The Global Market for Equipment and Materials for IC Manufacturing

Table of Contents

Chapter-1: Introduction

Chapter-2: Low-K Dielectric Issues and Trends

• 2.1 Introduction
• 2.2 Ideal Dielectric
• 2.3 Types of Low-K Dielectrics
  • 2.3.1 FSG
  • 2.3.2 HSQ
  • 2.3.3 Nanoporous Silica
  • 2.3.4 Spin-on Polymers
  • 2.3.5 BCB
  • 2.3.6 Flowfill
  • 2.3.7 CVD
  • 2.3.8 AF4
  • 2.3.9 PTFE
• 2.4 Summary
  • 2.4.1 Processing Issues
  • 2.4.2 Integration Issues

Chapter-3: Lithography Issues And Trends

• 3.1 Optical Systems
  • 3.1.1 Step-and-Repeat Aligners
  • 3.1.2 248nm DUV Resist
  • 3.1.3-193nm DUV Resist
  • 3.1.4 Mix-and-Match
  • 3.1.5 Immersion Lithography
  • 3.1.6 EUV
• 3.2 X-Ray Systems
  • 3.2.1 X-Ray Sources
  • 3.2.2 X-Ray Masks
  • 3.2.3 X-Ray Steppers
  • 3.2.4 X-Ray Resists
• 3.3 Electron Beam Systems
• 3.4 Ion Beam Systems
  • 3.4.1 Direct Write
  • 3.4.2 Ion Channel Masking
  • 3.4.3 Ion Projection
• 3.5 Nano-Imprint Lithography
• 3.6 New Technologies
  • 3.6.1 Mulith Reference Distribution Aerial Image Formation
  • 3.6.2 Holograms
  • 3.6.3 X-Ray Laser
  • 3.6.4 Atom Lithography
  • 3.6.5 Microlenses
  • 3.6.7 EWL Lithography
• 3.7 Evaluation of Lithography Cost of Ownership
  • 3.7.1 Introduction
  • 3.6.2 Cost of Ownership Model
  • 3.6.3 Results of Cost of Ownership Calculation
  • 3.6.4 Individual Cost Estimation
    • Lithography System Cost
    • Process Costs
    • Mask Costs
• 3.7 Conclusion

Chapter-4: CMP Issues and Trends

• 4.1 Need for Planarity
  • 4.1.1 Lithography
  • 4.1.2 Deposition
  • 4.1.3 Etching
• 4.2 Applications
  • 4.2.1 Dielectrics
  • 4.2.2 Metals
• 4.3 Planarization Techniques
  • 4.3.1 Local Planarization
    • 4.3.1.1 Deposition-Etchback
    • 4.3.1.2 ECR
    • 4.3.1.3 Oxide Reflow
    • 4.3.1.4 Spin-on-Glass
    • 4.3.1.5 TEOS-Ozone
    • 4.3.1.6 Laser
  • 4.3.2 Global Planarization
    • 4.3.2.1 Polymer
    • 4.3.2.2 Polyimide
    • 4.3.2.3 Isotropic Etch
    • 4.3.2.4 Spin Etch Planarization
    • 4.3.2.5 Electropolishing
• 4.4 Chemical Mechanical Polishing (CMP)
  • 4.4.1 Background
  • 4.4.2 Research Efforts
  • 4.4.3 Advantages and Disadvantages
  • 4.4.4 Process Parameters
    • 4.4.4.1 STI Planarization
    • 4.4.4.2 Copper CMP
    • 4.4.4.3 Low-K Integration
    • 4.4.4.4 Defect Density
    • 4.4.4.5 Metrology

Chapter-5: Factory Automation Issues and Trends

• 5.1 Introduction
• 5.2 Elements of Automation
  • 5.2.1 Tool Automation
  • 5.2.2 Intrabay Automation
  • 5.2.3 Interbay Automation
  • 5.2.4 Material-Control System
• 5.3 Flexible Automation
• 5.4 Reliability
• 5.5 Tool Issues and Trends
  • 5.5.1 Flexible Tool Interface
  • 5.5.2 Vacuum Robotics
  • 5.5.3 AGV
  • 5.5.4 CMP
  • 5.5.5 300-mm Wafer Transport
  • 5.5.6 Mini-Environments and Cleanroom Issues

Chapter-6: Thin film Deposition Issues and Trends

• 6.1 Physical Vapor Deposition
  • 6.1.1 Sputtering Technology
  • 6.1.2 Plasma Technology
  • 6.1.3 Reactor Designs
    • 6.1.3.1 Long-Throw Deposition
    • 6.1.3.2 Collimated Sputter Deposition
    • 6.1.3.3 Showerhead Deposition
    • 6.1.3.4 Ionized PVD
• 6.1.4 Semiconductor Processing
  • 6.1.4.1 Feature Patterning
  • 6.1.4.2 Gap Fill
• 6.2 Chemical Vapor Deposition (CVD) Techniques
  • 6.2.1 APCVD
  • 6.2.2 LPCVD
  • 6.2.3 PECVD
  • 6.2.4 HDPCVD
  • 6.2.5 ALD

Chapter-7: Plasma Etching Issues and Trends

• 7.1 Introduction
• 7.2 Processing Issues
  • 7.2.1 Chlorine Versus Fluorine Processes
  • 7.2.2 Multilevel Structures
  • 7.2.3 New Metallization Materials
  • 7.2.4 GaAs Processing
• 7.3 Plasma Stripping
  • 7.3.1 Photoresist Stripping
  • 7.3.2 Low-K Removal

Chapter-8: Cluster Tools Issues and Trends

• 8.1 Definitions
• 8.2 Device Technology and Integrated Processing
• 8.3 Main Functional Units
  • 8.3.1 Central Handling Platform
  • 8.3.2 Cassette Stations
  • 8.3.3 Extension Modules
  • 8.3.4 Single Process Modules
  • 8.3.5 Batch Modules
  • 8.3.6 Multiple Process Modules
• 8.4 Cluster Tool Communications
  • 8.4.1 Cluster Tool Controller
  • 8.4.2 Transport Module Controller
  • 8.4.3 Process Module Controller
  • 8.4.4 Control Software
  • 8.4.5 Human Interface Software
  • 8.4.6 Networking Software
• 8.5 Vacuum System Design
• 8.6 Trends
  • 8.6.1 Deposition - Plasma Etch
  • 8.6.2 Deposition - Rapid Thermal Processing
  • 8.6.3 Lithography - Resist Processing
  • 8.6.4 Diagnostics - Process
  • 8.6.5 CMP Polish - Clean

Chapter-9: Chemicals and Materials Issues and Trends

• 9.1 Liquid Chemicals
  • 9.1.1 Acids and Solvents
  • 9.1.2 Resists
    • 9.1.2.1 Resist Materials
    • 9.1.2.2 Resist Strippers
• 9.2 Purity Requirements
  • 9.2.1 Purification Methods
    • 9.1.1.1 Trends For Purity - Trace Elements
  • 9.2.2 Particulates
    • 9.2.2.1 Particulate Removal Techniques
    • 9.2.2.2 Particle Monitoring
• 9.3 Chemical Management
• 9.4 Gases
  • 9.4.1 Requirements
    • 9.4.1.1 Purification Alternatives
  • 9.4.2 Particulate Considerations
    • 9.4.2.1 Particle Monitoring
    • 9.4.2.2 Filtration Methods
  • 9.4.3 Summary
• 9.5 Chemical Management
• 9.6 Sputtering and Evaporation Materials
  • 9.6.1 Technology Issues
  • 9.6.2 Purity Requirements

Chapter-10: Contamination Issues and Trends

• 10.1 Liquid Chemicals
  • 10.1.1 Purification Methods
  • 10.1.2 Particulates
    • 10.1.2.1 Effects on Yield
    • 10.1.2.2 Particle Removal
    • 10.1.2.3 Particle Monitoring
  • 10.1.3 Bulk Distribution vs Bottles
  • 10.1.4 Piping System Construction
    • 10.1.4.1 Materials of Construction
    • 10.1.4.2 Cost Analysis
• 10.2 Gases
  • 10.2.1 Technology Issues
  • 10.2.2 Requirements
    • 10.2.2.1 Purification Alternatives
    • 10.2.2.2 Purity Trends
    • 10.2.2.3 Particulate Considerations
• 10.3 Deionized Water
  • 10.3.1 Purification Specifications
  • 10.3.2 Purification Methods
  • 10.3.3 Purity Measurement Techniques
  • 10.3.4 Filtration and Ultrafiltration
  • 10.3.5 Piping System Construction
  • 10.3.6 DI Water System Costs
• 10.4 Processing Equipment
  • 10.4.1 Detection Methods
  • 10.4.2 Removal Techniques

Chapter-11: Metrology

• 11.1 Defect Review/Wafer Inspection
  • 11.1.2 Defect Review
    • 11.1.2.1 SEM Defect Review
    • 11.1.2.2 Optical Defect Review
    • 11.1.2.3 Other Defect Review
  • 11.1.3 Patterned Wafer Inspection
    • 11.1.3.1 E-Beam Patterned Wafer Inspection
    • 11.1.3.2 Optical Patterned Wafer Inspection
  • 11.1.4 Unpatterned Wafer Inspection
  • 11.1.5 Macro-Defect Inspection
• 11.2 Thin Film Metrology
  • 11.2.1 Metal Thin-Film Metrology
  • 11.2.2 Non-Metal Thin-Film Metrology
  • 11.2.3 Substrate Metrology
• 11.3 Lithography Metrology
  • 11.3.1 Overlay
  • 11.3.2 CD
  • 11.3.3 Mask (Reticle) Metrology/Inspection

Chapter-12: Market Forecast

• 12.1 Market Drivers
  • 12.1.1 Semiconductor Market
  • 12.1.2 Technical Trends
  • 12.1.3 Economic Trends
  • 12.1.4 Geographic Trends
    • 12.1.1.1 China
    • 12.1.4.2 Asia
    • 12.1.4.3 Europe
    • 12.1.4.4 Japan
    • 12.1.4.5 United States
• 12.2 Market Forecast Assumptions
• 12.3 Low-K Market
• 12.4 Lithography Market
• 12.5 CMP Market
  • 12.5.1 CMP Polisher Market
  • 12.5.2 CMP Slurry Market
• 12.6 Factory Automation Market
• 12.7 Thin Film Deposition Market
  • 12.7.1 Chemical Vapor Deposition Market
  • 12.7.2 Physical Vapor Deposition Market
• 12.8 Plasma Etching Market
• 12.9 Cluster Tool Market
  • 12.9.1 Flexible Cluster Tool Market
  • 12.9.2 Non-Flexible Cluster Tool Market
• 12.10 Chemical and Materials Market
  • 12.10.1 Forecast by Chemical and Material
  • 12.10.2 Market Shares
• 12.11 Cleanroom and Contamination Market
• 12.12 Metrology Market

FIGURES

• 2.1 Interconnect Delay for Copper/Low-K
• 3.1 Lithography Roadmap
• 3.2 Lens Arrangement For Submicron Features
• 3.3 Advanced Optical Lithography Scenarios
• 3.4 Mix-and-Match Approaches
• 3.5 High Index Refractive Materials
• 3.6 EUV Lithography
• 3.7 Illustration of X-Ray Lithography
• 3.8 Schematic Of Scalpel Electron Beam System
• 3.9 Multi-Source E-Beam Lithography
• 3.10 Principles of LEEPL
• 3.11 Ion Projection Lithography System
• 3.12 Hermoplastic Nanoimprint Lithography Process
• 3.13 Step And Flash Nanoimprint Lithography Process
• 3.14 Mulith Reference Distribution Aerial Image Formation
• 3.15 Schematic of Microlens
• 3.16 Mapper Mask-Based Lithography
• 3.17 Mapper Maskless Lithography
• 3.18 CoO Value in DRAM Mass Production
• 3.19 Lithography Costs for 40,000 Wafers/Mask
• 3.20 Lithography Costs for 1,000 Wafers/Mask
• 4.1 Planarization Lengths of Various Methods
• 4.2 Normalized Removal Rates
• 4.3 Reduced Complexity With Copper
• 4.4 Copper Loss From CMP
• 4.5 CMP Copper Process Technologies
• 4.6 CMP Performance Improvements
• 4.7 Polish Endpoint Control
• 5.1 Material-Control System
• 5.2 Traditional and Flexible Automated Material Handling System
• 5.3 Overhead Monorail Delivery - Cassette in Box, Cassette in SMIF Pod
• 5.4 Stocker Design and Interfaces
• 6.1 Schematic Of Sputtering System
• 6.2 Magnetron Sputtering Design
• 6.3 Showerhead Reactor Design
• 6.4 Ionized PVD
• 6.5 APCVD Reactor
• 6.6 Tube CVD Reactor
• 6.7 HDPCVD Reactor
• 6.8 ALD Versus PVD Copper Barrier
• 7.1 Various Enhanced Designs (a) Helicon, (b) Multiple ECR, (c) Helical Resonator
• 7.2 Schematic of Inductively Coupled Plasma Source
• 7.3 Schematic of the HRe Source
• 7.4 Schematic of the Dipole Magnet Source
• 7.5 Schematic of Chemical Downstream Etch
• 7.6 Silicon Trench Structure
• 7.7 Dual Damascene Dielectric Etch Approaches
• 8.1 Basic Cluster Tool Architecture
• 8.2 Basic Cluster Tool Architecture
• 8.3 Communications Architecture In A Cluster Tool
• 9.1 Chemical Management Services Tasks
• 9.2 ITRS Roadmap
• 10.1 Relationship Between Device Yield and Particles
• 10.2 Relationship Between Die Yield and Cost Size
• 10.3 Sources of Particles
• 11.1 Thin Film Metrology Challenges
• 11.2 Spectroscopic Ellipsometry Diagram
• 11.4 ITRS Overlay Technology Roadmap
• 11.5 NIST Line Edge Roughness Model
• 11.6 ITRS Metrology Roadmap
• 11.7 Schematic Of OCD Optics
• 11.8 Microlithography Process And Measurements
• 12.1 Low-K Deposition Market Shares
• 12.2 Worldwide Lithography Market Shares
• 12.3 Semiconductor Equipment Utilization
• 12.4 Market Shares of Automated Wafer Transfer Suppliers
• 12.5 Worldwide MCVD Market Shares
• 12.6 Worldwide DCVD Market Shares
• 12.7 Worldwide PVD Market Shares
• 12.8 Worldwide Market Shares for Dry Etch Equipment
• 12.9 Distribution of Etch Sales by Type
• 12.10 Market Forecast of Flexible Cluster Tools
• 12.11 Market Shares of Flexible Cluster Tools
• 12.12 Market Forecast of Non-Flexible Cluster Tools
• 12.13 Market Shares of Non-Flexible Cluster Tools
• 12.14 Worldwide Market Shares of Sputtering Target Suppliers
• 12.15 Worldwide Market Shares of Liquid Chemical Suppliers
• 12.16 Worldwide Market Shares of Photoresist Suppliers
• 12.17 Worldwide Market Shares of Silicon Wafer Suppliers
• 12.18 Worldwide Market Shares of Gas Suppliers
• 12.19 Total Metrology Market Forecast
• 12.20 Total Metrology Market Shares

TABLES

• 2.1 Low-K Material Requirements
• 2.2 Low-K Materials
• 3.1 Lithography Requirements for IC Production
• 3.2 Characteristics of X-Ray Systems
• 3.3 Basic Conditions of CoO Model
• 3.4 Calculation List of Lithography System Cost
• 3.5 Throughput Estimation of X-Ray Lithography
• 3.6 Cost of Reticle/X-Ray Mask
• 3.7 Phase Shift Mask and X-Ray Mask Manufacturing
• 4.1 Levels of Integration of Dynamic Rams
• 4.2 Interconnect Levels of Logic Device
• 4.3 Typical Process Specifications
• 4.4 Organic Polymers for IMD Applications
• 4.5 CMP Process Variables
• 4.7 Optimized CMP and Post-CMP Clean Parameters
• 4.8 Interconnect Materials by Segment
• 7.1 Silicon Wafer Usage 2003 - 2009
• 7.2 Plasma Source Comparison
• 7.3 Typical Process Specifications
• 7.4 Dry Resist Stripping Systems
• 8.1 Model for DRAM Production Line
• 9.1 Common Wafer Processing Chemicals
• 9.2 Photoresist Stripping Solutions
• 9.3 Wet Stripping Systems
• 10.1 Advantages and Disadvantages of Various Cleaning Methods
• 10.2 Chemical and Material Compatibility
• 10.3 Piping System Economic Analysis for Positive Developer
• 10.4 Gas Control System Issues
• 10.5 Range of Purity of CVD Gases
• 10.6 Potential Hazards of Processing Gases
• 10.7 Particle Sources
• 10.8 Location of In-Situ Monitors by Equipment Type
• 11.1 Comparison Of White-Light With Multiple-Angle Laser Ellipsometry
• 12.1 Worldwide Capital Spending 2007-2009
• 12.2 Worldwide GDP997-2008
• 12.3 Worldwide Market Forecast Low-K Market
• 12.4 Worldwide Stepper Market
• 12.5 Worldwide CMP Polisher Market
• 12.6 Worldwide CMP Market Shares
• 12.7 Worldwide CMP Slurry Market
• 12.8 Worldwide Forecast of Automated Transfer Tools
• 12.9 Worldwide CVD Market Forecast
• 12.10 Worldwide PVD Market Forecast
• 12.11 Worldwide Market Forecast of Plasma Etching Systems
• 12.12 Worldwide Forecast of Chemicals and Materials
• 12.13 Worldwide Wafer Fab Construction Spending Forecast
• 12.14 Total Metrology Market Forecast