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Market Research Report

Cleanrooms and Contamination Control in VLSI Manufacturing

Published by The Information Network Contact us : +1-860-674-8796
Published 2007/06 Content info  
Product code 4960
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Description TOC

Table of Contents

Chapter 1 Introduction

  • 1.1 The Need For This Report

Chapter 2 Executive Summary

  • 2.1 Summary of Major Findings
  • 2.2 Summary of Market Forecast

Chapter 3 Cleanroom Design

  • 3.1 Types of Cleanrooms
  • 3.2 Minienvironments
    • 3.2.1 200mm
    • 3.2.2 300mm
  • 3.3 Airflow Filtering
  • 3.4 Electrostatic Discharge
  • 3.5 Impact of ASIC Devices
  • 3.6 Impact of VLSI Devices
  • 3.7 Impact of Factory Automation and 300mm Wafers

Chapter 4 Worldwide Semiconductor Fabs

  • 4.1 North American Fabs
    • Company
    • Address
    • Size of Wafer Processed
    • Minimum Feature Size
    • Process Technology
    • Principle Products
    • Employees
    • Plant Area
    • Cleanroom Area
  • 4.2 European Fabs
    • Company
    • Address
    • Size of Wafer Processed
    • Minimum Feature Size
    • Process Technology
    • Principle Products
    • Employees
    • Plant Area
    • Cleanroom Area
  • 4.3 Japanese Fabs
    • Company
    • Address
    • Size of Wafer Processed
    • Minimum Feature Size
    • Process Technology
    • Principle Products
    • Employees
    • Cleanroom Area
  • 4.4 Korean Fabs
    • Company
    • Address
    • Size of Wafer Processed
    • Minimum Feature Size
    • Process Technology
    • Principle Products
    • Employees
    • Cleanroom Area
    • Total Sales
  • 4.5 Taiwan Fabs
    • Company
    • Address
    • Size of Wafer Processed
    • Minimum Feature Size
    • Process Technology
    • Principle Products
    • Employees
    • Cleanroom Area
  • 4.6 ROW Fabs
    • Company
    • Address
    • Size of Wafer Processed
    • Minimum Feature Size
    • Process Technology
    • Principle Products
    • Employees
    • Cleanroom Area

Chapter 5 Contamination Issues

  • 5.1 Liquid Chemicals
    • 5.1.1 Purification Methods
    • 5.1.2 Particulates
      • Effects on Yield
      • Particulate Removal
      • Particle Monitoring
    • 5.1.3 Bulk Distribution vs Bottles
    • 5.1.4 Piping System Construction
      • Materials of Construction
      • Cost Analysis
  • 5.2 Gases
    • 5.2.1 Technology Issues
    • 5.2.2 Requirements
      • Purification Alternatives
      • Purity Trends
      • Particulate Considerations
  • 5.3 Deionized Water
    • 5.3.1 Purification Specifications
    • 5.3.2 Purification Specification
    • 5.3.3 Purity Measurement Techniques
    • 5.3.4 Filtration And Ultrafiltration
    • 5.3.5 Piping System Construction
    • 5.3.6 DI Water System Costs
  • 5.4 Processing Equipment
    • 5.4.1 Detection Methods
    • 5.4.2 Removal Techniques

Chapter 6 Market Forecast

  • 6.1 Market Forecast Assumptions
  • 6.2 Cleanroom Construction
    • 6.2.1 Cleanroom Design Criteria
    • 6.2.2 Class 1 Construction Costs
    • 6.2.3 Cleanroom Forecast
  • 6.3 Wet Stations And Spray Processors
  • 6.3 Forecasts of Liquid and Gas Filters
  • 6.4 Gas Purification Systems Market

Chapter 7 Strategic User Issues

  • 7.1 Cleanroom Personnel
  • 7.2 User Requirements
    • 7.2.1 Benchmarking a Vendor
  • 7.3 Need for Standardization

Chapter 8 Strategic Supplier Issues

  • 8.1 Process Equipment Cleanliness
  • 8.2 Supplier Strategies
  • 8.3 Supplier Opportunities

LIST OF TABLES

  • 3.1 Cleanroom HVAC Requirements
  • 3.2 General Cleanroom Operating Cost Breakdown
  • 3.3 Equipment Minienvironments
  • 3.4 Comparison Table of DRAM Production Factors
  • 5.1 Advantages and Disadvantages of Various Cleaning Metho
  • 5.2 Chemical and Material Compatibility
  • 5.3 Piping System Economic Analysis for Positive Developer
  • 5.4 Gas Control System Issues
  • 5.5 Range of Purity of CVD Gases
  • 5.6 Potential Hazards of Processing Gases
  • 5.7 Particle Sources
  • 5.8 Location of In-Situ Monitors By Equipment Type
  • 6.1 Worldwide Wafer Fab Projects -- U.S.
  • 6.2 Worldwide Wafer Fab Projects -- Japan
  • 6.3 Worldwide Wafer Fab Projects -- Europe
  • 6.4 Worldwide Wafer Fab Projects -- Korea
  • 6.5 Worldwide Wafer Fab Projects - Taiwan
  • 6.6 Worldwide Wafer Fab Projects - Asia
  • 6.7 Market Shares Of Automated Wet Station Suppliers
  • 6.8 Market Shares Of Spray Processor Suppliers
  • 6.9 Market For Large Gas Purification Systems
  • 6.10 Market For POU Gas Purification Systems
  • 6.11 Market For Catalytic Absorption Purification Systems
  • 6.12 Market For Catalytic Absorption Purification Systems
  • 6.13 Market For Palladium Purification Systems
  • 6.14 Market For Palladium Purification Systems
  • 6.15 Market For Getter Purification Systems
  • 6.16 Market For Getter Purification Systems
  • 6.17 Market For Resin Purification Systems
  • 6.18 Market For Resin Purification Systems

LIST OF FIGURES

  • 1.1 Cleanroom Class Vs Feature Size
  • 3.1 Fab Cost Versus Year
  • 3.2 Contamination Levels With and Without SMIF Box
  • 3.3 FOUP in Cluster Tool
  • 3.4 Contamination Levels During Cleanroom Work Cycles
  • 5.1 Relationship Between Device Yield and Particles
  • 5.2 Relationship Between Die Yield and Chip Size
  • 5.3 Sources of Particles
  • 6.1 Cleanroom Class Vs Feature Size
  • 6.2 Cost of a Semiconductor Facility
  • 6.3 Equipment and Facility Cost Ratio
  • 6.4 Fab Operational Cost Structure Versus Feature Size
  • 7.1 Example of a QC Flow Chart
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