHB DesignWare® Bridge
• Toshiba Introduces Second Generation of TC904XX Family of SoCs
• Toshiba Unveils 2.0 Megapixel and 3.2 Megapixel CMOS SoC Image Sensors
• Hua Hong NEC and Synopsys Unveil their Reference Design Flow 2.0
• Sonics Inc., Unveils SonicsMX SMART Interconnects Solution
• Sonics White Paper Defining SoC Interconnect Options for Developers
• Sonics Introduces the SonicsLX SMART Interconnect Solution
• Actel Introduces Design Infrastructure for ARM7-Enabled Fusion Programmable System Chips
• Actel Unveils the CoreMP7 Development Kit for ARM7-Enabled CoreMP7 Soft Processor Core
• Cypress Semiconductor Launches New Evaluation Kit for Wireless Radio System-on-a-Chip (SoC)
• Pentax Introduces Optio A10 Image Stabilization System Using Cypress' PsoC
• Hynix and M-Systems Introduces DOC Embedded Flash Drive (EFD)
• Sonics Unveils a New S3220 SMART Interconnects Solution
• Atmel Unveils New SoC Solution
• Agere Systems Develops USB 2.0 SoC
• Sunplus Unveils SPG290, a High-Performance System-on-a-Chip (SoC)
• Renesas Introduces Two Single-Chip ICs
• Renesas Unveils SH7397 32-Bit Microprocessor as a Single Chip Solution
• STMicroelectronics Releases 90nm HDD SoC devices
• Zoran Launches APPROACH 5, SoC for Mobile Handsets
• SigmaTel Unveils New SoC Solution for Multi-Function Printers
• CEVA Introduces a New DSP Architecture, the CEVA-X1621™
• Conexant Systems Unveils Integrated Xenon SoC Solution
• K-Micro Releases Topaz Computing Subsystem for SoCs
• Samsung Electronics Introduces 90-nm SoCs for Mobile Applications
• Magma and ARM Unveils an Advanced Implementation Solution for SoC Designs
• Parama Networks Unveils Transport SoC Technology
• Renesas Develops Advanced TTRAM for High-Speed and Low Power Consuming Applications
• Renesas Introduces Automated Device Sizing System for Use in SoCs
• S2C Releases New Interconnect Technology for SoC Designs
• PortalPlayer Introduces Two New Audio SoCs
• LSI Logic Corporation Innovates RapidChip SoC Prototyping Platform
• PRO/Wireless 5116 SoC from Intel
• New SoC Solution from Micronas
• Chipcon Innovates CC2431 ZigBee™ SoC Solution
• Ziptronix Develops Three-Dimensional System-on-a-Chip Device
• 1st Silicon and ZFOUNDRY Develops A18 Technology
• Chipcon Unveils CC2430 ZigBee SoC Solution
• Cypress Unveils 1.3-Megapixel SoC and Image Sensor Solutions
• Marvell Unveils VoWLAN SoC Solutions
• Micron Technology Unveils New SoC Sensor
• Mindspeed Technologies Introduces SoC Solution
• BroadLight Unveils BL2000 SoC
• STMicroelectronics Innovates SoC IC Devices
• RF Micro Devices Releases SiW4000 Bluetooth SoC Solution
• Vitesse Unveils Ethernet Switch System-on-a-Chip Solutions
• Cypress Develops Programmable System-on-a-Chip, CY8C24794-24LFXI
• Cypress Launches Programmable SoC, CY8C21x23
• FS2 System Navigator from First Silicon Solutions
• AMI Semiconductor Enhances its SmartPower SoC Mixed-Signal IC Technology
• AMI Semiconductor Develops Miniature Single-Chip Stepper Motor Driver-Controller ICs
• Atheros Develops Integrated Single-Chip 802.11g Access Point Solution
• Matsushita (Panasonic) Develops HD-PLC Technology for Home Networking Applications
• AXIOM Introduces MPSim™ System Verilog Verification
• Provigent Launches PVG310 Single-Chip Modem
• QUALCOMM and TSMC Jointly Develops 90-nm MSM™ Solutions
• Renesas Offers Embedded DRAM Core for SoCs
• RF Micro Unveils SiW4000™ SoC Bluetooth® Solution
• Samsung Develops ViP Design Methodology for Significantly Reducing SoC Design Time
• QuickLogic Corporation Introduces New Programmable SoC Devices
• New Solution for ESL Designs
• Vitesse Develops Gigabit Ethernet Switches
• Passave Develops SoC for EPON
• Enpirion Unveils Power SoC Solution
• CEVA Unveils Xpert-Palm
• Agilent Offers SoC Solution for PDAs
• Advantest Develops New T2000 MS Mainframe for Mid-Range SoC Devices
• Advantest Introduces T6577 SoC Test System

15. Recent Industry Activity

• ON Semiconductor Acquires AMI Semiconductor
• Broadcom Takes Over Sunext Design
• Broadcom Collaborates with Microsoft
• Broadcom Along with Coship Provides HD Set-Top Box Solution in China
• Zilog Signs Distribution Agreement with Nu Horizons
• BroadLight partners with ITRI
• ARC Extends Collaboration Agreement with Toshiba
• Samsung Uses Integrated FM Radio and Bluetooth® SoC from Broadcom
• NEC Opts Wipro to Provide Semiconductor Design Solutions
• Axiom Invests US$3 Million for New R&D Center in India
• Matsushita Implements IC Compiler of Synopsys
• EtherWaves Acquires Sonarics
• Silicon Image Acquires sci-worx
• Cortina Systems Acquires ImmenStar
• Wipro Acquires OTCS
• Synopsys Acquires MOSAID IP Assets
• BroadLight Collaborates with OpenCon Systems
• Mindspeed Partners with Terawave
• IC Nexus Partners with HDL Design House
• Global Unichip Allies with Vivante Graphics
• Jazz and Fujitsu Join Forces
• Coronis Systems Partners with Essensium N.V.
• Global Unichip Opts Testing Solution from Synopsys
• Core Logic to Establish Solution Center in China
• Newark Signs Franchise Agreement with Cypress
• Silicon Image Signs an Accord with Sunplus
• ARC Signs Multiple Agreements
• Global IP Sound Changes to Global IP Solutions
• Faraday Forms an Alliance with Palmchip Corporation
• CAST Enters into a Distribution Agreement with S2C
• Renesas - ZMD Alliance to Introduce 900-MHz Band ZigBee® Chipset by 2008
• Renesas Enters into an Agreement with Key Stream Corporation
• Renesas and Matsushita into their Fifth Stage of Collaboration
• Renesas Employs Synopsys' VCS Verification Solution and VMM Methodology
• Renesas Adopts Synopsys' IC Compiler Solution
• S2C Inc. is Tensilica® Inc.' s New Prototyping Partner in China
• Sonics Inc.® Enters into an Agreement with Ricoh Company
• MoSys Adopts SMIC' s CMOS Process Technology
• e2v Opts Tower Semiconductor to Manufacture CMOS Image Sensors
• Haier Group Adopts Broadcom' s Digital TV System-on-Chip Solution
• AMI Semiconductor Acquires Assets of NanoAmp
• AMD Acquires ATI Technologies
• LSI Buys Metta Technology
• NVIDIA Acquires PortalPlayer
• PMC-Sierra Acquires Passave
• Broadcom Purchases Sandburst
• Texas Instruments Purchases Chipcon AS
• Essensium Acquires Mind
• inSilicon and Sonics Form an Alliance for Developing Plug-and-Play SoC Platforms
• Sonics and CoWare® Enter into a Distribution Agreement
• BroadLight Enters into a Contract with Askey Computer
• Actions Semiconductor and GMI Sign an Agreement
• Mistletoe and eSilicon Develop an Integrated VPN-firewall SoC
• Matsushita Collaborates with Renesas to Test 45-nm SoC Technology
• Imagination Starts Operations in the US
• Air Broadband Selects FMA' s WiMAX SoC Solution
• ARM Licenses Advantage and Metro Products for 45 nm Technology
• QUALCOMM Starts Production of 90nm Chips
• eASIC Adds Two European Firms to Support Nextreme Line
• Newport Grabs More Funds to Develop SoC Solutions
• Sonics Inks an Agreement with CoWare
• SMIC and ARC Sign A Joint Agreement
• Toshiba Signs an Agreement with ARM
• ARCA Licenses ARM926EJ-STM Processor
• CMP Licenses ARM® RealView® ESL Tools
• Freescale to License The V2 ColdFire Core
• GCT Gets License for ARM926EJ-S™ Processor
• MIPS and msystems Unite to Develop a Safe-SOC™ Security platform
• Mobileye Obtains License for MIPS32® 34Kf™ Core
• Extreme DA Collaborates with UMC
• Scaleo chip Signs an Agreement with Wipro-NewLogic
• Key ASIC Partners with Silterra Malaysia Sdn. Bhd.
• STMicroelectronics Partners with iBiquity Digital Corporation
• SOCLE Employs UMC' s 90nm Process Technology
• Wipro Technologies Partners with Tensilica' s Processor Core Design Center
• Global Locate Partners with Toshiba to Roll Out Marlin™ A-GPS Chip
• Renesas Design Vietnam Opts Synopsys as EDA Provider
• CoWare Enters into a Strategic Agreement with Sonics
• CoFluent Collaborates with Sonics Inc.
• Summit Sells SystemC-based Sonics SMART Interconnects Solutions
• Bay Microsystems Acquires Parama Networks
• Broadcom Acquires Athena Semiconductors
• Cadence Acquires Verisity
• MOSAID Takes Over Virtual Silicon
• NVIDIA and ARM Enters into a Licensing Agreement
• SkyPilot Enters into a Contract Agreement with Fujitsu Microelectronics for WiMAX SoCs
• Virage Logic Enters into an Agreement with UMC
• ZAiQ Technologies Teams Up with S2C Inc.
• Synopsys Joins Forces with UMC
• Marvell Enters into a Deal with UTStarcom
• Tensilica Signs an Agreement with EVE
• Global UniChip Signs an Agreement with Synopsys
• Tower Semiconductor and Cadence Joins Forces
• Silterra Teams Up with Essensium
• White Electronic Designs Secures Contract for Supply of SoC Microprocessor Modules
• BroadLight Enters into a Licensing Agreement with MIPS Technologies for MIPS® Processor
• ARM Acquires Artisan Components
• Flextronics Partners with inSilica for the Development of SoC Solutions
• ARM, Artisan Components, NSC, Synopsys and UMC Collaborate for Advanced SoC Technology
• Ansoft Corporation Joins forces with Synopsys, Inc
• Nordic Semiconductor Obtains New Components Contract in Europe

16. Related Product/Corporate Developments

• Imagination Technologies Unveils New HD Video Decoder Core
• Mobileye Selects SMART Interconnect Solution of Sonics
• Cypress Semiconductor Introduces CY3630 Evaluation Kit for its Wireless Radio SoCs
• Renesas Technology Unveils Twin-Transistor RAM
• New Products from Texas Instruments
• K-Micro Develops Topaz Computing Subsystem
• New Innovations from AMI Semiconductor
• MemMax Memory Scheduler from Sonics, Inc
• Sonics Inc. Unveils New Version of SonicsMX SMART Interconnect
• SkyPilot Networks Selects SoC Solutions of Fujitsu Microelectronics
• Agere Systems Deploys IC Compiler of Synopsys
• Aperto Employs SoC Solutions of Fujitsu
• Jazz Semiconductor Unveils Innovative Process Platform for Advanced RF and Analog SoCs
• Telairity Launches Unique Processor Architecture for High Definition Video
• CoWare and Cadence Develop ESL Design Verification Flow
• Advantest Unveils Mid-Range SoC Test Solution
• Mentor Graphics Introduces Platform Express Product for SPIRIT 1.0 Norms

17. Focus on Select Players

• Actel Corporation (US)
• Altera Corporation (US)
• ARC International (US)
• ARM Holdings (UK)
• Broadcom Corporation (US)
• Core Logic (South Korea)
• Freescale Semiconductor (US)
• GCT Semiconductor Inc. (US)
• Infineon Technologies (Germany)
• Intel Corporation (US)
• LSI Corporation (US)
• Marvell Technology Group Ltd. (US)
• Matsushita Electric Industrial Co., Ltd (Panasonic) (Japan)
• Mentor Graphics Corporation (US)
• NEC Electronics Corporation (Japan)
• NVIDIA Corporation (US)
• ON Semiconductors Corporation (US)
• Palmchip Corporation (US)
• Provigent Inc. (US)
• Renesas Technology Corp. (Japan)
• Samsung Electronics Co., Ltd. (South Korea)
• STMicroelectronics N.V. (Switzerland)
• Synopsys Inc. (US)
• Taiwan Semiconductor Manufacturing Co. Ltd. (Taiwan)
• Texas Instruments (US)
• Toshiba America Electronics Components (US)
• Xilinx Inc. (US)
• Zilog Inc. (US)
• Ziptronix, Inc. (US)

18. Global Market Perspective

• Table 15: World Recent Past, Current & Future Analysis for System-on-a-Chip (SoC) by Geographic Region/Country - US, Canada, Japan, Europe, Asia-Pacific (Excluding Japan) and Rest of World Markets Independently Analyzed with Annual Sales Figures in US$ Million for Years 2004 through 2010 (includes corresponding Graph/Chart)
• Table 16: World Long-term Projections for System-on-a-Chip (SoC) by Geographic Region/Country - US, Canada, Japan, Europe, Asia-Pacific (Excluding Japan) and Rest of World Markets Independently Analyzed with Annual Sales Figures in US$ Million for Years 2011 through 2015 (includes corresponding Graph/Chart)
• Table 17: World 10-Year Perspective for System-on-a-Chip (SoC) by Geographic Region/Country - Percentage Breakdown of Dollar Sales for US, Canada, Japan, Europe, Asia-Pacific (Excluding Japan) and Rest of World Markets for 2004, 2008 and 2013 (includes corresponding Graph/Chart)
• Table 18: World Recent Past, Current & Future Analysis for System-on-a-Chip (SoC) by Product Type - SoCs Based on Standard Cell and SoCs Based on Embedded IP Markets Independently Analyzed with Annual Sales Figures in US$ Million for Years 2004 through 2010 (includes corresponding Graph/Chart)
• Table 19: World Long-term Projections for System-on-a-Chip (SoC) by Product Type - SoCs Based on Standard Cell and SoCs Based on Embedded IP Markets Independently Analyzed with Annual Sales Figures in US$ Million for Years 2011 through 2015(includes corresponding Graph/Chart)
• Table 20: World 10-Year Perspective for System-on-a-Chip (SoC) by Product Type - Percentage Breakdown of Dollar Sales for SoCs Based on Standard Cell and SoCs Based on Embedded IP Markets for 2004, 2008 and 2013
• Table 21: World Recent Past, Current & Future Analysis for System-on-a-Chip (SoC) by End-Use Application - Computers, Communications Equipment, Consumer Electronics Devices, Automotive Applications and Other Markets Independently Analyzed with Annual Sales Figures in US$ Million for Years 2004 through 2010 (includes corresponding Graph/Chart)
• Table 22: World Long-term Projections for System-on-a-Chip (SoC) by End-Use Application - Computers, Communications Equipment, Consumer Electronics Devices, Automotive Applications and Other Markets Independently Analyzed with Annual Sales Figures in US$ Million for Years 2011 through 2015 (includes corresponding Graph/Chart)
• Table 23: World 10-Year Perspective for System-on-a-Chip (SoC) by End-Use Application - Percentage Breakdown of Dollar Sales for Computers, Communications Equipment, Consumer Electronics Devices, Automotive Applications and Other Markets for 2004, 2008 and 2013 (includes corresponding Graph/Chart)

III. MARKET

1. North America

• Semiconductors Market Perspective
• An Overview of the SoC Market

1a. The United States

• A. Market Analysis
  • Rise in SoC End-Use Sectors Drives the Growth
  • Technological Innovations Adds to Growth
  • The U.S. Companies Follows Outsourcing Strategy to Reduce Costs
  • Product Developments & Launches
  • Strategic Corporate Developments
  • Related Product/Corporate Developments
  • Focus on Select Players
  • Actel Corporation
  • Altera Corporation
  • ARC International
  • ARM-US
  • Atmel Corporation
  • AXIOM Design Automation
  • Broadcom Corporation
  • Sandburst Corporation
  • BroadLight, Inc.
  • Cadence
  • Conexant Systems, Inc
  • CPU Technology, Inc
  • Cypress Semiconductor Corp
  • Enpirion
  • Eureka Technology
  • Freescale Semiconductor
  • Fujitsu Microelectronics
  • GCT Semiconductor Inc.
  • IBM Microelectronics
  • Intel
  • LSI Corporation
  • Marvell Technology Group Ltd.
  • Magma Design Automation
  • Mentor Graphics Corporation
  • Mindspeed Technologies
  • MIPS Technologies
  • Motorola
  • National Semiconductor
  • NEC Electronics America
  • NeoMagic Corporation
  • NVIDIA Corporation
  • ON Semiconductors Corporation
  • Palmchip Corporation
  • Palmchip Semiconductor
  • Bay Microsystems
  • PMC-Sierra
  • Provigent Inc.
  • QuickLogic Corporation
  • RF Micro Devices
  • S2C Inc.
  • SanDisk Corp.
  • Sonics, Inc
  • Synopsys Inc.
  • Texas Instruments Incorporated
  • Toshiba America Electronics Components
  • Wipro Technologies
  • Xilinx Inc.
  • Zilog Inc.
  • Ziptronix, Inc.
• B. Market Analytics
  • Table 24: The US Recent Past, Current & Future Analysis for System- on-a-Chip (SoC) Market Independently Analyzed with Annual Sales Figures in US$ Million for Years 2004 through 2010 (includes corresponding Graph/Chart)
  • Table 25: US Long-term Projections for System-on-a-Chip (SoC) Market Independently Analyzed with Annual Sales Figures in US$ Million for Years 2011 through 2015 (includes corresponding Graph/Chart)

1b. Canada

• A. Market Analysis
  • Mosaid Technologies, Inc. - A Major Player
• B. Market Analytics
  • Table 26: The Canadian Recent Past, Current & Future Analysis for System-on-a-Chip (SoC) Market Independently Analyzed with Annual Sales Figures in US$ Million for Years 2004 through 2010 (includes corresponding Graph/Chart)
  • Table 27: Canadian Long-term Projections for System-on-a- Chip (SoC) Market Independently Analyzed with Annual Sales Figures in US$ Million for Years 2011 through 2015(includes corresponding Graph/Chart)

2. Japan

• A. Market Analysis
  • An Overview of Japanese Semiconductor Market
  • Consumer Profile
  • Foreign Players Ties-Up with Local Fabricators and Vendors
  • Local Companies Expands Customer Base
  • SoC Market Overview
  • Growth in IC Sector
  • Product Developments & Launches
  • Strategic Corporate Developments
  • Related Product/Corporate Developments
  • Focus on Select Players
  • Hitachi, Ltd.
  • Matsushita Electric Industrial Co., Ltd (Panasonic)
  • NEC Electronics Corporation
  • Renesas Technology Corp.
• B. Market Analytics
  • Table 28: Japanese Recent Past, Current & Future Analysis for System-on-a-Chip (SoC) Market Independently Analyzed with Annual Sales Figures in US$ Million for Years 2004 through 2010 (includes corresponding Graph/Chart)
  • Table 29: Japanese Long-term Projections for System-on-a-Chip (SoC) Market Independently Analyzed with Annual Sales Figures in US$ Million for Years 2011 through 2015 (includes corresponding Graph/Chart)

3. Europe

• A. Market Analysis
  • Semiconductors Market Overview
  • SoC Market Overview
  • Semiconductors Market by European Regions - A Recent Past Perspective
  • Table 30: Semiconductors Market in Europe (2005 & 2006): Percentage Share Breakdown by Region/ Country for Germany, UK, France, Nordic Countries, Italy, Benelux Region and Rest of Europe (includes corresponding Graph/Chart)
  • Semiconductors Market by End-Use Sectors - A Recent Past Perspective
  • Table 31: Semiconductors Market in Europe (2005): Percentage Share Breakdown by End-Use Sector for EDP, Telecom, Automotive, Consumer, Industrial and Military & Others (includes corresponding Graph/Chart)
  • Consolidation Drives the Market
  • Market Trends
  • SoC Deployment Rises for the Automotive and the Communications Sector
  • Demand for Pre-Configured Functional IP Blocks Rising
  • Subcontracting Increases for Final SoC Products Assembly to Low- Cost European Countries
  • Product Developments & Launches
  • Strategic Corporate Developments
  • Related Product/Corporate Development
  • Focus on Select Players
  • ARM Holdings (UK)
  • Essensium (Belgium)
  • Infineon Technologies (Germany)
  • NEC Electronics (Europe) (Germany)
  • Nordic Semiconductor (Norway)
  • OKI Electric Europe (Germany)
  • Samsung Electronics (UK)
  • STMicroelectronics N.V. (Switzerland)
• B. Market Analytics
  • Table 32: European Recent Past, Current & Future Analysis for System-on-a-Chip (SoC) Market Independently Analyzed with Annual Sales Figures in US$ Million for Years 2004 through 2010 (includes corresponding Graph/Chart)
  • Table 33: European Long-term Projections for System-on- a-Chip (SoC) Market Independently Analyzed with Annual Sales Figures in US$ Million for Years 2011 through 2015 (includes corresponding Graph/Chart)

4. Asia-Pacific

• A. Market Analysis
  • SoC Market Overview
  • Asia Emerges as a Major Market for SoC Deployment in Wireless Devices
  • China
  • India
  • From Just Design to Complete Solutions
  • Challenges Faced
  • South Korea
  • Integrated Circuits (ICs) Market - A Recent Past Perspective
  • Table 34: Integrated Circuits (ICs) Market in Korea (2005): Percentage Share Breakdown by End-Use Services for Corporate Management, Design & Development, Engineering Management, Test Engineering and Others (includes corresponding Graph/Chart)
  • Korean SoC Market on a Rise
  • Product Developments & Launches
  • Strategic Corporate Developments
  • Focus on Select Players
  • X-FAB Sarawak Sdn. Bhd. (Malaysia)
  • 5V Technologies (Taiwan)
  • Core Logic (South Korea)
  • Dongbu HiTek Company Ltd. (South Korea)
  • EE Solutions (Taiwan)
  • Faraday Technology Corp. (Taiwan)
  • Global Unichip Corp. (Taiwan)
  • Hynix Semiconductor (South Korea)
  • ICNexus (Taiwan)
  • Insilica Semiconductors (India)
  • Integrated Circuit Solution (Taiwan)
  • Samsung Electronics Co., Ltd. (South Korea)
  • Silicon Motion Technology (Taiwan)
  • Silterra Malaysia Sdn. Bhd. (Malaysia)
  • Taiwan Semiconductor Manufacturing Co., Ltd. (Taiwan)
  • United Microelectronics Corp. (Taiwan)
• B. Market Analytics
  • Table 35: Asia-Pacific Recent Past, Current & Future Analysis for System-on-a-Chip (SoC) Market Independently Analyzed with Annual Sales Figures in US$ Million for Years 2004 through 2010 (includes corresponding Graph/Chart)
  • Table 36: Asia-Pacific Long-term Projections for System- on-a-Chip (SoC) Market Independently Analyzed with Annual Sales Figures in US$ Million for Years 2011 through 2015 (includes corresponding Graph/Chart)

5. Rest of World

• Market Analysis
• Table 37: Rest of World Recent Past, Current & Future Analysis for System-on-a-Chip (SoC) Market Independently Analyzed with Annual Sales Figures in US$ Million for Years 2004 through 2010 (includes corresponding Graph/Chart)
• Table 38: Rest of World Long-term Projections for System- on-a-Chip (SoC) Market Independently Analyzed with Annual Sales Figures in US$ Million for Years 2011 through 2015 (includes corresponding Graph/Chart)

IV. COMPETITIVE LANDSCAPE