ICs with Multiple Wireless Functionality - 2009 Edition

Chapter 1 - Introduction, Scope and Methodology

Chapter 2 - Technology Review

• 2.0 Introduction
  • 2.1 Bluetooth Technology
    • 2.1.1 Introduction
    • 2.1.2 Technical Specification
    • 2.1.3 Standards Evolution
    • 2.1.4 Markets served with Classic Bluetooth
  • 2.2 Bluetooth high speed
    • 2.2.1 Introduction
    • 2.2.2 Specification and Standards Evolution
    • 2.2.3 Markets served by Bluetooth hs
  • 2.3 Bluetooth low energy
    • 2.3.1 Introduction
    • 2.3.2 Bluetooth low energy Specification
    • 2.3.3 Standards Evolution
    • 2.3.4 Markets served by Bluetooth LE
  • 2.4 WLAN
    • 2.4.1 Introduction
    • 2.4.2 Specification and Standards Evolution
    • 2.4.3 Markets served with WLAN
  • 2.5 UWB
    • 2.5.1 Introduction
    • 2.5.2 Technical Specification
    • 2.5.3 Standards Evolution
    • 2.5.4 Markets Served with UWB
  • 2.6 GPS
    • 2.6.1 Introduction
    • 2.6.2 Technical Specification
    • 2.6.3 Standards Evolution
    • 2.6.4 Markets served with GPS
  • 2.7 NFC
    • 2.7.1 Introduction
    • 2.7.2 Technical Specification
    • 2.7.3 Standards Evolution
    • 2.7.4 Markets served with NFC
  • 2.8 Combination ICs
    • 2.8.1 Advantages of Combination ICs
    • 2.8.2 Disadvantages of Combination ICs

Chapter 3 - Competitive Environment and Supplier Industry

• 3.0 Introduction
  • 3.1 Competitive Environment
    • 3.1.1 Introduction
    • 3.1.2 Impact of Current Global Economic Situation
    • 3.1.3 Converged Future - Competitive Environment
  • 3.2 Summary of Technologies Addressed
  • 3.3 Summary of Standards/Industry Body Involvement
  • 3.4 Alereon
  • 3.5 Atheros
  • 3.6 AzureWave Technologies
  • 3.7 Broadcom
  • 3.8 CSR
  • 3.9 GCT Semiconductor
  • 3.10 Infineon
  • 3.11 Intel Corporation
  • 3.12 Laird Technologies
  • 3.13 Marvell
  • 3.14 Qualcomm
  • 3.15 Renesas Technology Corporation
  • 3.16 SiGe Semiconductor, Inc.
  • 3.17 SiRF Technology, Inc.
  • 3.18 ST-Ericsson
  • 3.19 Staccato
  • 3.20 Stonestreet One
  • 3.21 TDK Electronics
  • 3.22 Texas Instruments
  • 3.23 U-Blox
  • 3.24 Wipro
  • 3.25 Wisair

Chapter 4 - Market Forecasts and Analysis

• 4.0 Introduction
  • 4.1 Combination IC Forecasts
    • 4.1.1 Introduction
    • 4.1.2 Bluetooth Shipment Volumes
    • 4.1.3 Combination IC Shipment Volumes and Revenues
  • 4.2 Combination IC Forecasts by Application
    • 4.2.1 Cellular Handsets
      • 4.2.1.1 Wireless Technologies in Cellular Handsets
      • 4.2.1.2 Key Drivers/Barriers for Combination ICs in Cellular Handsets
      • 4.2.1.3 Market Forecasts and Assumptions
    • 4.2.2 Digital Cameras
      • 4.2.2.1 Wireless Technologies in Digital Cameras
      • 4.2.2.2 Key Drivers/Barriers for Combination ICs in Digital Cameras
      • 4.2.2.3 Market Forecasts and Assumptions
    • 4.2.3 Laptop PCs
      • 4.2.3.1 Wireless Technologies in Laptop PCs
      • 4.2.3.2 Key Drivers/Barriers for Combination ICs in Laptop PCs
      • 4.2.3.3 Market Forecasts and Assumptions
    • 4.2.4 Personal Media Players (PMPs)
      • 4.2.4.1 Wireless Technologies in PMPs
      • 4.2.4.2 Key Drivers/Barriers for Combination ICs in PMPs
      • 4.2.4.3 Market Forecasts and Assumptions
    • 4.2.5 Personal Navigation Devices (PNDs)
      • 4.2.5.1 Wireless Technologies in PNDs
      • 4.2.5.2 Key Drivers/Barriers for Combination ICs in PNDs
      • 4.2.5.3 Market Forecasts and Assumptions
    • 4.2.6 Add-in Cards and Dongles
      • 4.2.6.1 Wireless Technologies in Add-in Cards and Dongles
      • 4.2.6.2 Key Drivers/Barriers for Combination ICs in Add-in Cards and Dongles
      • 4.2.6.3 Market Forecasts and Assumptions
    • 4.2.7 Gaming Devices
    • 4.2.7.1 Wireless Technology in Gaming
    • 4.2.7.2 Key Drivers/Barriers for Combination ICs in Gaming
    • 4.2.7.3 Market Forecasts and Assumptions