Abstract
This report analyzes the worldwide markets for Thin Layer Deposition Equipment
in Millions of US$. The major product segments analyzed are 1.Physical Vapor
Deposition (PVD) Equipment (Microelectronics, Cutting Tools, Industrial,
Specialty Packaging, Storage, Optics, and Medical), and 2.Chemical Vapor
Deposition (CVD) Equipment (Microelectronics, Cutting Tools, Industrial, and
Medical). The End-use segments discussed include Microelectronics, Cutting
Tools, Industrial Applications, Specialty Packaging, Data Storage,
Optoelectronic Components, and Medical Technology Applications. The report
provides separate comprehensive analytics for the US, Canada, Japan, Europe,
Asia-Pacific, and Rest of World. Annual forecasts are provided for each region
for the period of 2001 through 2015. A ten-year historic analysis is also
provided for these markets with annual market analytics. The report profiles
119 companies including players such as AIXTRON, Applied Materials, Inc., ASM
International N.V., Axcelis Technologies, Inc., Canon ANELVA Corporation, CHA
Industries, CVD Equipment Corporation, Denton Vacuum, Edwards Limited, Ibis
Technology Corporation, Implant Sciences Corporation, Ionbond AG, Jusung
Engineering Co., Ltd., KDF Electronic & Vacuum Services, Inc., Kokusai
Semiconductor Equipment Corporation, Kookje Electric Korea Co., Ltd., Novellus
Systems, Inc., OC Oerlikon Corporation AG, RIBER SA, Seki Technotron USA, SEN
Corporation, Silicon Genesis Corporation, Tecvac Limited, Tegal Corporation,
Ti-Coating, Inc., Tokyo Electron Limited, Ultramet, ULVAC Technologies, Inc.,
Vapor Technologies, Inc., and Veeco Instruments. Market data and analytics are
derived from primary and secondary research. Company profiles are mostly
extracted from URL research and reported select online sources.
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