The Global MEMs Device, Equipment, and Materials Markets: Forecasts and Strategies for Vendors and Foundries

Table of Contents

• 2.1 MEMS Device Market Forecast
  • 2.1.1 Ink Jet Head
  • 2.1.2 Pressure Sensor
  • 2.1.3 Silicon Microphone
  • 2.1.4 Accelerometer
  • 2.1.5 Gyroscope
  • 2.1.6 MOEMS
  • 2.1.7 Micro Display
  • 2.1.8 Microfluidics
  • 2.1.9 RF MEMS
  • 2.1.10 Micro Fuel Cells
  • 2.1.11 Emerging Applications
• 2.2 MEMS System Market Forecast

• 3.1 Introduction
• 3.2 MEMS Equipment Markets
  • 3.2.1 Assembly
  • 3.2.2 Bonding
  • 3.2.3 Cleaning
  • 3.2.4 Deposition
  • 3.2.5 Dicing
  • 3.2.6 Etching
  • 3.2.7 Laser Micromachining
  • 3.2.8 Lithography
  • 3.2.9 Metrology/Inspection
  • 3.2.10 Testing
  • 3.2.11 Thermal Treatment
  • 3.2.12 Wafer Thinning
• 3.3 MEMS Material Markets
  • 3.3.1 Chemicals
  • 3.3.2 Photomasks
  • 3.3.3 Substrates

• 4.1 Foundry Profiles and Strategies
  • 4.1.1 Advanced Custom Sensors, Inc.
  • 4.1.2 Advanced Microsensors
  • 4.1.3 ACSI
  • 4.1.4 Alpha Tech International
  • 4.1.5 Amkor
  • 4.1.6 APM
  • 4.1.7 Applied MEMS
  • 4.1.8 Asia Pacific Microsystems
  • 4.1.9 Beijing First MEMS
  • 4.1.10 Bosch
  • 4.1.11 Branchy
  • 4.1.12 China Resoources Semiconductor
  • 4.1.13 Canadian Microelectronics Corporation (CMC)
  • 4.1.14 Chipsense
  • 4.1.15 Colibrys
  • 4.1.16 Corning Intellisense
  • 4.1.17 Cronos (subsidiary of MEMSCAP)
  • 4.1.18 C2V
  • 4.1.19 Dalsa
  • 4.1.20 Delphi Delco
  • 4.1.21 Dai-Nippon
  • 4.1.22 ELMOS
  • 4.1.23 ELume Inc.
  • 4.1.24 Haleos
  • 4.1.25 Honeywell MEMSplus
  • 4.1.26 Infineon Technologies SensoNor As
  • 4.1.27 Institute of Microelectronics
  • 4.1.28 Innovative Micro Tech
  • 4.1.29 Integrated Sensing Systems Inc. (ISSYS)
  • 4.1.30 Intelligent Micro Patterning
  • 4.1.31 Jazz Semiconductor
  • 4.1.32 Kionix, New York
  • 4.1.33 LioniX
  • 4.1.34 MEMS Engineering and Material
  • 4.1.35 MEMSCAP
  • 4.1.36 MEMSIC
  • 4.1.37 MEMS OpticalMEMStech
  • 4.1.38 Metrodyne
  • 4.1.39 MicralynemicroFAB Bremen GmbH
  • 4.1.40 Micronit Microfluidics BV
  • 4.1.41 Microbase
  • 4.1.42 Midwest MicroDevices, LLC
  • 4.1.43 MOSIS
  • 4.1.44 Nanostructures Inc
  • 4.1.45 NetMotion, Inc.
  • 4.1.46 Norcada Inc.
  • 4.1.47 Olympus Optical
  • 4.1.48 Omron
  • 4.1.49 OptiSwitch Technology Corp. (OTC)
  • 4.1.50 Prodeo Technologies Inc
  • 4.1.51 Protochips, Inc.
  • 4.1.52 Proton Mikrotechnik
  • 4.1.53 Rogue Valley Microdevices
  • 4.1.54 SEMEFAB
  • 4.1.55 Semiconductor Complex Limited
  • 4.1.56 Sanyo
  • 4.1.57 Silex Microsystems
  • 4.1.58 SiWave, Inc.
  • 4.1.59 Sony
  • 4.1.60 Sporian, Colorado STMicroelectronics
  • 4.1.61 SVTC Technologies
  • 4.1.62 Taiwan Semiconductor Manufacturing Co Ltd (TSMC)
  • 4.1.63 Touch Microsystems
  • 4.1.64 TRONICS Microsystems
  • 4.1.65 TI
  • 4.1.66 Verimetra
  • 4.1.67 Walsin Lihwa
  • 4.1.68 X-Fab
  • 4.1.69 Yokogawa
• 4.2 Segmentation of MEMS foundries

• 5.1.1 Achieving Economies Of Scale
• 5.1.2 Competitive Advantages
• 5.1.3 Core Strengths
• 5.1.4 Employee Commitment
• 5.1.5 Expansion Plans
• 5.1.6 Financial Objectives:
• 5.1.7 Groundbreaking MEMS Solutions
• 5.1.8 In- House Expertise in MEMS Testing And Reliability
• 5.1.9 Leadership in Technology
• 5.1.10 1Manufacturing Excellence
• 5.1.11 Manufacturing Process
• 5.1.12 Mastering Process and Production Technology
• 5.1.13 Patent Protection
• 5.1.14 Partnerships
• 5.1.15 Products
• 5.1.16 Proprietary Development Processes
• 5.1.17 Sales Organization
• 5.1.18 Sales Process and Customer Base
• 5.1.19 Strong Customer Relations
• 5.1.20 Vision and Goal

• 6.1 3-D Interconnects and Packaging
• 6.2 Wafer Size
• 6.3 MEMS Testing
• 6.4 Opportunities For Fabless MEMS Companies

LIST OF TABLES

• 2.1 Ink Jet Head Sales Forecast 2007-2012
• 2.2 Pressure Sensor Sales Forecast 2007-2012
• 2.3 Automotive Inertial Sensors Sales Forecast 2007-2012
• 2.4 Automotive Pressure Sensors Sales Forecast 2007-2012
• 2.5 Automotive Flow Sensors Sales Forecast 2007-2012
• 2.6 Automotive IR Sensors Sales Forecast 2007-2012
• 2.7 Silicon Microphone Sales Forecast 2007-2012
• 2.8 Accelerometer Sales Forecast 2007-2012
• 2.9 Gyroscope Sales Forecast 2007-2012
• 2.1 MOEMS Sales Forecast 2007-2012
• 2.11 Micro Display Sales Forecast 2007-2012
• 2.12 Microfluidics Sales Forecast 2007-2012
• 2.13 RF MEMS Sales Forecast 2007-2012
• 2.14 Micro Fuel Cells Sales Forecast 2007-2012
• 2.15 Emerging Applications Sales Forecast 2007-2012
• 3.1 Assembly Equipment Sales Forecast 2007-2012
• 3.2 Bonding Equipment Sales Forecast 2007-2012
• 3.3 Cleaning Equipment Sales Forecast 2007-2012
• 3.4 Deposition Equipment Sales Forecast 2007-2012
• 3.5 Dicing Equipment Sales Forecast 2007-2012
• 3.6 Etching Equipment Sales Forecast 2007-2012
• 3.7 Laser Micromachining Equipment Sales Forecast 2007-2012
• 3.8 Lithography Equipment Sales Forecast 2007-2012
• 3.9 Metrology/Inspection Equipment Sales Forecast 2007-2012
• 3.1 Testing Equipment Sales Forecast 2007-2012
• 3.11 Thermal Treatment Equipment Sales Forecast 2007-2012
• 3.12 Wafer Thinning Equipment Sales Forecast 2007-2012
• 3.13 Chemicals Sales Forecast 2007-2012
• 3.14 Photomasks Sales Forecast 2007-2012
• 3.15 Substrates Sales Forecast 2007-2012
• 4.1 Ranking Of Top MEMS Foundries
• 6.1 Forecast of Wafer Size

LIST OF FIGURES

• 2.1 MEMS Markets (2007-2012)
• 2.2 MEMS System Sales Forecast 2007-2012
• 3.1 Discrete Assembly of MEMS
• 6-1 Process For Capping Mems
• 6-2 Examples Of Thermoplastic Cavity Packages
• 6-3 Fluidic Packaging System