Table of Contents
Chapter 1 - Introduction
- 1.1 The Need For This Report
Chapter 2 - Executive Summary
- 2.1 Summary of Major Issues
- 2.2 Summary of Market Opportunities
Chapter 3 - Lithography Issues And Trends
- 3.1 Optical Systems
- 3.1.1 Step-and-Repeat Aligners
- 3.1.2 248nm DUV Resist
- 3.1.3 193nm DUV Resist
- 3.1.4 Mix-and-Match
- 3.1.5 Immersion Lithography
- 3.1.6 EUV
- 3.2 X-Ray Systems
- 3.2.1 X-Ray Sources
- 3.2.2 X-Ray Masks
- 3.2.3 X-Ray Steppers
- 3.2.4 X-Ray Resists
- 3.3 Electron Beam Systems
- 3.4 Ion Beam Systems
- 3.4.1 Direct Write
- 3.4.2 Ion Channel Masking
- 3.4.3 Ion Projection
- 3.5 Nano-Imprint Lithography
- 3.6 New Technologies
- 3.6.1 Mulith Reference Distribution Aerial Image Formation
- 3.6.2 Holograms
- 3.6.3 X-Ray Laser
- 3.6.4 Atom Lithography
- 3.6.5 Microlenses
- 3.6.7 EWL Lithography
- 3.7 Evaluation of Lithography Cost of Ownership
- 3.7.1 Introduction
- 3.6.2 Cost of Ownership Model
- 3.6.3 Results of Cost of Ownership Calculation
- 3.6.4 Individual Cost Estimation
- Lithography System Cost
- Process Costs
- Mask Costs
- 3.7 Conclusion
Chapter 4 - User - Supplier Strategies
- 4.1 Determining Lithography Needs
- 4.2 Benchmarking a Vendor
- 4.2.1 Pricing
- 4.2.2 Vendor Commitment and Attitudes
- 4.2.3 Vendor Capabilities
- 4.2.4 System Capabilities
- 4.2.5 Vendor Feedback During Equipment Evaluation
- 4.2.6 Vendor Feedback During Device Production
- 4.3 Competitive Environment
- 4.4 Equipment For Class 1 Cleanrooms
- 4.5 Equipment For the Factory of the Future
- 4.6 Opportunities
Chapter 5 - Market Forecast
- 5.1 Driving Forces
- 5.1.1 Technical Trends
- 5.1.2 Economic Trends
- 5.1.3 Optical Limitations
- 5.2 Market Forecast Assumptions
- 5.3 Market Forecast
LIST OF TABLES
- 3.1 Lithography Requirements for IC Production
- 3.2 Characteristics of X-Ray Systems
- 3.3 Basic Conditions of CoO Model
- 3.4 Calculation List of Lithography System Cost
- 3.5 Throughput Estimation of X-Ray Lithography
- 3.6 Cost of Reticle/X-Ray Mask
- 3.7 Phase Shift Mask and X-Ray Mask Manufacturing
- 5.1 Worldwide Capital Spending 2005 - 2007
- 5.2 DRAM Lithographic Requirements
- 5.3 Worldwide Optical Stepper Market
- 5.4 Worldwide Stepper Market Shares - 1992-2008
LIST OF FIGURES
- 1.1 Lithographic Equipment Requirements for DRAMs
- 3.1 Lithography Roadmap
- 3.2 Lens Arrangement For Submicron Features
- 3.3 Advanced Optical Lithography Scenarios
- 3.4 Mix-and-Match Approaches
- 3.5 High Index Refractive Materials
- 3.6 EUV Lithography
- 3.7 Illustration of X-Ray Lithography
- 3.8 Schematic Of Scalpel Electron Beam System
- 3.9 Multi-Source E-Beam Lithography
- 3.10 Principles of LEEPL
- 3.11 Ion Projection Lithography System
- 3.12 Hermoplastic Nanoimprint Lithography Process
- 3.13 Step And Flash Nanoimprint Lithography Process
- 3.14 Mulith Reference Distribution Aerial Image Formation
- 3.15 Schematic of Microlens
- 3.16 Mapper Mask-Based Lithography
- 3.17 Mapper Maskless Lithography
- 3.18 CoO Value in DRAM Mass Production
- 3.19 Lithography Costs for 40,000 Wafers/Mask
- 3.20 Lithography Costs for 1,000 Wafers/Mask
- 4.1 Manufacturing Costs Per Exposure Station
- 5.1 Lithography Market Vs Equipment Market
- 5.2 Lithography Double Exposure Technique
- 5.3 Lithography Requirements
- 5.4 Lithography Extensions
- 5.5 Lithography Cost of Ownership
- 5.6 Segmentation of Stepper/Scan Shipments
- 5.7 Market Shares of Vendors (Units) - 2008
- 5.8 Unit Market Shares of Vendors - 1992-2008
- 5.9 Worldwide I-Line Market Shares - 2008
- 5.10 Worldwide 248nm Market Shares - 2008
- 5.11 Worldwide 193nm Dry Market Shares - 2008
- 5.12 Worldwide 193nm Wet Market Shares - 2008
- 5.13 Market Shares of Vendors (Revenues) - 2008
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