The GaAs IC Market

Table of Contents

Chapter 1 - Introduction

Chapter 2 - Executive Summary

• 2.1 Summary of Major Issues
• 2.2 Summary of Market Forecast

Chapter 3 - Technology Issues

• 3.1 GaAs Devices
  • 3.1.1 FETs
  • 3.1.2 HEMTs
  • 3.1.3 HBT
• 3.2 Comparison of Logic Structures
  • 3.2.1 Buffered FET Logic
  • 3.2.2 FET Logic
  • 3.2.3 Capacitively Enhanced Logic
  • 3.2.4 Direct-Coupled FET Logic
  • 3.2.5 Source-Coupled FET Logic
• 3.3 Material Issues
  • 3.3.1 Wafer Production
  • 3.3.2 Etch Pit Densities
• 3.4 Equipment
  • 3.4.1 Implanters
  • 3.4.2 Lithography
  • 3.4.3 Etching
  • 3.4.4 Deposition
  • 3.4.5 Rapid Thermal Processing
• 3.5 Packaging
  • 3.5.1 Package Types
  • 3.5.2 Bonding
• 3.6 Testing
• 3.7 Design

Chapter 4 - Applications for GaAs ICs

• 4.1 Introduction
  • 4.1.1 The Trend Toward Higher Frequencies
  • 4.1.2 Transition from Analog to Digital Modulation
  • 4.1.3 Discrete Components and Silicon-Based ICs
• 4.2 Markets
  • 4.2.1 Telecommunications Systems
  • 4.2.2 Television Systems
  • 4.2.3 Computing
  • 4.2.4 Data Communications
  • 4.2.5 Automotive
  • 4.2.6 Automated Test Equipment
  • 4.2.7 Military

Chapter 5 - IC Supplier and End-User Issues

• 5.1 Introduction
• 5.2 Competing Against Silicon
• 5.3 Competing Against The Japanese
• 5.4 Taiwan' s Market Momentum
• 5.5 Korea' s Market Momentum
• 5.6 Wafer Sizes
• 5.7 Competing Against SiGe
  • 5.7.1 Introduction
  • 5.7.2 Technology
    • 5.7.2.1 Strained Silicon
    • 5.7.2.2 Device Manufacturing
  • 5.7.3 Applications
    • 5.7.3.1 Wireless LAN
    • 5.7.3.2 WiMAX
    • 5.7.3.3 Bluetooth
    • 5.7.3.4 Cellular
    • 5.7.3.5 GPS

Chapter 6 - Market Forecast

• 6.1 Driving Forces
• 6.2 Market Forecast Assumptions
• 6.3 GaAs IC Market Forecast
• 6.4 SiGe IC Market Forecast
• 6.5 End Application Market

Chapter 7 - Profile of GaAs IC Manufacturers

LIST OF TABLES

• 5.1 Cost Comparison for GaAs Structures
• 5.2 A Comparison of SiGe BiCMOS, RF CMOS, and InGaP/GaAs
• 6.1 Worldwide Merchant GaAs IC Market Forecast By Device Type
• 6.2 Worldwide Merchant Market Forecast By Geographical Region
• 6.3 Worldwide Merchant Market Forecast By Application
• 6.4 Market Shares of U.S. Merchant Participants - 2008
• 6.5 A Comparison of SiGe BiCMOS, RF CMOS, and InGaP/GaAs

LIST OF FIGURES

• 3.1 Schematic of GaAs MESFET
• 3.2 Schematic of GaAs HEMT Device
• 3.3 Schematic of GaAs HBT Device
• 3.4 Schematic of GaAs HBT Device
• 3.5 Symbolic Representations of Various GaAs Transistor Type
• 3.6 Schematic of BFL Logic Gate
• 3.7 Schematic of FETL Logic Gate
• 3.8 Schematic of CEL Logic Gate
• 3.9 Schematic of DCFL Logic Gate
• 3.10 Schematic of SCFL Logic Gate
• 3.11 Full wafer EPD mapping of LEC and VGF wafers
• 3.12 Mesoscopic EL2 mapping of LEC and VGF wafers
• 3.13 pHEMT MMIC Process Flow Chart
• 3.14 0.15 Micron 3MI Process Cross Section
• 3.15 InGaP HBT Process
• 5.1 Comparison of Die Costs of Si and GaAs
• 5.2 Strained Silicon Germanium Technology
• 5.3 Fourth Generation Of Strain Technology
• 5.4 Performance Versus Germanium Content
• 5.5 Bulk Versus SOI Strain Method
• 6.1 Worldwide Merchant GaAs IC Market Forecast
• 6.2 Worldwide GaAs Merchant Market Forecast By Geographical Region
• 6.3 Worldwide GaAs Merchant Market Forecast By Application
• 6.4 Global Handset Market
• 6.5 Migration Of PA' s In Handset Market
• 6.6 CMOS Replacement Of Bipolar And GaAs
• 6.7 Worldwide SiGe Market Forecast