Cree CGH40010 GaN HEMT Teardown Report-short version

Table of Contents

• 1. Product Identification
• 2. External Appearance and Principal Dimensions
• 3. Package
  • Encapsulation
  • Leadframe structure and material
  • Die attach
  • Wirebonding
• 4. Semiconductor Die
  • 4.1 Plan view analysis
    • Dimensions
    • Structure
  • 4.2 Cross section analysis
    • 4.2.1 Source Probe Pads
    • 4.2.2 Gate Contact
    • 4.2.3 Active Area
    • 4.2.4 Source Through Vias
    • 4.2.5 Coupled gate and drain contact pads
• 5. Emission Microscopy Analysis
• 6. Summary