Chemicals and Materials for Sub-100 nm IC Manufacturing

Table of Contents

Chapter 1 - Introduction

Chapter 2 - Executive Summary

• 2.1 Key Industry Trends
• 2.2 Market Outlook
• 2.3 Supplier Opportunities

Chapter 3 - IC Industry Trends

• 3.1 IC Industry Growth Forecast
• 3.2 Trends in IC Processing Technology
• 3.3 Environment, Safety And Health (ESH) Issues

Chapter 4 - Liquid Chemicals

• 4.1 Technology Issues
  • 4.1.1 Acids and Solvents
  • 4.1.2 Resists
• 4.2 Purity Requirements
  • 4.2.1 Purification Methods
    • Trends For Purity - Trace Elements
  • 4.2.2 Particulates
    • Effects on Yield
    • Particulate Removal Techniques
    • Particle Monitoring
• 4.3 Chemical Management
  • 4.3.1 Introduction
  • 4.3.2 Chemical Usage Reduction

Chapter 5 - Gases

• 5.1 Technology Issues
• 5.2 Requirements
  • 5.2.1 Purification Methods
    • Historical Perspective
    • Trends For Purity - Consistency
  • 5.2.2 Particulate Considerations
    • Particle Monitoring
    • Filtration Methods
  • 5.2.3 Summary
• 5.3 Chemical Management

Chapter 6 - Sputtering and Evaporation Materials

• 6.1 Technology Issues
• 6.2 Purity Requirements

Chapter 7 - Chemical Dispensing Practices

• 7.1 Vendor Delivery Alternatives
  • 7.1.1 Bottles
    • Glass & Polyethylene
  • 7.1.2 Bulk Chemical Delivery
• 7.2 Point-of-Use Chemical Generation
• 7.3 Chemical Management Services
  • 7.3.1 Introduction
  • 7.3.2 Process Initiation
  • 7.3.3 CMS Supplier Responsibilities
  • 7.3.4 Improved Chemical Use
  • 7.3.5 JIT Inventory Management
  • 7.3.6 Environmental Services
  • 7.3.7 Optimized Chemical Delivery
  • 7.3.8 Reprocessor Management
  • 7.3.9 Cost/Benefits
  • 7.3.10 Trends

Chapter 8 - Market Forecast

• 8.1 Market Driving Forces & Assumptions
• 8.2 Chemicals and Materials Forecast
  • 8.2.1 Forecast By Chemical and Material
  • 8.2.2 Chemical Use Per Unit Area Of Silicon Processed
  • 8.2.3 Market Shares

Chapter 9 - Strategic Customer Issues

• 9.1 Benchmarking a Vendor
  • 9.1.1 Statistical Quality Control
    • Assay and Related Items
    • Trace Elements
    • Particles
  • 9.1.2 Analytical Capabilities
  • 9.1.3 Product Manufacturing And/Or Sourcing
  • 9.1.4 General Considerations
    • Installation and Retrofitting Costs
• 9.2 In-House Quality Control And Assurance
  • 9.2.1 Analytical Tools
  • 9.2.2 How Much Testing
  • 9.2.3 Exhaust Gas Analysis

LIST OF FIGURES

• 3.1 Minimum Feature Size for Dynamic RAMs With Time
• 3.2 ITRS Roadmap Screening Tool
• 3.3 Chemical And Material Technology Requirements
• 4.1 Relationship Between Device Yield and Particles
• 4.2 Relationship Between Die Yield and Chip Size
• 4.3 Chemical Management Services Tasks
• 6.1 ITRS Roadmap
• 8.1 Chemical/Semiconductor Revenue Ratio
• 8.2 Worldwide Resist Market
• 8.3 Worldwide Resist Market by Geographic Region
• 8.4 Resist/Semiconductor Revenue Ratio
• 8.5 Silicon Wafer Market
• 8.6 Silicon Wafer Market
• 8.7 Cost of Chemicals Per Square Inch of Silicon
• 8.8 Worldwide Market Shares for Gas Suppliers
• 8.9 Worldwide Market Shares for Liquid Chemical Suppliers
• 8.10 Worldwide Market Shares for Photoresist Suppliers
• 8.11 Worldwide Market Shares for Sputtering Target Suppliers
• 8.12 Worldwide Market Shares for Silicon Wafer Companies

LIST OF TABLES

• 3.1 Interconnect Levels Of Logic Device
• 4.1 Common Wafer Processing Chemicals
• 4.2 Photoresist Stripping Solutions
• 4.3 Wet Stripping Systems
• 4.4 Purity Requirements Of Wet Chemicals
• 5.1 Gas Control System Issues
• 5.2 Potential Hazards of Processing Gases
• 7.1 Worldwide Growth of CMS
• 7.2 Cost of Ownership of CMS
• 8.1 Worldwide Forecast of Chemicals and Materials for IC Manufacture
• 8.2 Worldwide Liquid Chemical Market by Chemical
• 8.3 Worldwide Market Forecast of Si Wafers
• 8.4 Worldwide Market Forecast of Sputtering Targets