Abstract
Up to 11 layers of wiring with a cumulative wire length >1.4km will be used
on a 10mm square microprocessor introduced in 2007. In a typical MPU
cross-section, tungsten studs in a planarized PSG pre-metal dielectric layer
are typically used to make contact between the copper Metal 1 layer and the
device gate and diffusions. A single damascene process is used for Metal 1,
and the product layout uses staggered contacts to allow for the tightest
pitch. A dual-damascene process is used for subsequent intermediate and global
wiring layers. All Cu wires are encased by a metallic diffusion barrier on
sidewall and bottom regions, and by a dielectric capping layer on top of the
wire that also functions as a diffusion barrier.
CMOS-based devices will remain “the industry workhorse” beyond
2020, although it also states that new devices appearing toward the end of the
next decade will use new methods of processing and storing information.
Because most of these products will require new materials, a subchapter was
added in a new separate section covering emerging devices.
This report examines and projects the technologies involved in the fabrication
of VLSI semiconductor devices, their likely developments, why and when their
introduction or demise will take place, what problems and choices are facing
users, and where the opportunities and pitfalls are. It is written from an
industry perspective.
The 350 processing steps required to make an integrated circuit (IC) entail
the use of chemicals and equipment, all housed in a contamination-free
environment or cleanroom. This report discusses the technology trends,
products, applications, and suppliers of chemicals (liquids and gases) and
equipment (lithography, mask making, plasma etching, deposition, CMP,
automation, and metrology).
This report is written for the purpose of assisting the reader in evaluating
the spectrum of products, packaging, and dispensing systems available for his
use. It also suggests criteria for selecting a vendor as well as a chemical
delivery and dispensing system that will serve his specific requirements.
It also gives insights to suppliers for future user needs and should assist
them in long-range planning, new product development and product improvement.
This report' s numerous illustrations and diagrams make it a time-saving
resource for anyone involved in the IC industry. It addresses the strategic
issues impacting both the user and supplier of chemicals and equipment and
is written for:
- Executive personnel of semiconductor manufacturing facilities
- Strategic planners of semiconductor facilities
- Buyers of chemicals and equipment for the semiconductor industry
- Product planners of chemicals and equipment to the semiconductor industry
- Chemical and equipment suppliers to the semiconductor industry
- Investment analysts
This report examines and projects the technology of equipment and materials
involved in the fabrication of VLSI semiconductor devices, their likely
developments, why and when their introduction or demise will take place, what
problems and choices are facing users, and where the opportunities and
pitfalls are. This report discusses the technology trends, products,
applications, and suppliers of chemicals (liquids and gases) and equipment
(lithography, plasma etching, and CMP). It also gives insights to suppliers
for future user needs and should assist them in long range planning, new
product development and product improvement.
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