Abstract
This IDC study includes market forecast data and analysis on
a worldwide basis for the mobile phone semiconductor market for
2009 through 2013. This document provides segmentation by various air
interface standards in 2G, 2.5G, 3G, 3.5G, and 4G technologies;
major semiconductor device type; and geographic region. It also provides
comprehensive data on semiconductor BOM costs by air interface standard
and component subsystem. Further detail is provided by component for
each air interface. Key forecast assumptions are identified, and their
potential impact on the mobile phone semiconductor market is discussed.
A comparison of the current forecast with the prior forecast
is also noted.
"Worldwide mobile phone semiconductor revenue is expected to
drop by 12.4% this year to $39.3 billion in response
to the sharp global economic slowdown over the last year.
We expect consumers to gradually return to their past replacement
cycles through 2010 and 2011 to help rebuild industry revenue,
although 2008 levels will not be retraced until after 2013."
— Flint Pulskamp, analyst, Wireless/Mobile Semiconductors
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