the-infoshop.com - The vertical markets research portal
View CartView Cart
Global Information, Inc.
US: +1-860-674-8796
EU: +32-2-535-7543
SG: +65-6223-2436
  Home | Category | Publishers | Custom Research | E-mail Alert | About Us | Contact Us | Site Map |
 

* View All Categories
View Conferences
Japanese Korean Chinese

Market Research Report

The Worldwide Market for Semiconductors in Mobile Handsets 2009

Published by IMS Research Contact us : +1-860-674-8796
Published 2009/03 Content info 156 PAGES (including 76 tables)
Product code IZ83348
Price From  US $ 7400 Order/Price list
US $ 7400 PDF by E-mail (Single User License)
US $ 8880 PDF BY E-mail (Site License)
US $ 11100 PDF BY E-mail (Divisional License)
Delivery Time
PDF by E-Mail
Approx. 1-2 business days
Hard Copy/CD-ROM
Approx. 3-4 business days
If you need expedited delivery, please call us.
Description TOC

Abstract

Description

This report analyzes the link between the market for handsets and the market for semiconductor components in handsets. By linking the consumption of handsets with feature, technology, integration and design trends this report presents valuable data for anyone in the supply chain of handset manufacturing.

The study provides the following:

  • Detailed shipment analysis for handsets and IC components by air-interface and feature tier.
  • Quantitative and qualitative tables of 21 handset features and discussions of performance expectations and requirements from a design focus.
  • Market size estimates for handsets and components in 2007 and 2008 with growth forecasts to 2013.
  • RF design trends, including quantitative analysis of analog & digital integration and multi-mode & multi-band forecasts, through 2013.
  • Digital design trends, including quantitative analysis of RF integration, microprocessing and logic component trends, and feature and technology influences.
  • BOM estimates for each air-interface.
  • Discussion of technology trends for displays, storage, interfaces and processor performance and their potential disruptive influence in the next 5 years.

The study forecasts handsets, the following handset components and categories through 2013:

  • RF discretes including switches, filters, transceivers (XCVR), power amps. (PA) and low-noise amps (LNA).
  • Integrated RF modules including switch/filter, XCVR & filter, PA/switch, XCVR/switch/filter, PA/switch/filter and PA-FEMs, RF CMOS integrated baseband solutions.
  • Processors including DSPs; 4/8-bit, 16-bit, 32-bit Microprocessors; and 4/8-bit, 16-bit, 32-bit Microcontrollers
  • Logic including classic and core-based ASICs, ASSPs and PLDs.
  • RF Connectivity components such as digital transceivers, DACs and ADCs.
  • Interconnect design trends.
  • Breakout categories by 15 major air-interfaces in GSM, CDMA, UMTS, TD-SCDMA, WiMAX and LTE families.
  • Breakout categories by ultra-low cost (ULC), basic feature, advanced feature and smartphone tiers.
  • Handset subscribership and shipments worldwide and shipments by Americas, Asia, Europe and MEA regions.
Related Report
Back to Top
Please inform me when related publications are released
InfoWatch

US: 1-860-674-8796 EU: 32-2-535-7543 SG: 65-6223-2436
The vertical markets research portal
© 2009, the-infoshop.com by Global Information, Inc. All rights reserved.