Abstract
This research report presents market size and value forecast and recent
quarter review of the Taiwanese feature phone baseband, transceiver, power
amplifier, and Bluetooth IC markets. The report includes baseband,
transceiver, power amplifier, and Bluetooth IC market volume, value, ASP, and
market share by solution provider. The content of this report is based on
primary data obtained through interviews with feature phone component makers.
The report finds that Taiwanese feature phone application IC market volume
grew sequentially in the second quarter of 2009 due to growth in overall
mobile phone shipment volume. Slight sequential growth rates are expected for
the Taiwanese feature phone application IC market volume in the second half of
2009.
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