Table of Contents
Executive Summary
Chapter 1: Introduction, Scope and Methodology
- 1.0 Introduction
- 1.1 Scope
- 1.2 Methodology
- 1.3 Exchange Rates
- 1.4 Definitions
Chapter 2: The Global Customer Premises Equipment Market
- 2.0 Introduction
- 2.1 The Global CPE Summary
- 2.2 xDSL Access
- 2.3 Broadband Cable Access
- 2.4 Broadband Satellite (2-Way) Access
- 2.5 Fibre-to-the-Premises Access
- 2.6 Broadband Powerline Access
- 2.7 Broadband Wireless Access
- 2.8 Broadband Dedicated Wiring LAN
- 2.9 Broadband Phoneline LAN
- 2.10 Broadband Powerline LAN
- 2.11 Broadband Coaxial LAN
- 2.12 Broadband Wireless LAN
Chapter 3: System ICs in Home Networking
- 3.0 Introduction
- 3.1 The Market for System ICs in Home Networking
- 3.2 Access Devices
- 3.2.1 Overview of Access Devices
- 3.2.2 Worldwide Shipments for ICs in xDSL Access Devices
- 3.2.3 Worldwide Shipments for ICs in Cable Access Devices
- 3.2.4 Worldwide Shipments for ICs in Satellite (2-way) Access Devices
- 3.2.5 Worldwide Shipments for ICs in FTTP Devices
- 3.2.6 Worldwide Shipments for ICs in Broadband Powerline Devices
- 3.2.7 Worldwide Shipments for ICs in MAN Devices
- 3.3 LAN Devices
- 3.3.1 Overview of LAN Device
- 3.3.2 Worldwide Shipments for Dedicated Wire ICs in LAN Devices
- 3.3.3 Worldwide Shipments for Broadband Phoneline ICs in LAN Devices
- 3.3.4 Worldwide Shipments for Broadband Powerline ICs in LAN Devices
- 3.3.5 Worldwide Shipments for Coaxial Cable ICs in LAN Devices
- 3.3.6 Worldwide Shipments for Wi-Fi ICs in LAN Devices
Appendix 1: List of Tables
Appendix 2: List of OEM/ODMs, SoC Solution Providers and Microprocessing Component Suppliers
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