Abstract
Flip chip packaging is currently growing at a 28% compound annual rate, and
the lithography and etch market will be major beneficiaries. Flip chip
packaging eliminates the need for wire bonding by placing the contact points
of the chip in direct contact with the packaging substrate and requiring the
stringent control of the placement of the chip on the substrate. This method
of advanced packaging of ICs offers advantages in size, signal speed, cost,
and reliability.
This report analyzes the manufacture of flip chips and analyzes the market to
2009. Lithography and wet etch equipment are also analyzed and forecast to
2009.
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