Table of Contents
Chapter 1 - Introduction
- 1.1 The Need For This Report
Chapter 2 - Executive Summary
- 2.1 Summary of Major Issues
- 2.2 Summary of Market Opportunities
Chapter 3 - Technology Issues
- 3.1 Mask Making
- 3.1.1 Mask Blanks
- 3.1.2 Completed Masks
- 3.2 Mask Making Equipment
- 3.2.1 Electron Beam Systems
- 3.2.2 Laser Pattern Generators
- 3.3 Mask Inspection
- 3.3.1 Mask Defects
- Transmission Variations
- Transparent Defects
- Nuisance Defects
- CD Variations
- Reflectivity Variations
- 3.4 Mask Repair
- 3.4.1 Laser Repair
- 3.4.2 Focused Ion Beam Repair
- 3.4.3 Other Repair Methods
Chapter 4 - User - Vendor Strategies
- 4.1 Establishing User Needs
- 4.1.1 Mask Making - Merchant or Captive
- 4.1.2 Submicron Mask Making Equipment - Laser vs E-Beam
- 4.1.3 Mask Inspection Equipment
- 4.1.4 Mask Repair - Laser vs FIB
- 4.1.5 Phase-Shift Masks
- 4.1.6 Optical Proximity Correction
- 4.1.7 NGL Technology Challenges
- 4.1.7.1 X-Ray Masks
- 4.1.7.2 EPL Masks
- 4.1.7.3 EUVL Masks
- 4.2 Competitive Vendor Opportunities
Chapter 5 - Market Forecast
- 5.1 Driving Forces
- 5.1.1 Introduction
- 5.1.2 Trends in IC Processing Technology
- 5.1.3 Mask and Reticle Requirements
- 5.1.4 Fast Turnaround Devices
- 5.1.5 Impact of Direct Write E-Beam and X-Ray
- 5.2 Market Forecast Assumptions
- 5.3 Mask Making, Inspection, and Repair
- 5.3.1 Completed Mask Market
- 5.3.2 Reticle/Mask Manufacturing Equipment
LIST OF FIGURES
- 3.1 Light Transmittance of Glasses
- 3.2 Photomask Fabrication Flow
- 3.3 Optical Photomask Fabrication Flow
- 3.4 SCAPLEL Photomask Fabrication Flow
- 3.5 MaskRigger Software in a Mask Fabrication Process
- 3.6 Schematic of a Laser Pattern Generator
- 3.7 Mulith Reference Distribution Aerial Image Formation
- 3.8 Die-to-Die and Die-to-Database Inspection
- 3.9 Defect Inspection Practices - 2007
- 3.10 Percentage of Yield Losses - 2007
- 3.11 Yield for Binary Masks - 2007
- 3.12 Yield for PSM Masks - 2007
- 3.13 Schematic of a Focused Ion Beam System
- 3.14 Illustration of Clear and Opaque Mask Repair
- 4.1 Write Time Versus Device Complexity
- 4.2 Subwavelength Gap
- 4.3 Lithography Requiements
- 4.4 Phase-Shifting Masks
- 4.5 iN Phase Mask Design
- 4.6 Illustration of OPC
- 4.7 Main NGL Mask Formats
- 4.8 Mask Costs Versus Feature Size
- 5.1 Production Costs for Maskmaking
- 5.2 Capital Expenditures and Revenues
- 5.3 Photomask Functionality
- 5.4 Worldwide Merchant Mask Making Market Shares
- 5.5 North American Merchant Mask Making Market Shares
- 5.6 European Merchant Mask Making Market Shares
- 5.7 Pacific Rim Merchant Mask Making Market Shares
- 5.8 Japan Merchant Mask Making Market Shares
- 5.9 Worldwide Mask Making Equipment Market Shares
- 5.10 Mask Inspection Market Shares
- 5.11 Mask Repair Market Shares
- 5.12 Photomask Repair Methods
LIST OF TABLES
- 4.1 FIB and Laser Repair Comparison
- 4.2 NGL Mask Formats
- 4.3 Cost of Reticle/X-Ray Mask
- 4.4 Phase Shift Mask and X-Ray Mask Manufacturing
- 5.1 Overall Roadmap of Technology Characteristics
- 5.2 Roadmap of Mask Inspection
- 5.3 IC Lithographic Requirements
- 5.4 Increasing Mask Complexity
- 5.5 Worldwide Mask Making Market by Feature Size
- 5.6 Captive Mask Shops
- 5.7 Worldwide Mask Making Equipment Market Forecast
- 5.8 Worldwide Mask Making Equipment Market Shares
- 5.9 Mask Inspection Market Forecast
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