Abstract
CCMs are developing towards smaller sizes and lower costs. However,
traditional CCM assembly methods are restricted by materials and technology,
and there are bottlenecks in terms of product cost control. As a result,
wafer-level camera modules have emerged. Wafer-level camera modules make use
of semiconductor production processes to manufacture optical components, and
are integrated with the image sensor. This process can enable companies to
achieve their goals of making modules smaller and lowering prices. Large-scale
production and low prices will threaten existing camera module makers, and
could also lead to changes in the CCM industry supply chain. However, a
challenge for wafer-level modules is yield rate, which will have to increase
significantly before they will have a significant impact.
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