Nanomemory

Table of Contents

I. INTRODUCTION, METHODOLOGY & PRODUCT DEFINITIONS

• Study Reliability and Reporting Limitations
• Disclaimers
• Data Interpretation & Reporting Level
• Product Definitions and Scope of Study

II. EXECUTIVE SUMMARY

1. MARKET OVERVIEW

• Modern Day Storage Woes
• Nanomemory to the Rescue
• Table 1: World Long Term Projections for Nanomemory Market- Annual Sales Figures in US$ Billion for the Years 2010 through 2015 (includes corresponding Graph/Chart)
• Who Leads the Pack?
• Conventional Vs Emerging Storage Options
• Comparison Between Traditional and Emerging Memory Types
• Nanotechnology to Alter Memory Storage in Electronics
• MRAM: Pros and Cons
• What' s in Store for MRAM?
• Ovonic Memory Gathering Momentum
• Holographic Memory in Future
• R&D in Nanomemory: A Sneak Peak
• Carbon Nanotubes Based Memory
• Nanodots
• Nanocrystalline Memory
• Nano-Ionic Memory
• Patent Protection Vital for Investment
• Table 2: Number of Patents Filed for Select Nanomemory Types from 2003 Onwards in the US, Japan, Europe, and WIPO (includes corresponding Graph/Chart)

2. PRODUCT OVERVIEW

• Nanotechnology: Breaking Conventional Size Barriers
• Volatile and Non-Volatile Memory
• Nanomemory: An Introduction
• Select Nanomemory Types - Features, and Applications
• Comparison of Select Nanomemory Technologies- FRAM, MRAM, and Ovonic Unified Memory
• FRAM
• MRAM
• Ovonic Unified Memory
• Holographic Memory
• NRAM
• Molecular Memory
• Polymer Memory

3. TECHNOLOGICAL DEVELOPMENTS

• Researchers Develop New Nanotube Flash Memory Design
• Researchers to Develop Graphene Memory
• Physicists Succeed in Controlling Electron Spin
• Chemists Develop New Method to Synthesize Nanorods and Nanowires
• Researchers Develop Nanowires to Store Data
• IBM Develops New Memory Device
• KAIST Develops 8nm NVM Flash Memory
• University of Southampton Develops Optical Memory Element
• Researchers Develop the Largest Memory Bit Array
• Physicists Develop Optical Memory Using Single Gallium Nanoparticle

4. PRODUCT INNOVATIONS/INTRODUCTIONS

• Toshiba Unveils New 16-Gigabit Memory Chip
• Micron Launches 8-Gb SLC high speed NAND
• AMD Launches New Stream Processor, AMD FireStream(tm) 9250
• AMD Introduces Two New Graphics Card with TeraFlops Graphics Chip
• AMD to Use GDDR5 Memory in New Advanced ATI Radeon(tm) Graphics Systems
• AMD Introduces New Graphics Accelerator, ATI FirePro(tm) V 8700
• AMD Releases New Graphic Processor, ATI Radeon(tm) E2400
• Hitachi Announces Nanotechnology Milestone for Hard Disk Drives Capacity
• Ramtron' s New Integrated EDR Incorporates F-RAM Capabilities
• Ramtron Unveils New Serial F-RAM with 2Mb Memory
• Ramtron Unveils FM3135
• Samsung' s Sampling of Smallest-ever 2Gb DDR3 Utilizes 50nm Class Circuiting
• Samsung' s New High-Performing Smart Card IC Utilizes 90nm Technology
• SanDisk Releases a New WORM Digital Memory Card for Data-Write-Protection
• SanDisk' s New Advanced Memory Stick PRO-HG Duo(tm), Ideal for SLR cameras
• Everspin Includes Small Footprint and byte-wide BGA Products into MRAM family
• Infineon Technologies Launches X-GOLD(tm)102
• Nanochip Unveils a Breakthrough Storage Technology
• Ramtron Unveils FM25V05, Serial 512-Kilobit F-RAM
• Ramtron Releases High-Speed FM28V100
• Ramtron Releases FM25V10, Flexible 1-Megabit Serial F-RAM
• Ramtron Enhances Its Range of AEC-Q100-Specified F-RAM Memory Devices
• Samsung Introduces First 30nm Flash Memory in the World
• Virage Unveils New 65nm Product Lines
• RIC Launches 4Mb FRAM
• Samsung Launches 8GB Flash Memory
• Hewlett-Packard Launches Nanotechnology Based New Computer Chip
• Ramtron Unveils 4Mb Non-Volatile FRAM Memory
• Samsung Develops a New Chip for Digital TVs
• Samsung Launches 8GB moviNAND for Mobiles
• Samsung Launches 30nm Process Node Based Primary Flash Memory Chip
• Virage Expands the Range of Silicon Aware IP Line
• Toshiba Corp to Manufacture NAND Flash Memory Chips with 43nm Technology
• Impinj Releases AEON@OTP Nonvolatile Memory Cores
• Scientists in South Korea Create the World' s First 8-nanometer Flash Memory Part
• Epson and Fujitsu Develop Next-Generation FRAM Technology
• Fujitsu Introduces Embedded FRAM for Digital Televisions
• Ramtron Extends Grade 1 Automotive Devices Product Range
• Ramtron Announces Expansion of +125oC F-RAM-based Automotive Devices
• Ramtron Unveils a New 2Mb Parallel High-Density F-RAM memory device
• Ramtron Expands Versa 8051Series by Unveiling a 2 KB F-RAM Microcontroller
• Ramtron Expands Nonvolatile State Saver Line by Unveiling a 4-bit F-RAM Device
• Ramtron Expands F-RAM-based Grade 1 Automotive parts
• FRAM Memory from Ramtron Incorporated in Car Audio Platform by Daesung-Eltec
• Ramtron Announces Upgrading of Grade 1 Automotive line
• Ramtron Introduces Improved F-RAM-Enhanced(tm) Processor Companions
• Samsung Unveils GDDR5 Memory Chip Transfers data at Speeds of 6Gb/s
• Samsung Introduces 64Gb MLC NAND Flash Memory for High Density Storage
• Samsung Unveils 60nm 2Gb DDR2 DRAM Using Class Processing Technology
• Samsung Introduces a Multi-chip High-Density moviMCP Memory Package
• Samsung Commences Sampling of 16Gb NAND Flash Utilizing 50nm Processing Technology
• Hitachi and Renesas Launch Circuit Technology for On-Chip Nonvolatile Memory Applications
• Hitachi Launches 0.05mm x 0.05mm Contactless RFID IC Chip
• Infineon Unveils XE166 Family of Real-Time Signal Controllers
• Impinj Releases AEON(r) for Production in TSMC
• Ramtron and TI to Launch 4-Mbit FRAM

5. RECENT INDUSTRY ACTIVITY

• Hynix to Acquire Stake in ProMOS
• Lockheed Martin Acquires Government Business Unit of Nantero
• BAE Systems and MAST to Develop Nano-Sensor Technology
• Qimonda Partners with Elpida
• SVTC Partners with Nantero
• Hynix Partners with Nanosys
• Qimonda AG in Partnership with Elpida Memory Inc. to Develop Nano-Chips
• Nantero Partners with SVTC Technologies to Develop Carbon Nanotube Process
• Aewin Technologies Enters into an Agreement with Ramtron
• Numonyx Commences Prototype Production of 45nm Wafers
• Hynix to Commence Production of 50nm DRAM
• SanDisk to Commence Production of MLC NAND Flash Memory
• Crocus Technology Raises Funds to Develop MRAM Technology
• Samsung and Sun Microsystems Collaborate on SLC Flash Memory Development
• ATMI and Ovonyx to Collaborate on High-Volume Manufacture of PCM Products
• SanDisk and Toshiba Co-Develop NAND Flash Memory
• Energy Optimizers Enters into an Agreement with Ramtron
• Freescale Forms New Company for MRAM Development
• Hynix Joins the Memory Technology Access Program (M-TAP) of Nanosys
• Toshiba Develops 16-Gigabit NAND Flash Memory
• Ramtron International Selects Shanghai Welltech for FM25L16 Designing
• AMD Partners with TSMC
• TSMC Announces Virage as IP Partner
• RIC Partners with TI
• Samsung and Toshiba Collaborate on Premium NAND Memory Chips
• Ovonyx and Hynix Collaborate on PCM Products Development
• Ovonyx and Qimonda Collaborate on PCRAM Technology
• IBM, Infineon, Freescale, Samsung & Chartered Cooperate on 32-nm Semiconductors
• Spansion Inks Agreement with TSMC
• AMD Enters into an Agreement with SAMSUNG
• Infineon Enters into an Agreement with IBM
• Toshiba to Manufacture 43nm NAND Flash Memory Chips
• Samsung Starts Production of 16-gigabit NAND Flash Memory
• Samsung Commences Production of 60nm DRAM Chips
• Intel Corp Receives Approval for New Computer Chip Plant
• NVE Corp to Receive New Patent
• Intel to Commence Mass Production of Alverstone
• National Semiconductor to Qualify Cavendish Kinetics' Nanomech Process
• Samsung Commences Mass Production of NAND Flash Memory Chips

6. FOCUS ON SELECT GLOBAL PLAYERS

• Advanced Micro Devices, Inc. (US)
• California Molecular Electronics Corporation (US)
• Cavendish Kinetics (US)
• Colossal Storage Corporation (US)
• Cypress Semiconductor Corporation (US)
• Everspin Technologies, Inc. (US)
• Fujitsu Limited (Japan)
• Hewlett-Packard Development Company, L.P. (US)
• Hitachi, Ltd. (Japan)
• Honeywell International Inc. (US)
• International Business Machines Corp. (US)
• Infineon Technologies AG (Germany)
• Intel (US)
• Nanochip, Inc. (US)
• Nanosys, Inc. (US)
• Nantero, Inc. (US)
• NVE Corporation (US)
• Ovonyx, Inc. (US)
• Ramtron International Corporation (US)
• Samsung Electronics Co., Ltd. (Korea)
• SanDisk Corporation (US)
• STMicroelectronics NV (Switzerland)
• Texas Instruments Inc (US)
• ZettaCore, Inc. (US)

III. COMPETITIVE LANDSCAPE