Metrology, Inspection, and Process Control in VLSI Manufacturing

Table of Contents

Chapter 1 Introduction

Chapter 2 Executive Summary

Chapter 3 Metrology/Inspection Technologies

• 3.1 Introduction
• 3.2 Imaging Techniques
  • 3.2.1 Scanning Electron Microscope (SEM)
  • 3.2.2 Transmission Electron Microscope (TEM)
• 3.3 Scanning Probe Microscopes
  • 3.3.1 Atomic Force Microscopy (AFM)
  • 3.3.2 Scanning Tunneling Microscopy (STM)
  • 3.3.3 Scanning Probe Microscopy (SPM)
  • 3.3.4 AFM Types
    • 3.3.4.1 Contact AFM
    • 3.3.4.2 Dynamic Force Mode AFM Techniques
  • 3.3.5 Scanning Surface Potential Microscopy (SSPM)
• 3.4 Optical Techniques
  • 3.4.1 Scatterometry
    • 3.4.1.1 Ellipsometry
    • 3.4.1.2 Reflectometry
    • 3.4.1.3 Scatterometry Developments
  • 3.4.2 Total Reflection X-Ray Fluorescence (TXRF)
  • 3.4.3 Energy Dispersive X-Ray Analysis (EDX)
  • 3.4.4 Secondary Ion Mass Spectrometry (SIMS)
    • 3.4.4.1 Surface Imaging Using SIMS
    • 3.4.4.2 SIMS Depth Profiling
  • 3.4.5 Auger Electron Spectroscopy
  • 3.4.6 Focused Ion Beam (FIB)
  • 3.4.7 X-Ray Reflectometry (XRR)
  • 3.4.8 X-Ray Photoelectron Spectroscopy (XPS)
  • 3.4.9 Rutherford Backscattering (RBS)
    • 3.4.10 Optical Acoustics Metrology
    • 3.4.11 Fourier Transform Infrared Spectroscopy (FTIR)
    • 3.4.12 IDS 10000
    • 3.4.13 Thermally-Induced Voltage Alteration (TIVA)
• 3.5 Film Thickness And Roughness
  • 3.5.1 Surface Inspection Technology
  • 3.5.2 Dimensional Technology
  • 3.5.3 Stylus Profilometer

Chapter 4 Defect Review/Wafer Inspection

• 4.1 Introduction
• 4.2 Defect Review
  • 4.2.1 SEM Defect Review
  • 4.2.2 Optical Defect Review
  • 4.2.3 Other Defect Review
• 4.3 Patterned Wafer Inspection
  • 4.3.1 E-Beam Patterned Wafer Inspection
  • 4.3.2 Optical Patterned Wafer Inspection
• 4.4 Unpatterned Wafer Inspection
• 4.5 Macro-Defect Inspection

Chapter 5 Thin Film Metrology

• 5.1 Introduction
  • 5.1.1 Front End Applications
  • 5.1.2 Back End Applications
• 5.2 Metal Thin-Film Metrology
• 5.3 Non-Metal Thin-Film Metrology
• 5.4 Substrate Metrology

Chapter 6 Lithography Metrology

• 6.1 Overlay
• 6.2 CD
• 6.3 Mask (Reticle) Metrology/Inspection

Chapter 7 Market Forecast

• 7.1 Introduction
• 7.2 Market Forecast Assumptions
• 7.3 Market Forecast
  • 7.3.1 Total Process Control Market Forecast
  • 7.3.2 Lithography Metrology Market Forecast
    • 7.3.2.1 Overlay Market Forecast
    • 7.3.2.2 CD Measurement Market Forecast
    • 7.3.2.3 Mask Inspection Market Forecast
    • 7.3.2.4 Mask Metrology Market Forecast
  • 7.3.3 Wafer Inspection / Defect Review Market
    • 7.3.3.1 Patterned Wafer Inspection Market Forecast
      • E-Beam Patterned Wafer Inspection Market Forecast
      • Optical Patterned Wafer Inspection Market Forecast
    • 7.3.3.2 Defect Review Market Forecast
      • SEM Defect Review Market Forecast
      • Optical Defect Review Market Forecast
      • Other Defect Review Market Forecast
    • 7.3.3.3 Unpatterned Wafer Inspection Market Forecast
    • 7.3.3.4 Macro Defect Detection Market Forecast
  • 7.3.4 Thin Film Metrology Market Forecast
    • 7.3.4.1 Non-Metal Thin Film Metrology Market Forecast
      • Non-Metal Standalone Thin Film Metrology Market Forecast
      • Non-Metal Integrated Thin Film Metrology Market Forecast
    • 7.3.4.2 Substrate / Other Thin Film Metrology Market Forecast
  • 7.3.5 Other Process Control Systems Market Forecast

Chapter 8 Integrated/In-Situ Metrology/Inspection Trends

• 8.1 Introduction
• 8.2 In-Situ Metrology
• 8.3 Integrated Metrology
  • 8.3.1 Benefits
  • 8.3.2 Limitations

Chapter 9 Key Drivers

• 9.1 300mm Wafers
• 9.2 Copper Metrology
• 9.3 Low-K Dielectrics
• 9.4 Chemical Mechanical Planarization (CMP)
• 9.5 Ion Implant

LIST OF TABLES

• 3.1 Comparison Of Derivative AFM Techniques
• 5.1 Comparison Of White-Light With Multiple-Angle Laser Ellipsometry
• 7.1 Total Process Control Market Forecast
• 7.2 Lithography Metrology Market Forecast
• 7.3 Overlay Market Forecast
• 7.4 CD Measurement Market Forecast
• 7.5 Mask Inspection Market Forecast
• 7.6 Mask Metrology Market Forecast
• 7.7 Wafer Inspection / Defect Review Market Forecast
• 7.8 Patterned Wafer Inspection Market Forecast
• 7.9 E-Beam Patterned Wafer Inspection Market Forecast
• 7.10 Optical Patterned Wafer Inspection Market Forecast
• 7.11 Defect Review Market Forecast
• 7.12 SEM Defect Review Market Forecast
• 7.13 Optical Defect Review Market Forecast
• 7.14 Other Defect Review Market Forecast
• 7.15 Unpatterned Wafer Inspection Market Forecast
• 7.16 Macro Defect Detection Market Forecast
• 7.17 Thin Film Metrology Market Forecast
• 7.18 Non-Metal Thin Film Metrology Market Forecast
• 7.19 Non-Metal Standalone Thin Film Metrology Market Forecast
• 7.20 Non-Metal Integrated Thin Film Metrology Market Forecast
• 7.21 Substrate / Other Thin Film Metrology Market Forecast
• 7.22 Other Process Control Systems Market Forecast
• 9.1 Dielectric Film Challenges

LIST OF FIGURES

• 3.1 Schematic Of Scanning Electron Microscope
• 3.2 Schematic Of Transmission Electron Microscope
• 3.3 Schematic Of Atomic Force Microscopy
• 3.5 Interaction Between Two Atoms In AFM
• 3.6 Schematic Of Lateral Force Microscopy
• 3.7 Schematic Of Dynamic Force Mode AFM
• 3.8 Schematic Of Scanning Surface Potential Microscopy
• 3.9 Principle Of Scatterometry
• 3.10 Schematic Of Ellipsometer
• 3.11 Principles Of CD Scatterometry
• 3.12 Conventional TXRF Analysis Geometry
• 3.13 Schematic Of Secondary Ion Mass Spectrometry
• 3.14 Principle Of Auger Electron Emission
• 3.15 Schematic Of Auger Electron Spectroscopy
• 3.16 Schematic Of Focused Ion Beam Technology
• 3.17 Schematic Of X-Ray Reflectometry
• 3.18 Schematic Of X-Ray Photoelectron Spectroscopy
• 3.19 Schematic Of Rutherford Backscattering
• 3.20 Schematic Of Optical Acoustics Metrology
• 3.21 Spatial Wavelength Of Nanotopography
• 3.22 Schematic Of Non-Contact Capacitive Gauging
• 3.23 Schematic Of Stylus Profilometer
• 5.1 Thin Film Metrology Challenges
• 5.2 Spectroscopic Ellipsometry Diagram
• 6.1 ITRS Overlay Technology Roadmap
• 6.2 NIST Line Edge Roughness Model
• 6.3 ITRS Metrology Roadmap
• 6.4 Schematic Of OCD Optics
• 6.5 Microlithography Process And Measurements
• 7.1 Total Process Control Market Forecast
• 7.2 Total Process Control Market By Geographic Region
• 7.3 Total Process Control Market Vs. Overall Equipment Market 1995-2005
• 7.4 Lithography Metrology Market Shares - 2005
• 7.5 Overlay Market Shares - 2005
• 7.6 CD Measurement Market Shares - 2005
• 7.7 Mask Inspection Market Shares - 2005
• 7.8 Mask Metrology Market Shares - 2005
• 7.9 Wafer Inspection / Defect Review Market Shares - 2005
• 7.10 Patterned Wafer Inspection Market Shares - 2005
• 7.11 E-Beam Patterned Wafer Inspection Market Shares - 2005
• 7.12 Optical Patterned Wafer Inspection Market Shares - 2005
• 7.13 Defect Review Market Shares - 2005
• 7.14 SEM Defect Review Market Shares - 2005
• 7.15 Optical Defect Review Market Shares - 2005
• 7.16 Other Defect Review Market Shares - 2005
• 7.17 Unpatterned Wafer Inspection Market Shares - 2005
• 7.18 Macro Defect Detection Market Shares - 2005
• 7.19 Thin Film Metrology Market Shares - 2005
• 7.20 Non-Metal Thin Film Metrology Market Shares - 2005
• 7.21 Non-Metal Standalone Thin Film Metrology Market Shares - 2005
• 7.22 Non-Metal Integrated Thin Film Metrology Market Shares - 2005
• 7.23 Substrate / Other Thin Film Metrology Market Shares - 2005
• 7.24 Other Process Control Systems Market Shares - 2005
• 7.25 Other Process Software Market Shares - 2005
• 8.1 Integrated Control In A Fab
• 9.1 Polish Endpoint Control