300mm/Copper/Low-K Convergence:Timing, Trends, Issues, Market Analysis

Table of Contents

Chapter 1 - Introduction

Chapter 2 - Executive Summary

• 2.1 Summary of Technical Issues
• 2.2 Summary of Market Forecasts

Chapter 3 - 300mm Wafer Issues and Trends

• 3.1 Introduction
• 3.2 Industry Consortia
  • 3.2.1 International Sematech
  • 3.2.2 SEMI
  • 3.2.3 SELETE
  • 3.2.4 J300
  • 3.2.5 SEA
  • 3.2.6 MEDEA
• 3.3 Benefits of 300mm Wafers
• 3.4 Impact on Small IC Manufacturers
• 3.5 Impact on ASIC Manufacturers
• 3.6 Costs
  • 3.6.1 Cost Breakdown
  • 3.6.2 Requirements For IC Manufacturers
• 3.7 Impact on Automation
  • 3.7.1 Software
  • 3.7.2 Minienvironments
  • 3.7.3 Robots
  • 3.7.4 Cluster Tools
• 3.8 300 mm Fab Construction Plans
• 3.9 300mm Prime
• 3.10 450mm Fabs
  • 3.10.1
  • 3.10.2 450mm Wafer Technical Issues
  • 3.10.3 Economic Challenges

Chapter 4 - Copper Issues and Trends

• 4.1 Advantages of Copper
• 4.2 Copper Processing Challenges
• 4.3 Metal Deposition
  • 4.3.1 Seed Layer
  • 4.3.2 Bulk Copper Fill
• 4.4 Barriers
• 4.5 Planarization
• 4.6 Metrology
• 4.7 Competing against Aluminum Damascene
• 4.8 Equipment Suppliers' Copper Electroplating Products
• 4.9 IC Manufacturers' Copper Plans
• 4.10 Summary
  • 4.10.1 Advantages/Disadvantages of Cu
  • 4.10.2 Processing Issues
  • 4.10.3 Challenges

Chapter 5 - Low-K Dielectric Issues and Trends

• 5.1 Introduction
• 5.2 Ideal Dielectric
• 5.3 Types of Low-K Dielectrics
  • 5.3.1 FSG
  • 5.3.2 HSQ
  • 5.3.3 Nanoporous Silica
  • 5.3.4 Spin-on Polymers
  • 5.3.5 BCB
  • 5.3.6 Flowfill
  • 5.3.7 CVD
  • 5.3.8 AF4
  • 5.3.9 PTFE
• 5.4 Processing Issues
• 5.5 Summary
  • 5.5.1 Integration Issues
  • 5.5.2 Low-K Dielectric Issues

Chapter 6 - Market Analysis

• 6.1 Semiconductor Market
• 6.2 Road to Recovery
• 6.3 Market Forecast Assumptions
• 6.4 300mm Wafer Market
• 6.5 300mm Equipment Market
  • 6.5.1 300mm Equipment Tools
  • 6.5.2 Factory Automation in 300mm Fab Market
• 6.6 Copper Processing Equipment Market
• 6.7 Low-K Market

TABLES

• 1.1 Planned 300mm Fab Construction
• 3.1 Increase in Wafer Sizes
• 3.2 Cost of 300mm Fab
• 3.3 300mm Fab Construction Plans
• 3.4 Generic Model For CZ Crystal Yield
• 5.1 Low-K Material Requirements
• 5.2 Low-K Materials
• 6.1 Worldwide Market Forecast of Si Wafers
• 6.2 Worldwide Market Forecast of 300mm Equipment
• 6.3 Process Tool Automation For 300mm Fabs
• 6.4 Worldwide Forecast of Automation Transfer Tools
• 6.5 Interconnect Technology Requirements
• 6.6 Worldwide Forecast of Copper Processing Equipment
• 6.7 Worldwide Forecast of Low-K Market

FIGURES

• 3.1 Selete' s Program Results
• 3.2 Larger Die Sizes More Efficiently Utilize 300mm Wafer Area
• 3.3 Increase in IC Size With Time
• 3.4 Economy Of Scale Factor
• 3.5 300mm and 200mm Fab Cost Comparison
• 3.6 300mm Fab Equipment Installs 2007
• 3.7 300mm Fab Equipment Installs 2006
• 3.8 300mm Fabs By Year 2000-2008
• 3.9 300mm Fabs By Location By Type - 2000-2008
• 3.10 Wafer Shipments 1973-2004
• 3.11 Wafer Shipments 1998-2010
• 3.12 Wafer Thickness Trends With Diameter
• 3.13 Polysilicon Usage By The Solar Industry
• 3.14 Increasing Cost Of Wafer With Time
• 4.1 Reduced Complexity of Copper Interconnect
• 4.2 Interconnect Delay for Copper
• 4.3 ALD Versus PVD Copper Barrier
• 4.4 Copper CMP Steps And Challenges
• 4.5 Electromigration Resistance
• 4.6 Metal Diffusion Barrier
• 4.7 Cu Planarization Process
• 4.8 Copper ECMD Process
• 4.9 Damascus Complete Copper
• 4.10 Copper/Low-K Interconnect Schemes
• 4.11 Copper And Low-K Integration Concerns
• 5.1 Low-K Roadmap
• 6.1 300mm Wafer Market As Percentage of Total Market
• 6.2 Electrochemical Deposition Market Shares - Revenues
• 6.3 Copper Implementation By Geographic Region
• 6.4 Copper Implementation By Feature Size
• 6.5 Low-K Deposition Market Shares