The Worldwide Market for Semiconductors in Mobile Handsets 2009

Table of Contents

Executive Summary

Chapter 1 Introduction, Scope and Methodology

• 1.0 Introduction
• 1.1 Scope
  • 1.1.1 Report Content
  • 1.1.2 Report Objective
  • 1.1.3 Quantitative Analysis
  • 1.1.4 Qualitative Analyses
• 1.2 Methodology
  • 1.2.1 Information Sources
  • 1.2.2 Forecasting Methodology
  • 1.2.3 Exchange Rates

Chapter 2 Handset Shipments & Features

• 2.0 Handset Shipments and Features
• 2.1 Handset Shipments
  • 2.1.1 Regional Variation
• 2.2 Handset Features
  • 2.2.1 Handset Tier Classification
  • 2.2.2 Feature Market Size
• 2.3 General Handset Design Trends

Chapter 3 RF Design Trends

• 3.0 RF Design Trends
• 3.1 RF Multi-mode and Multi-band Trends
• 3.2 RF Integration Trends

Chapter 4 RF Component Trends

• 4.0 RF Component Trends
• 4.1 TDMA RF Component Trends
• 4.2 CDMA RF Component Trends
• 4.3 UMTS RF Component Trends
• 4.4 Other Emerging Air-Interface Component Trends
• 4.5 RF Component Trends by Tier

Chapter 5 Digital Component Trends

• 5.0 Digital Component Trends
• 5.1 Embedded Processing Components
• 5.2 Embedded Processing Components by Air-Interface
• 5.3 Embedded Processing Components
• 5.4 Interface Technologies

Appendix A Cellular Technology Overview

• A.0 Cellular Technology Overview
• A.1 Second Generation (2G)
  • A.1.1 GSM, GRPS, EDGE
  • A.1.2 cdmaOne, 1xRTT
• A.2 Third Generation (3G)
  • A.2.1 W-CDMA, HSDPA and HSUPA
  • A.2.2 cdma2000 and EV-DO
  • A.2.3 TD-SCDMA
  • A.2.4 WiMAX (3G) and WiBro
• A.3 Future Generations
  • A.3.1 Long Term Evolution (LTE)
  • A.3.2 Ultra Mobile Broadband (UMB)
  • A.3.3 WiMAX (m)

Appendix B List of Tables & Figures