Printed and Thin Film Transistors and Memory 2009-2029

Table of Contents

EXECUTIVE SUMMARY AND CONCLUSIONS

1. INTRODUCTION

• 1.1. Importance of printed and potentially printed electronics
  • 1.1.2. Awesome new capability creates new markets
  • 1.1.3. This is the new printing before it is the new electronics
  • 1.1.4. Importance of flexibility, light weight and low cost
  • 1.1.5. Creating radically new products
  • 1.1.6. Improving existing products
• 1.2. How printed electronics is being applied
• 1.3. Importance of printed and thin film transistors and memory
  • 1.3.1. Vision for the future
  • 1.3.2. Benefits of thin film transistors and memory
• 1.4. Transistor basics and value chain
  • 1.4.1. How a transistor works
  • 1.4.2. TFTC value chain
• 1.5. Transistor geometry and parameters
  • 1.5.1. Conventional geometry - horizontal transistors
  • 1.5.2. New vertical geometry - vertical VFETs
  • 1.5.3. New geometry - single layer transistors Plastic E Print
  • 1.5.4. On off ratio and leakage current
  • 1.5.5. Frequency, carrier mobility and channel length
• 1.6. Choice of materials for these transistors
  • 1.6.1. The thin film transistors on the back of today' s LCD TV - a dead end?
  • 1.6.2. Organic vs inorganic materials
• 1.7. Choice of semiconductor
  • 1.7.2. Organic semiconductors
  • 1.7.3. Crystalline Silicon is a dead end?
  • 1.7.4. Compound inorganic semiconductors
  • 1.7.5. Breakthrough in printed inorganic performance in from Kovio
  • 1.7.6. CMOS and the n type difficulty
  • 1.7.7. Ambipolar semiconductors
  • 1.7.8. Carbon nanotubes as thin film semiconductors
  • 1.7.9. Importance of the dielectric layer
  • 1.7.10. Importance of codeposition
  • 1.7.11. Memory basics and value chain
• 1.8. Substrates
  • 1.8.1. High temperature and protective substrates vs low cost flexible
  • 1.8.2. Polymers
  • 1.8.3. Paper
• 1.9. Printing processes
  • 1.9.1. Requirements
  • 1.9.2. Ink jet vs fast reel to reel printing
  • 1.9.3. Transfer printing of single crystals
  • 1.9.4. 3D printed silicon transistors, Japan

2. ORGANIC TRANSISTORS AND MEMORY - DEVELOPMENTS

• 2.1. History and prospective benefits
• 2.2. PolyApply program of the European Commission
• 2.3. RFID labels from Poly IC
• 2.4. Lowest performance, lowest cost - ACREO
• 2.5. Organic dielectrics and ferroelectrics
• 2.6. High permittivity organic transistor gates by ionic drift

3. INORGANIC COMPOUND TRANSISTORS - DEVELOPMENTS

• 3.1. History and summary of potential benefits
• 3.2. Semiconductors
  • 3.2.1. Zinc oxide based transistor semiconductors
  • 3.2.2. Amorphous InGaZnO
  • 3.2.3. Progress towards p-type metal oxide semiconductors
  • 3.2.4. Transfer printing silicon, GaN and GaAs on film
  • 3.2.5. Tin disulphide
• 3.3. Inorganic dielectrics in devices
  • 3.3.1. Solution processed barium titanate nanocomposite
  • 3.3.2. Hafnium oxide and HafSOx
  • 3.3.3. Hybrid inorganic dielectrics - zirconia
  • 3.3.4. Aluminium, lanthanum, tantalum and other oxides
• 3.4. Chromium based technology
  • 3.4.1. Printed oxide transistors at Oregon State University
• 3.5. Silicon nanoparticle ink
  • 3.5.1. Kovio
• 3.6. Printing aSi reel to reel
• 3.7. Do organic transistors have a future?

4. TECHNOLOGY AND SUPPLIERS - LARGE MEMORY

• 4.1. Types of memory
• 4.2. Big difference in making small vs large memory
• 4.3. Strategy of various developers of thin film and printed memory
• 4.3.2. Thin Film Electronics TFE memory

5. TECHNOLOGY AND SUPPLIERS -CONDUCTORS

• 5.1. Organic vs inorganic conductors
• 5.2. Organic conductors
• 5.3. Inorganic conductors
  • 5.3.2. Comparison of metal options
  • 5.3.3. Polymer - metal suspensions
  • 5.3.4. Silver solution
• 5.4. Progress with new conductive ink chemistries and cure processes
• 5.5. Carbon nanotubes
• 5.6. Carbon Nanotubes and printed electronics
• 5.7. Developers of Carbon Nanotubes for Printed Electronics

6. MARKETS 2009-2029

• 6.1. Forecasts 2009-2029
• 6.2. Assumptions for our forecasts
• 6.3. Split between backplane, RFID and other applications to 2019
• 6.4. Size of relevant markets that are impacted
• 6.5. Potential for non-RFID electronic labels
• 6.6. Potential for RFID labels 2009-2019
• 6.7. Market for RFID
  • 6.7.2. Ultimate potential for highest volume RFID
  • 6.7.3. Penetration of chipless RFID
• 6.8. Impact on silicon
• 6.9. Forecasts for materials
• 6.10. Backplane transistor arrays hold up AMOLED market penetration
• 6.11. Impediments to the commercialisation of printed transistors and memory
• 6.12. Despite recession, finance for printed electronics is not drying up

7. COMPARISON OF ORGANISATIONS INVOLVED IN TFTCS AND THEIR MATERIALS

• 7.1. Semiconductor, process, geometry, targets, challenges and objectives for 80 organisations in printed and thin film transistors and/ or memory
• 7.2. Profiles of 100 organisations in printed and thin film transistors and/ or memory
  • 7.2.1. 3M
  • 7.2.2. ACREO
  • 7.2.3. Asahi Kasei
  • 7.2.4. Asahi Glass
  • 7.2.5. AU Optoelectronics
  • 7.2.6. BASF
  • 7.2.7. Canon
  • 7.2.8. CEA Liten
  • 7.2.9. Chinese Academy of Sciences
  • 7.2.10. DialMat
  • 7.2.11. DaiNippon Ink and Chemical
  • 7.2.12. DaiNippon Printing
  • 7.2.13. Dow Chemical
  • 7.2.14. Ecole Superiure des Mines Saint Etienne
  • 7.2.15. ETRI
  • 7.2.16. Evident Technologies
  • 7.2.17. Evonik
  • 7.2.18. Fraunhofer Institute for Photonic Microsystems
  • 7.2.19. Fraunhofer Institute for Reliability and Microintegration
  • 7.2.20. Fuji Electric Holdings
  • 7.2.21. Fujitsu
  • 7.2.22. H.C.Starck
  • 7.2.23. Hewlett Packard
  • 7.2.24. Hitachi
  • 7.2.25. Idemitsu Kosan
  • 7.2.26. Impika
  • 7.2.27. Industrial Technology Research Institute
  • 7.2.28. Institute of Microelectronics
  • 7.2.29. International University of Bremen
  • 7.2.30. Japan Science and Technology Agency
  • 7.2.31. John Hopkins University
  • 7.2.32. Konica Minolta
  • 7.2.33. Korea Electronics Technology Institute
  • 7.2.34. Korea Research Institute of Chemical Technology
  • 7.2.35. Korea Institute of Science and Technology
  • 7.2.36. Kovio
  • 7.2.37. Kyoto University
  • 7.2.38. Kyushu University
  • 7.2.39. Kyung Hee University
  • 7.2.40. LG Chem
  • 7.2.41. LG Displays
  • 7.2.42. Liebnitz Institute for Solid State and Materials Research (IFW)
  • 7.2.43. Luminescence Technology Corporation
  • 7.2.44. Matsushita
  • 7.2.45. Merck Chemicals
  • 7.2.46. Motorola
  • 7.2.47. Nanyang Technological University
  • 7.2.48. NanoMas Technologies
  • 7.2.49. National Institute of Advanced Industrial Science and Technology
  • 7.2.50. National Institute for Materials Science
  • 7.2.51. National Chiao Tung University
  • 7.2.52. National Taiwan University
  • 7.2.53. NHK
  • 7.2.54. Northwestern University
  • 7.2.55. Optoelectronic Industry and Technology Development Association
  • 7.2.56. ORFID
  • 7.2.57. Organic ID
  • 7.2.58. Oregon State University
  • 7.2.59. Osaka University
  • 7.2.60. Palo Alto Research Center
  • 7.2.61. Panipol
  • 7.2.62. Paru
  • 7.2.63. Philips
  • 7.2.64. Pioneer
  • 7.2.65. Plastic E Print
  • 7.2.66. Plastic Logic
  • 7.2.67. Plextronics
  • 7.2.68. Polyera
  • 7.2.69. Poly IC
  • 7.2.70. Princeton University
  • 7.2.71. Purdue University
  • 7.2.72. Rieke Metals
  • 7.2.73. Ricoh
  • 7.2.74. Riken Low Temperature Physics Laboratory
  • 7.2.75. Samsung
  • 7.2.76. Samsung Advanced Institute of Technology SAIT
  • 7.2.77. Seiko Epson
  • 7.2.78. Epson Cambridge Laboratory,
  • 7.2.79. Semiconductor Energy Laboratory
  • 7.2.80. Semprius
  • 7.2.81. Seoul National University
  • 7.2.82. Sharp
  • 7.2.83. Solvay
  • 7.2.84. Sony
  • 7.2.85. Spansion
  • 7.2.86. ST Microelectronics
  • 7.2.87. Sunchon National University
  • 7.2.88. Sumitomo Chemical
  • 7.2.89. Technical University of Braunschweig
  • 7.2.90. Technical University of Darmstadt
  • 7.2.91. Thin Film Electronics
  • 7.2.92. Tohoku University
  • 7.2.93. Tokyo Institute of Technology
  • 7.2.94. Toppan Forms
  • 7.2.95. Toppan Printing
  • 7.2.96. Unidym
  • 7.2.97. University of California Los Angeles
  • 7.2.98. University of Cambridge
  • 7.2.99. University of Chemnitz
  • 7.2.100. University of Groningen
  • 7.2.101. University of Tokyo
  • 7.2.102. Xerox
  • 7.2.103. Other players in this value chain

APPENDIX 1: IDTECHEX PUBLICATIONS AND CONSULTANCY

TABLES

• 1.1. Envisaged benefits of TFTCs in RFID and other low-cost applications when compared with envisaged silicon chips
• 1.2. Typical carrier mobility in different potential TFTC semiconductors (actual and envisaged)
• 1.3. Properties of the Polyera/ BASF n type printing ink for organic field effect transistors consisting of N,N Dioctyl-dicyanoperylene-3,4:9,10-bis(dicarboxyamide), PD18-CN2
• 2.1. Printable polymer transistor dielectric PE-DI-1900 from BASF and Polyera
• 3.1. A summary of the promised benefits of polymer ink used in pilot production of organic transistors vs two thin film inorganic semiconductors for transistors vs nanosilicon ink
• 3.2. Some properties of new thin film dielectrics
• 3.3. Benefits and challenges of R2R
• 3.4. Imprint lithography
• 4.1. Some of the small group of contestants for large capacity printed memory
• 5.1. Benefits and challenges of organic vs inorganic conductors for printed and thin film transistors, memory and their interconnects.
• 5.2. Conductance in ohms per square for the different printable conductive materials compared with bulk metal
• 5.3. Examples of ink suppliers progressing printed RFID antennas etc
• 5.4. Some companies progressing ink jettable conductors
• 5.5. Comparison of metal etch (e.g. copper and aluminium) conductor choices
• 5.6. Electroless metal plate - Additive print process with weakly conductive ink (e.g. plastics or carbon) followed by wet metal plating
• 5.7. Electro metal plate - Additive print process with weakly conductive ink (e.g. plastics or carbon) followed by dry metal plating
• 5.8. Printable metallic conductors cure at LT e.g. silver based ink
• 5.9. A typical process cost comparison for RFID antennas
• 5.10. Possibilities for various new printed conductors.
• 5.11. Charge carrier mobility of carbon nanotubes compared with alternatives
• 5.12. Developers of Carbon Nanotubes for Printed Electronics
• 6.1. Global market for printed electronics logic and memory 2009-2029 in billions of dollars, with % printed and % flexible
• 6.2. Primary assumptions of organic electronics in full production 2007 to 2025
• 6.3. Global electronics industry by application
• 6.4. End user markets relevant to printed electronics
• 6.5. Global semiconductor shipments monthly and three month average 1983 to 2005
• 6.6. Statistics for electronic labels and their potential locations
• 6.7. Number (in millions) of passive tags by application 2009-2019
• 6.8. Total value of tags by application 2009-2019 (US Dollar Millions)
• 6.9. Choices of digital chipless RFID technologies
• 6.10. Chipless versus Chip RFID, in numbers of units (billions) 2009-2019 (includes passive and active RFID)
• 6.11. Market size of a variety of chipless solutions, $ millions
• 6.12. Scope for printed TFTCs to create new markets or replace silicon chips
• 6.13. Market for printed and potentially printed electronic devices 2009-2029 in billions of dollars
• 6.14. Printed electronics materials and other elements of device income 2009-2029 in billions of dollars
• 7.1. Objectives and challenges of 80 organisations developing printed and potentially printed transistor and/ or memory circuits and/or their materials
• 7.2. Objectives and challenges of 23 organizations developing inks and their materials for printed and potentially printed transistors and memory
• 7.3. 42 organisations that developing TFTCs and their materials and their priorities for products to be sold
• 7.4. Typical quantum dot materials from Evident and their likely application.
• 7.5. Other players in the value chain

FIGURES

• 1.1. Growth in sales of silicon chips by value compared with growth in sales of printed and thin film electronic components.
• 1.2. Examples of the radically new capabilities of printed electronics.
• 1.3. Types of early win and longer term project involving printed electronics 1995-2025
• 1.4. Logic circuits printed by PolyIC in Germany using a reel to reel process
• 1.5. How printed electronics is being applied to products
• 1.6. Printed Electronics Applications
• 1.7. Plastic film scanner
• 1.8. The value chain for manufacturing of printed electronics
• 1.9. Value chain for TFTCs and examples of migration of activity for players
• 1.10. Traditional geometry for a field effect transistor
• 1.11. Vertical organic field effect transistor VOFET showing a short channel length and a large cross section for current flow. The substrate is shown at the bottom.
• 1.12. ORFID view of the problems of the traditional horizontal transistor
• 1.13. Examples of vertical transistors
• 1.14. ORFID VOFET approach
• 1.15. The Plastic E print process
• 1.16. Structure of SSD diode and device operation
• 1.17. Principle of self aligned printing by Plastic Logic
• 1.18. Prevalence of organic vs inorganic materials in printed and thin film electronics today
• 1.19. PEDOT:PSS
• 1.20. Motorola summary of thin film FET issues concerning the dielectric layer .
• 1.21. Motorola view of available gate materials
• 1.22. The simple capacitor like structure for many printed devices including memory
• 1.23. Choices of substrate for printed electronics
• 1.24. Change in stiffness of PET vs PEN substrate material with temperature.
• 1.25. Biaxially oriented crystalline film
• 1.26. Factors influencing film choice- property set
• 1.27. Some candidate materials for flexible substrates
• 1.28. Requirements in printing thin film transistors
• 1.29. The big picture for printing transistors and memory in ever increasing numbers
• 1.30. Reel to reel printing of transistors and complete RFID labels by Poly IC
• 1.31. Options for high speed, low-cost printing of TFTCs
• 1.32. Choice of printing technology for silver RFID antennas today, where Omron and Avery Dennison use gravure despite volumes being no more than hundreds of millions.
• 1.33. Performance improvement in thermal ink jet over the years.
• 1.34. Benefits of ink jet printing of electronics
• 1.35. Thermal ink jet printed transistor evolution
• 1.36. Hybrid process improves performance
• 1.37. Transfer printed GaAs FETs on PET
• 1.38. Semprius opportunity space
• 1.39. Seiko Epson 3D printed silicon transistor
• 2.1. Reel to reel printing of TFTCs
• 2.2. ACREO technology platform
• 2.3. Components of the ACREO low functionality approach to transistors
• 2.4. ACREO electrochemical transistors
• 2.5. Electrochemical components electrical effects
• 2.6. ACREO electrochemical transistors
• 2.7. ACREO objectives for electrochemical transistor circuits
• 2.8. ACREO electrochemical timer transistor
• 2.9. ACREO matrix addressed display.
• 2.10. Interactive games printed on paper
• 2.11. Concept demonstrator integrating printed electrochemical components and its patented "Dry Phase Patterning" of metal conductors.
• 2.12. ACREO applicational ideas
• 2.13. Transistor structure used
• 2.14. Ion modulation
• 3.1. Early Hewlett Packard work on ink jet printing of inorganic compound semiconductors
• 3.2. Printed flexible inorganic semiconductor
• 3.3. Transparent transistor
• 3.4. Material choices for transparent transistors
• 3.5. Amorphous thin film inorganic dielectric
• 3.6. Example of ZnO based transistor circuit that is transparent.
• 3.7. Using a nanolaminate as an e-platform
• 3.8. TEM images of solution processed nanolaminates
• 3.9. Cross-sectional schematic view of an amorphous oxide TFT
• 3.10. Transparent and flexible active matrix backplanes fabricated on PEN films
• 3.11. Semprius transfer printing
• 3.12. Motorola high permittivity printable OFET dielectric using a barium titanate organic nanocomposite.
• 3.13. Hybrid organic-inorganic transistor and right dual dielectric transistor
• 3.14. Motorola high permittivity printable OFET dielectric using a barium titanate organic nanocomposite.
• 3.15. Motorola results - the nanotechnology used
• 3.16. Lower operating voltage
• 3.17. NHK transistor on polycarbonate film with tantalum oxide gate.
• 3.18. Solution-based activities and capabilities
• 3.19. Printing inorganic films
• 3.20. Aqueous processing of oxides
• 3.21. Examples of the challenges
• 3.22. A typical test transistor with HafSOx dielectric
• 3.23. Performance of Kovio' s ink versus others by mobility
• 3.24. Road map
• 3.25. The web rolled on the core is its own clean room
• 3.26. Basic Imprint Lithography Process
• 4.1. An all-organic permanent memory transistor
• 4.2. TFE memory compared with the much more complex DRAM in silicon
• 4.3. Structure of TFE memory
• 4.4. TFE priorities for commercialisation of mega memory
• 5.1. InkTec soluble silver inks. Left: Transparent Electronic Ink. Right: Transparent Inkjet Inks
• 5.2. Patterning using InkTec ink
• 5.3. Typical SEM images of CU flake C1 6000F. Copper flake
• 5.4. Properties and morphology of single walled carbon nanotubes
• 5.5. Nanotube shrink-wrap from Unidym
• 6.1. Global market for printed electronics logic and memory 2009-2019 in billions of dollars, with the percentage that will be printed and the percentage that will be flexible
• 6.2. Transistors - first significant commercial product in 2009
• 6.3. Sales of printed and potentially printed transistors and memory by application in 2010
• 6.4. Sales of printed and potentially printed transistors and memory by application in 2015
• 6.5. 4 Sales of printed and potentially printed transistors and memory by application in 2019
• 6.6. Potential, in billions yearly, for global sales of RFID labels and circuits printed directly onto products or packaging. Item level is shown in red. These are examples.
• 6.7. Market for printed and potentially printed electronic devices by chemistry of key element 2009-2019 in billions of dollars
• 6.8. Printed electronics materials and other elements of device income 2009-2019
• 6.9. Current options and challenges for backplane TFTs
• 7.1. Semiconductor development at Evonik
• 7.2. Target range for mobility and processing temperature of semiconductors.
• 7.3. Transfer characteristics of gen3 semiconductor system
• 7.4. Current efficiency of a Novaled PIN OLEDTM stack on an inkjet printed, transparent conductive ITO anode.
• 7.5. Fujitsu "electronic paper" display
• 7.6. Researchers and users play major roles with active logistic support from JST
• 7.7. High Mobility OTFT
• 7.8. Summary and Conclusion
• 7.9. LG Chemical spun-off into LG Chem Investment (LGCI), LG Chem and LG Household & Healthcare.
• 7.10. NanoMas technology
• 7.11. PARC have developed innovative displays
• 7.12. Materials and devices. Fully printed RFID tag in development.
• 7.13. Fully printed EAS (anti theft) tag shown on website.
• 7.14. Left is diode logic OR gate and the right is a bridge rectifier
• 7.15. Micrograph of an SSD array and the 110 GHz microwave measurement setup
• 7.16. Prototype HF tag and reader
• 7.17. 10 nm holes and 40 nm pitch in PMMA fabricated by nanoimprint lithography
• 7.18. The first room-temperature silicon single electron memory.
• 7.19. Samsung OLED display
• 7.20. Samsung OLED display
• 7.21. A flexible display sample
• 7.22. Printed electronics samples
• 7.23. A circuit by Associate Professor Zhenan Bao.